Abstract: A light emitting device having practical light emission characteristics is obtained without epitaxial growth. A quantum dot-dispersed light emitting device of the invention includes a substrate 11, an electron injection electrode 12, a hole injection electrode 14, and an inorganic light emitting layer 13 disposed so as to be in contact with both the electrodes. The inorganic light emitting layer 13 contains an ambipolar inorganic semiconductor material and nanocrystals 15 dispersed as luminescent centers in the ambipolar inorganic semiconductor material and is configured so as to be capable of light emission without having, at the interface with the electron injection electrode and/or the hole injection electrode, epitaxial relation therewith.

Abstract: A light emitting device having practical light emission characteristics is obtained without epitaxial growth. A quantum dot-dispersed light emitting device of the invention includes a substrate 11, an electron injection electrode 12, a hole injection electrode 14, and an inorganic light emitting layer 13 disposed so as to be in contact with both the electrodes. The inorganic light emitting layer 13 contains an ambipolar inorganic semiconductor material and nanocrystals 15 dispersed as luminescent centers in the ambipolar inorganic semiconductor material and is configured so as to be capable of light emission without having, at the interface with the electron injection electrode and/or the hole injection electrode, epitaxial relation therewith.

Abstract: A manufacturing method for an MIS type semiconductor device features in the preferred form a single masking operation used to define source, gate, and drain windows simultaneously in an upper insulating oxide layer disposed over a semiconducting polysilicon layer, the polysilicon layer being separated from the semiconductor substrate by a thin insulating oxide layer serving as the gate oxide. By subsequent deposition of an overall capping nitride layer, followed by selective removal of layers, using relatively low resolution photoresist and portions of the layers themselves as intermediate etching barriers, and by finally converting the polycrystalline layer to an oxide except where it is protected from oxidation by the presence of a nitride stripe over a gate window, the resulting gate electrode is precisely centered between the source and drain windows, and is sealed on all three sides by a protective oxide layer.

Abstract: A surface-acoustic-wave device has a laminate formed of a semiconductor and a piezoelectric layer and a depletion layer control means locally provided at an interface portion of the semiconductor and said piezoelectric layer, wherein a parametric interaction is caused at a region other than an area where the depletion layer control means is provided and a depletion layer capacitance is controlled by applying a DC bias voltage and a pumping voltage to the depletion layer control means.