Patents by Inventor Morimichi Sudou

Morimichi Sudou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing prepreg, prepreg, metal clad laminate and printed wiring board
    Patent number: 6749899
    Abstract: There are disclosed a method of preparing a prepreg comprising the steps of a impregnation process in which a thermosetting resin varnish is impregnated into a fiber base material and a drying step in which a solvent of the impregnated thermosetting resin varnish in the fiber base material is vaporized and the resin is semi-cured, wherein the drying step is carried out by moving the fiber base material into which the thermosetting resin varnish is impregnated with a tensile force of 3.0 N/cm or less; and a prepreg prepared by the method.
    Type: Grant
    Filed: September 3, 2002
    Date of Patent: June 15, 2004
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Takeshi Saitou, Akinori Hanawa, Takashi Matsuzaki, Morimichi Sudou
  • Method for producing prepreg, preprig, metal-clad laminate and printed wiring board
    Publication number: 20030094232
    Abstract: There are disclosed a method of preparing a prepreg comprising the steps of a impregnation process in which a thermosetting resin varnish is impregnated into a fiber base material and a drying step in which a solvent of the impregnated thermosetting resin varnish in the fiber base material is vaporized and the resin is semi-cured, wherein the drying step is carried out by moving the fiber base material into which the thermosetting resin varnish is impregnated with a tensile force of 3.0 N/cm or less; and a prepreg prepared by the method.
    Type: Application
    Filed: September 3, 2002
    Publication date: May 22, 2003
    Inventors: Takeshi Saitou, Akinori Hanawa, Takashi Matsuzaki, Morimichi Sudou