Abstract: A heat treatment apparatus includes a processing container that accommodates a processing target; a heater that heats the processing target accommodated in the processing container; and a controller that controls an overall operation of the heat treatment apparatus. The controller controls heating by the heater according to a set temperature of the heater; monitors the processing container in which the processing target is accommodated based on a monitoring condition of a protection function for the processing target; and when an upper limit time of monitoring elapses while the monitoring condition is being satisfied, changes the set temperature of the heater to a set temperature of the protection function.

Abstract: A heat treatment apparatus includes a control device. The control device includes a heat treatment control unit that controls a heat treatment performed on a processing target accommodated in a processing container, according to a process condition, a cleaning control unit that controls a cleaning process on deposits adhering to the processing container due to the heat treatment, a cumulative film thickness specification unit that specifies a value of a cumulative film thickness of the deposits adhering to the processing container, based on the process condition for the heat treatment, and a temperature correction unit that corrects a temperature of the heat treatment based on a temperature correction amount corresponding to the value of the cumulative film thickness and a frequency of the cleaning process.

Abstract: A substrate transfer device includes a pick which has positioning pins to position a substrate and holds a positioned substrate; a drive unit which drives the pick such that the substrate is loaded/unloaded to/from a vacuum processing unit by using a pick; and a transfer control unit which controls a transfer operation of the substrate using the pick. The transfer control unit obtains in advance information on a reference position of the substrate at room temperature when the substrate is loaded into the vacuum processing unit, calculates a positional deviation from the reference position of the substrate when the substrate is loaded into the vacuum processing unit in actual processing, and controls a drive unit such that the substrate is loaded into the vacuum processing unit by correcting the positional deviation.