Patents by Inventor Morio Mori

Morio Mori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat-resistant film base-material-inserted B-stage resin composition sheet for lamination and use thereof
    Patent number: 6866919
    Abstract: The present invention relates to a heat-resistant film base-material-inserted B-stage resin composition sheet for producing a multilayer printed wiring board which is excellent in copper adhesive strength, heat resistance and insulating reliability particularly in the Z direction and is suitable for use, as a high density small printed wiring board, in a semiconductor-chip-mounting, small-sized and lightweight novel semiconductor plastic package, and to a use thereof.
    Type: Grant
    Filed: February 20, 2003
    Date of Patent: March 15, 2005
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Nobuyuki Ikeguchi, Morio Mori
  • Heat-resistant film base-material-inserted B-stage resin composition sheet for lamination and use thereof
    Publication number: 20030162006
    Abstract: The present invention relates to a heat-resistant film base-material-inserted B-stage resin composition sheet for producing a multilayer printed wiring board which is excellent in copper adhesive strength, heat resistance and insulating reliability particularly in the Z direction and is suitable for use, as a high density small printed wiring board, in a semiconductor-chip-mounting, small-sized and lightweight novel semiconductor plastic package, and to a use thereof.
    Type: Application
    Filed: February 20, 2003
    Publication date: August 28, 2003
    Inventors: Nobuyuki Ikeguchi, Morio Mori