Patents by Inventor Morio Nakamura

Morio Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10679677
    Abstract: Provided is an information processing device that includes a control unit that determines a visual effect to a screen on which representative information of content is displayed. The visual effect is determined based on detection information detected at time of generating the content. The control unit and displays the determined visual effect along with the representative information on the screen.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: June 9, 2020
    Assignee: SONY CORPORATION
    Inventors: Kazuki Nakamura, Chikako Tateishi, Morio Omata
  • Publication number: 20190133502
    Abstract: The present technology relates to an optical apparatus and an information processing method capable of more easily obtaining an indicator value. In the optical apparatus according to the present technology, irradiation light including a predetermined irradiation wavelength band is emitted, first reflected light being a reflected light in a first wavelength band obtained by reflection of the emitted irradiation light on a predetermined object and second reflected light being reflected light in a second wavelength band obtained by reflection of the irradiation light on the object are received at a plurality of pixels; and a value of a predetermined indicator relating to a region in a predetermined range of the object is obtained on the basis of a received light amount of each of the received first reflected light and the received second reflected light. For example, the present technology can be applied to optical apparatuses, electronic apparatuses, imaging apparatuses, and information processing apparatuses.
    Type: Application
    Filed: May 2, 2017
    Publication date: May 9, 2019
    Inventors: SHINICHIRO GOMI, KENICHIRO NAKAMURA, YOICHI TORIUMI, MORIO OGURA
  • Patent number: 7948088
    Abstract: In order to improve the manufacturing yield of a semiconductor device having a three-dimensional structure in which a plurality of chips are stacked and attached to each other, the opening shape of each of conductive grooves (4A) formed in each chip (C2) obtained from a wafer (W2) is rectangular, and the number of the conductive grooves (4A) whose long-sides are directed in a Y direction and the number of the conductive grooves (4A) whose long-sides are directed in an X direction perpendicular to the Y direction are made to be approximately equal to each other number in the entire wafer (W2), whereby the film stress upon embedding of a conductive film into the interior of the conductive grooves is reduced, and generation of exfoliation and micro-cracks in the conductive film or warpage and cracks of the wafer (W2) are prevented.
    Type: Grant
    Filed: August 25, 2006
    Date of Patent: May 24, 2011
    Assignees: Hitachi, Ltd., Honda Motor Co., Ltd.
    Inventors: Toshio Saito, Satoshi Moriya, Morio Nakamura, Goichi Yokoyama, Tatsuyuki Saito, Nobuaki Miyakawa
  • Publication number: 20090174080
    Abstract: In order to improve the manufacturing yield of a semiconductor device having a three-dimensional structure in which a plurality of chips are stacked and attached to each other, the opening shape of each of conductive grooves (4A) formed in each chip (C2) obtained from a wafer (W2) is rectangular, and the number of the conductive grooves (4A) whose long-sides are directed in a Y direction and the number of the conductive grooves (4A) whose long-sides are directed in an X direction perpendicular to the Y direction are made to be approximately equal to each other number in the entire wafer (W2), whereby the film stress upon embedding of a conductive film into the interior of the conductive grooves is reduced, and generation of exfoliation and micro-cracks in the conductive film or warpage and cracks of the wafer (W2) are prevented.
    Type: Application
    Filed: August 25, 2006
    Publication date: July 9, 2009
    Inventors: Toshio Saito, Satoshi Moriya, Morio Nakamura, Goichi Yokoyama, Tatsuyuki Saito, Nobuaki Miyakawa
  • Patent number: 6573330
    Abstract: A process for preparing a water-absorbent resin is provided which enables the water-absorbent resin to ensure the reduction in the release amount of liquid and the increase in the liquid diffusibility. In the preparation process, the water-absorbent resin is prepared by polymerization of a water-soluble ethylenic unsaturated monomer. The polymerization of the water-soluble ethylenic unsaturated monomer is allowed to take place in the presence of a water-absorbent resin having a water-absorbing rate different from that of a water-absorbent resin resulting from polymerization of the water-soluble ethylenic unsaturated monomer. In a preferred mode, the polymerization is performed by a reversed-phase suspension polymerization method.
    Type: Grant
    Filed: December 10, 1998
    Date of Patent: June 3, 2003
    Assignee: Sumitomo Seika Chemicals, Co., Ltd.
    Inventors: Masato Fujikake, Yasuhiro Nawata, Magoto Shirakawa, Masakazu Yamamori, Shioko Yoshinaka, Morio Nakamura
  • Patent number: 6235828
    Abstract: A method for producing a highly concentrated aqueous acrylic amide-based polymer dispersion which is inexpensive, good in fluidity and easy to handle is provided. The method comprises polymerizing a water-soluble monomer composition containing an acrylic amide monomer in an aqueous solution of an inorganic salt in the presence of a homopolymer of vinylpyrrolidone and/or a copolymer of vinylpyrrolidone and other monomer(s).
    Type: Grant
    Filed: August 31, 1999
    Date of Patent: May 22, 2001
    Assignees: Sumitomo Seika Chemicals Co., Ltd., Taki Chemical Co., Ltd.
    Inventors: Masato Fujikake, Shigeki Hamamoto, Nobutaka Fujimoto, Kimihiko Kondo, Morio Nakamura, Takao Okada
  • Patent number: 6166436
    Abstract: A high frequency semiconductor device includes: a substrate having a substantially flat principal surface, with a predetermined circuit pattern including at least an input line, an output line, and a ground electrode provided on the principal surface; and a transistor which has a drain electrode, a source electrode, and a gate electrode and is mounted on the substrate by a flip chip mounting. The source electrode and the ground electrode are connected to each other by a first bump in the flip chip mounting.
    Type: Grant
    Filed: April 15, 1998
    Date of Patent: December 26, 2000
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masahiro Maeda, Morio Nakamura, Takayuki Yoshida, Masazumi Yamazaki
  • Patent number: 5901042
    Abstract: A semiconductor chip is mounted on the central portion of a metal heat radiator. A pair of metal projecting members are provided on the heat radiator externally of the pair of opposed sides of the semiconductor chip to extend therealong beyond both ends of the semiconductor chip. A circuit board is mounted on the side of each of the pair of projecting members opposed to the semiconductor chip. The top surface of the semiconductor chip and the top surface of each of the projecting members are connected to each other by a third bonding wire for grounding.
    Type: Grant
    Filed: April 20, 1998
    Date of Patent: May 4, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yorito Ota, Masahiro Maeda, Shigeru Morimoto, Morio Nakamura
  • Patent number: 5838543
    Abstract: A radio frequency power amplification module includes: a radiation section; a printed circuit board attached to the radiation section; a semiconductor device for power amplification, mounted on the printed circuit board; and a cap. The radiation section includes a plurality of radiation boards, the plurality of radiation boards at least including a first radiation board as a lowermost layer, and a second radiation board attached onto the first radiation board, the first radiation board being coupled to the cap.
    Type: Grant
    Filed: March 6, 1997
    Date of Patent: November 17, 1998
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Morio Nakamura, Masahiro Maeda
  • Patent number: 5736901
    Abstract: In a radio frequency amplifier, a resistor and an inductor are connected to a gate terminal of transistor such as an FET. Another resistor for preventing oscillation is connected to the inductor. A capacitor and a third resistor connected to each other in parallel are connected to the first resistor while the other ends thereof are grounded. A resistance value of the resistor for preventing oscillation is in the range of about 30 .OMEGA. to about 70 .OMEGA.. An inductance value of the inductor is such that an impedance value for a low frequency becomes negligibly small.
    Type: Grant
    Filed: April 3, 1996
    Date of Patent: April 7, 1998
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Morio Nakamura, Masahiro Maeda, Yorito Ota
  • Patent number: 5629395
    Abstract: There is provided an industrially advantageous process for producing a crosslinked polymer containing carboxyl groups which comprises (a) polymerizing an .alpha.,.beta.-unsaturated carboxylic acid and a crosslinking agent copolymerizable with it in the presence of a radical polymerization catalyst in an inert solvent, (b) heating the polymerized product in the presence of a radical scavenger and (c) removing the solvent. The polymer dissolved in water has high viscosity and excellent flowing properties.
    Type: Grant
    Filed: March 25, 1996
    Date of Patent: May 13, 1997
    Assignee: Sumitomo Seika Chemicals Co., Ltd.
    Inventors: Masato Fujikake, Shinji Kobayashi, Shigeki Hamamoto, Mitsutaka Tabata, Morio Nakamura
  • Patent number: 5334679
    Abstract: The present invention is directed to a method for production of a water-soluble cationic polymer comprising polymerizing a cationic vinyl monomer; either a cationic acrylate monomer alone or a mixture of said monomer and another monomer copolymerizable therewith, in dispersion medium in the presence of a surfactant by suspension polymerization method. The present invention offers an industrially advantageous method to obtain the water-soluble cationic polymer with a high degree of cationization and a high viscosity in water solution which can be used for flocculants, antistatic agents, retention aids for paper manufacturing and other purposes.
    Type: Grant
    Filed: July 22, 1993
    Date of Patent: August 2, 1994
    Assignee: Sumitomo Seika Chemicals Co., Ltd.
    Inventors: Takushi Yamamoto, Hiroari Hara, Nobuhiro Maeda, Morio Nakamura
  • Patent number: 5326852
    Abstract: The present invention is directed to a method for production of alkylene oxide polymers comprising reacting an alkylene oxide in an inert hydrocarbon solvent in the presence of a catalyst. The method of the present invention offers alkylene oxide polymers with a great commercial value and a high degree of polymerization which can be produced industrially advantageously with high reproducibility by the use of a catalyst obtained by a simple procedure of applying heat treatment to the product obtained by reacting an organic zinc compound with particular aliphatic polyhydric alcohol and monohydric alcohol.
    Type: Grant
    Filed: July 1, 1992
    Date of Patent: July 5, 1994
    Assignee: Sumitomo Seika Chemicals Co., Ltd.
    Inventors: Masato Fujikake, Morio Nakamura, Shinji Kobayashi, Katsunori Tanaka, Masahiro Suzuki
  • Patent number: 5180798
    Abstract: An improved process for the production of a water-absorbent resin by reversed phase suspension polymerization of a water-soluble ethylenic unsaturated monomer is disclosed. The process is conducted by subjecting an aqueous solution of a water-soluble ethylenic unsaturated monomer to reversed phase suspension polymerization reaction of a first stage in a petroleum hydrocarbon solvent in the presence of a surfactant and/or polymeric protective colloid by using a radical polymerization initiator optionally in the presence of a crosslinking agent, cooling the resulting slurry to precipitate the surfactant and/or polymeric protective colloid, and adding an aqueous solution of a water-soluble ethylenic unsaturated monomer containing a radical polymerization initiator and optionally a crosslinking agent to the first polymerization reaction system to further carry out the reversed phase suspension polymerization reaction, at least, once.
    Type: Grant
    Filed: January 3, 1991
    Date of Patent: January 19, 1993
    Assignee: Sumitomo Seika Chemicals Co., Ltd.
    Inventors: Morio Nakamura, Takushi Yamamoto, Hitoshi Tanaka, Hitoshi Ozawa, Yasuhiro Shimada
  • Patent number: 5075373
    Abstract: A water retention material with water-absorbency which comprises finely divided particles of water-absorbent resin having a water absorption capacity of 2 to 50-fold and a particle size of 100.mu. or finer and a hydrophobic material such as a thermoplastic resin, elastomer, sealant, paint or adhesive.
    Type: Grant
    Filed: January 30, 1989
    Date of Patent: December 24, 1991
    Assignee: Seitetsu Kagaku Co., Ltd.
    Inventors: Shinichi Takemori, Shigeji Obayashi, Morio Nakamura, Kosaku Yamada, Tetsurou Motooka
  • Patent number: 4972019
    Abstract: A water-absorbent resin composition having superior gel stability which comprises a water-absorbent resin, at least one oxygen-containing reducing inorganic salt and, optionally, at least one organic antioxidant.
    Type: Grant
    Filed: June 20, 1989
    Date of Patent: November 20, 1990
    Assignee: Seitetsu Kagaku Co., Ltd.
    Inventors: Shigeji Obayashi, Morio Nakamura, Takushi Yamamoto, Hitoshi Tanaka, Yuji Sakamoto
  • Patent number: 4880888
    Abstract: A water-absorbent resin having excellent physical properties can be produced by a process wherein an aqueous solution containing an .alpha.,.beta.-unsaturated carboxylic acid and an alkali metal salt thereof in a total amount of 25% by weight or more is subjected to polymerization with a radical polymerization initiator in a petroleum-based hydrocarbon solvent in the presence or absence of a crosslinking agent, characterized by using, as a surfactant, a polyglycerine--fatty acid ester having an HLB of 2 to 16 and represented by the general formula ##STR1## (wherein R is an acyl group or hydrogen atom and n is an integer of 0 to 8).
    Type: Grant
    Filed: January 5, 1987
    Date of Patent: November 14, 1989
    Assignee: Seitetsu Kagaku Co., Ltd.
    Inventors: Shigeji Obayashi, Morio Nakamura, Takushi Yamamoto, Hitoshi Tanaka, Yuji Sakamoto
  • Patent number: 4863989
    Abstract: A water-absorbent resin composition having superior gel stability which comprises a water-absorbent resin, at least one oxygen-containing reducing inorganic salt and, optionally, at least one organic antioxidant.
    Type: Grant
    Filed: May 26, 1987
    Date of Patent: September 5, 1989
    Assignee: Seitetsu Kagaku Co., Ltd.
    Inventors: Shigeji Obayashi, Morio Nakamura, Takushi Yamamoto, Hitoshi Tanaka, Yuji Sakamoto
  • Patent number: 4810419
    Abstract: A shaped electroconductive aromatic imide polymer article comprising an aromatic imide polymer matrix and 10% to 40% by weight of short cut carbon fibers 1 to 30 .mu.m thick and 0.05 to 3.0 mm long dispersed in the matrix, is produced by admixing a slurry of the short cut carbon fibers having a limited moisture content of 1.0% or less in a polymerization medium, with a polymerization mixture containing an aromatic tetracarboxylic acid component and an aromatic diamine component, by subjecting the resultant admixture to a polymerization procedure to prepare a dope comprising a resultant polymerization product, the carbon fibers and the polymerization medium, and by subjecting the dope to shaped article-producing procedures in which the dope is shaped into a desired form and the shaped dope is solidified by removing the polymerization medium to provide a desired shaped article.
    Type: Grant
    Filed: November 2, 1987
    Date of Patent: March 7, 1989
    Assignee: Ube Industries Ltd.
    Inventors: Akihiro Kunimoto, Seiichirou Takabayashi, Morio Nakamura, Tatuaki Maeda
  • Patent number: 4732968
    Abstract: A water-absorbent resin having an appropriate particle size and a narrow particle size distribution can be obtained by adding a powdered inorganic material in a proportion of 0.000005-0.2 part by weight to 1 part by weight of a water-absorbent resin containing therein a carboxylate as a component of the polymer with agitation in an inert solvent in the presence of 0.1-5.0 parts by weight of water and 0.005-0.2 part by weight of a surfactant and then removing water and the inert solvent by distillation.
    Type: Grant
    Filed: December 3, 1986
    Date of Patent: March 22, 1988
    Assignee: Seitetsu Kagaku Co., Ltd.
    Inventors: Shigeji Obayashi, Morio Nakamura, Takushi Yamamoto, Hitoshi Tanaka, Yuji Sakamoto, Yasuhiro Shimada