Patents by Inventor Morimi Osawa
Morimi Osawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8553198Abstract: In view of realizing a lithographic process which makes it possible to estimate and correct flare with an extremely high accuracy, and causes only an extremely small dimensional variation in width, over the entire portion not only of a single shot region, but also of a single chip region, a mask pattern correction device of the present invention has a numerical aperture calculation unit calculating, for every single shot region, flare energy for a mask pattern corresponding to a transferred pattern, based on an exposure layout of a plurality of shot regions, or more specifically, while considering flare from a plurality of shot regions located around every single shot region.Type: GrantFiled: June 4, 2012Date of Patent: October 8, 2013Assignee: Fujitsu Semiconductor LimitedInventors: Teruyoshi Yao, Satoru Asai, Morimi Osawa, Hiromi Hoshino, Kouzou Ogino, Kazumasa Morishita
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Publication number: 20120236279Abstract: In view of realizing a lithographic process which makes it possible to estimate and correct flare with an extremely high accuracy, and causes only an extremely small dimensional variation in width, over the entire portion not only of a single shot region, but also of a single chip region, a mask pattern correction device of the present invention has a numerical aperture calculation unit calculating, for every single shot region, flare energy for a mask pattern corresponding to a transferred pattern, based on an exposure layout of a plurality of shot regions, or more specifically, while considering flare from a plurality of shot regions located around every single shot region.Type: ApplicationFiled: June 4, 2012Publication date: September 20, 2012Applicant: FUJITSU SEMICONDUCTOR LTDInventors: Teruyoshi YAO, Satoru Asai, Morimi Osawa, Hiromi Hoshino, Kouzou Ogino, Kazumasa Morishita
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Patent number: 8227153Abstract: In view of realizing a lithographic process which makes it possible to estimate and correct flare with an extremely high accuracy, and causes only an extremely small dimensional variation in width, over the entire portion not only of a single shot region, but also of a single chip region, a mask pattern correction device of the present invention has a numerical aperture calculation unit calculating, for every single shot region, flare energy for a mask pattern corresponding to a transferred pattern, based on an exposure layout of a plurality of shot regions, or more specifically, while considering flare from a plurality of shot regions located around every single shot region.Type: GrantFiled: April 26, 2010Date of Patent: July 24, 2012Assignee: Fujitsu Semiconductor LimitedInventors: Teruyoshi Yao, Satoru Asai, Morimi Osawa, Hiromi Hoshino, Kouzou Ogino, Kazumasa Morishita
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Patent number: 7971160Abstract: A method for creating a pattern on a photomask includes steps of recognizing a space between main patterns by using pattern data which indicate the main patterns to be adjacently transferred onto a wafer, determining a 1st rule about arrangement of an assist pattern on the photomask, the assist pattern being adjacent to the main patterns and not being transferred onto the wafer, estimating a depth of focus in the presence of the assist pattern among the main patterns, determining a 2nd rule about arrangement of the assist pattern on the photomask to improve the depth of focus in the presence of the 1st assist pattern among the main patterns in a group having one or more number of appearance times of the space between main patterns, and correcting the assist pattern on the photomask using the assist pattern data on the basis of the 2nd rule.Type: GrantFiled: January 22, 2008Date of Patent: June 28, 2011Assignee: Fujitsu Semiconductor LimitedInventors: Morimi Osawa, Takayoshi Minami, Satoru Asai
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Patent number: 7870520Abstract: A semiconductor device yield calculation method and a computer program that include selecting from a designed device pattern a specified first pattern and a second pattern that differs from the first pattern, finding a probability that the second pattern passes a test when the first pattern passes the test for each of a plurality of distances between the first pattern and the second pattern, and finding a yield of the device pattern based on a product of the probability and a yield value for the first pattern.Type: GrantFiled: January 11, 2008Date of Patent: January 11, 2011Assignee: Fujitsu Semiconductor LimitedInventor: Morimi Osawa
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Publication number: 20100209834Abstract: In view of realizing a lithographic process which makes it possible to estimate and correct flare with an extremely high accuracy, and causes only an extremely small dimensional variation in width, over the entire portion not only of a single shot region, but also of a single chip region, a mask pattern correction device of the present invention has a numerical aperture calculation unit calculating, for every single shot region, flare energy for a mask pattern corresponding to a transferred pattern, based on an exposure layout of a plurality of shot regions, or more specifically, while considering flare from a plurality of shot regions located around every single shot region.Type: ApplicationFiled: April 26, 2010Publication date: August 19, 2010Applicant: FUJITSU SEMICONDUCTOR LTD.Inventors: Teruyoshi YAO, Satoru ASAI, Morimi OSAWA, Hiromi HOSHINO, Kouzou OGINO, Kazumasa MORISHITA
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Patent number: 7732107Abstract: In view of realizing a lithographic process which makes it possible to estimate and correct flare with an extremely high accuracy, and causes only an extremely small dimensional variation in width, over the entire portion not only of a single shot region, but also of a single chip region, a mask pattern correction device of the present invention has a numerical aperture calculation unit calculating, for every single shot region, flare energy for a mask pattern corresponding to a transferred pattern, based on an exposure layout of a plurality of shot regions, or more specifically, while considering flare from a plurality of shot regions located around every single shot region.Type: GrantFiled: November 24, 2004Date of Patent: June 8, 2010Assignee: Fujitsu Semiconductor LimitedInventors: Teruyoshi Yao, Satoru Asai, Morimi Osawa, Hiromi Hoshino, Kouzou Ogino, Kazumasa Morishita
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Patent number: 7601471Abstract: The width values of transferred patterns of respective evaluation patterns transferred using a test photo mask (11) are calculated by first calculation unit (12) based on the relationship with the opening ratio of flare generation patterns. The distribution of the calculated width values of the respective transferred patterns is linearly approximated by second calculation unit (13) and the inclination thereof is calculated. On the basis of a table defining the inclination of the width values of the respective transferred patterns (the ratio of dimension fluctuation), the amount of correction is changed for each pattern by correction unit (14). Consequently, the amount of dimension fluctuation caused by local flares can be accurately calculated. This enables accurately performing pattern-dimension corrections against local flares.Type: GrantFiled: June 21, 2005Date of Patent: October 13, 2009Assignee: Fujitsu Microelectronics LimitedInventors: Morimi Osawa, Teruyoshi Yao, Hiroshi Arimoto, Satoru Asai
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Publication number: 20080172644Abstract: A semiconductor device yield calculation method and a computer program that include selecting from a designed device pattern a specified first pattern and a second pattern that differs from the first pattern, finding a probability that the second pattern passes a test when the first pattern passes the test for each of a plurality of distances between the first pattern and the second pattern, and finding a yield of the device pattern based on a product of the probability and a yield value for the first pattern.Type: ApplicationFiled: January 11, 2008Publication date: July 17, 2008Applicant: FUJITSU LIMITEDInventor: Morimi OSAWA
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Publication number: 20080113280Abstract: It is an object of the present invention to provide a manufacturing method of a photomask and a manufacturing method of a semiconductor apparatus using the photomask that optimize a sub resolution assist feature on the photomask so as to ensure the depth of focusing for a formed image of a pattern for circuit formation on the photomask, preferably to the miniaturization of a pattern of the semiconductor apparatus.Type: ApplicationFiled: January 22, 2008Publication date: May 15, 2008Applicant: FUJITSU LIMITEDInventors: Morimi OSAWA, Takayoshi MINAMI, Satoru ASAI
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Patent number: 7240307Abstract: A pattern size correcting device includes: a testing photomask (1) having a test pattern; a quantifying unit (2) that quantifies, using the testing photomask (1), size variation in the test pattern as a function of distance and in relation to an open area ratio; an open area ratio calculating unit (3) that divides an exposure area having a plurality of actual device patterns into a plurality of correction areas and calculates the open area ratio of the respective correction areas; a data correcting unit (4) that inputs the open area ratio calculated by the open area ratio calculating unit (3) into a result of the quantification that uses the photomask (1), calculates size variations of the actual device patterns in the respective correction areas, and corrects design data of the actual device patterns based on the calculation; and a proximity effect correcting unit correcting a proximity effect.Type: GrantFiled: January 25, 2005Date of Patent: July 3, 2007Assignee: Fujitsu LimitedInventors: Hajime Aoyama, Morimi Osawa, Teruyoshi Yao, Kozo Ogino
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Patent number: 7205078Abstract: A method for generating backscattering intensity with which charged particles are backscattered to a resist layer when charged particle beam is irradiated onto the resist layer which is formed on plural layers, each of which includes a pattern of one substance or a plurality of substances. For the nth layer from the resist layer among the plural layers, there is provided, for each of the substances in the nth layer, a reflection coefficient rn, which corresponds with the number of particles reflected by the nth layer; a transmission coefficient tn, which corresponds with the number of particles transmitted by the nth layer; and a scatter distribution in which the charged particles are scattered within the nth layer. The generation method comprises a first step of generating the backscattering intensity by using the reflection coefficient rn, the transmission coefficient tn, and the scatter distribution.Type: GrantFiled: May 26, 2004Date of Patent: April 17, 2007Assignee: Fujitsu LimitedInventors: Morimi Osawa, Kozo Ogino
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Publication number: 20060018529Abstract: In view of realizing a lithographic process which makes it possible to estimate and correct flare with an extremely high accuracy, and causes only an extremely small dimensional variation in width, over the entire portion not only of a single shot region, but also of a single chip region, a mask pattern correction device of the present invention has a numerical aperture calculation unit calculating, for every -single shot region, flare energy for a mask pattern corresponding to a transferred pattern, based on an exposure layout of a plurality of shot regions, or more specifically, while considering flare from a plurality of shot regions located around every single shot region.Type: ApplicationFiled: November 24, 2004Publication date: January 26, 2006Applicant: FUJITSU LIMITEDInventors: Teruyoshi Yao, Satoru Asai, Morimi Osawa, Hiromi Hoshino, Kouzou Ogino, Kazumasa Morishita
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Publication number: 20050233226Abstract: The width values of transferred patterns of respective evaluation patterns transferred using a test photo mask (11) are calculated by first calculation unit (12) based on the relationship with the opening ratio of flare generation patterns. The distribution of the calculated width values of the respective transferred patterns is linearly approximated by second calculation unit (13) and the inclination thereof is calculated. On the basis of a table defining the inclination of the width values of the respective transferred patterns (the ratio of dimension fluctuation), the amount of correction is changed for each pattern by correction unit (14). Consequently, the amount of dimension fluctuation caused by local flares can be accurately calculated. This enables accurately performing pattern-dimension corrections against local flares.Type: ApplicationFiled: June 21, 2005Publication date: October 20, 2005Applicant: FUJITSU LIMITEDInventors: Morimi Osawa, Teruyoshi Yao, Hiroshi Arimoto, Satoru Asai
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Publication number: 20050121628Abstract: A pattern size correcting device includes: a testing photomask (1) having a test pattern; a quantifying unit (2) that quantifies, using the testing photomask (1), size variation in the test pattern as a function of distance and in relation to an open area ratio; an open area ratio calculating unit (3) that divides an exposure area having a plurality of actual device patterns into a plurality of correction areas and calculates the open area ratio of the respective correction areas; a data correcting unit (4) that inputs the open area ratio calculated by the open area ratio calculating unit (3) into a result of the quantification that uses the photomask (1), calculates size variations of the actual device patterns in the respective correction areas, and corrects design data of the actual device patterns based on the calculation; and a proximity effect correcting unit correcting a proximity effect.Type: ApplicationFiled: January 25, 2005Publication date: June 9, 2005Applicant: FUJITSU LIMITEDInventors: Hajime Aoyama, Morimi Osawa, Teruyoshi Yao, Kozo Ogino
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Patent number: 6862726Abstract: Light intensities at light intensity calculation points on the photomask are found approximately based on distances from barycenters of opening patterns, and areas and transmission factors of the opening patterns. Thereafter, the result is added to a distribution of light intensity which is obtained by the conventional simulation without consideration given to the influence of the local flare. According to such a method, it is possible to easily carry out the simulation of the light intensity with high accuracy.Type: GrantFiled: January 30, 2003Date of Patent: March 1, 2005Assignee: Fujitsu LimtedInventors: Hiroki Futatsuya, Morimi Osawa
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Publication number: 20050040344Abstract: A method for generating backscattering intensity with which charged particles are backscattered to a resist layer when charged particle beam is irradiated onto the resist layer which is formed on plural layers, each of which includes a pattern of one substance or a plurality of substances. For the nth layer from the resist layer among the plural layers, there is provided, for each of the substances in the nth layer, a reflection coefficient rn, which corresponds with the number of particles reflected by the nth layer; a transmission coefficient tn, which corresponds with the number of particles transmitted by the nth layer; and a scatter distribution in which the charged particles are scattered within the nth layer. The generation method comprises a first step of generating the backscattering intensity by using the reflection coefficient rn, the transmission coefficient tn, and the scatter distribution.Type: ApplicationFiled: May 26, 2004Publication date: February 24, 2005Applicant: FUJITSU LIMITEDInventors: Morimi Osawa, Kozo Ogino
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Publication number: 20040025138Abstract: Light intensities at light intensity calculation points on the photomask are found approximately based on distances from barycenters of opening patterns, and areas and transmission factors of the opening patterns. Thereafter, the result is added to a distribution of light intensity which is obtained by the conventional simulation without consideration given to the influence of the local flare. According to such a method, it is possible to easily carry out the simulation of the light intensity with high accuracy.Type: ApplicationFiled: January 30, 2003Publication date: February 5, 2004Applicant: FUJITSU LIMITEDInventors: Hiroki Futatsuya, Morimi Osawa
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Patent number: 6677089Abstract: (S12) A reference forward scattering intensity &egr;p is determined as equal to such a slice level that by adjusting the width of a pattern having the minimum width included in a block pattern repeatedly used and collectively exposed, the slice level that is in the range of 30 to 70% of the peak value of a forward scattering intensity distribution of the pattern becomes equal to the design width of the pattern. (S15) in each pattern in the block pattern a pattern width is adjusted such that the width of a forward scattering intensity distribution at &egr;p becomes equal to the design width of the pattern. Further, a collected exposure dose Qcp is determined such that Qcp(&egr;p+&agr;p′&eegr;)=Eth holds, where Eth is a threshold value for pattern developing, q is a backscattering coefficient and &agr;p′ is an effective pattern area density.Type: GrantFiled: April 11, 2002Date of Patent: January 13, 2004Assignee: Fujitsu LimitedInventors: Kozo Ogino, Morimi Osawa
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Publication number: 20020177056Abstract: (S12) A reference forward scattering intensity &egr;p is determined as equal to such a slice level that by adjusting the width of a pattern having the minimum width included in a block pattern repeatedly used and collectively exposed, the slice level that is in the range of 30 to 70% of the peak value of a forward scattering intensity distribution of the pattern becomes equal to the design width of the pattern. (S15) in each pattern in the block pattern a pattern width is adjusted such that the width of a forward scattering intensity distribution at &egr;p becomes equal to the design width of the pattern. Further, a collected exposure dose Qcp is determined such that Qcp(&egr;p+&agr;p′&eegr;)=Eth holds, where Eth is a threshold value for pattern developing, &eegr; is a backscattering coefficient and &agr;p′ is an effective pattern area density.Type: ApplicationFiled: April 11, 2002Publication date: November 28, 2002Applicant: FUJITSU LIMITEDInventors: Kozo Ogino, Morimi Osawa