Abstract: There is provided a probe card comprising a plurality of contact pins to be in contact and connected with testing electrodes of semiconductor chips, implanted in the surface of a wiring board, for testing electrical characteristic of the semiconductor chips, wherein the contact pins have a micro-spring structure. With such a probe card as described, the contact pins can be arranged at a narrow pitch, and are caused to be in stable contact with the respective testing electrodes by sufficiently absorbing variation in the height of the respective testing electrodes, thereby enabling high-speed transmission of signals to be realized.

Abstract: An IC testing apparatus which is able to measure the execution time of an automatic function for each DUT by a one-time test, and to grade said automatic function automatically based on the above measured execution time. A IC testing apparatus comprises a evaluation circuit of the automatic function with minimum execution time, a timer which is activated by the above evaluation circuit, and a timer counter which is activated by the above timer and stopped by the evaluation of each DUT, and automatically measures the execution time of automatic function of each DUT.