Patents by Inventor Morio Nakamura
Morio Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7948088Abstract: In order to improve the manufacturing yield of a semiconductor device having a three-dimensional structure in which a plurality of chips are stacked and attached to each other, the opening shape of each of conductive grooves (4A) formed in each chip (C2) obtained from a wafer (W2) is rectangular, and the number of the conductive grooves (4A) whose long-sides are directed in a Y direction and the number of the conductive grooves (4A) whose long-sides are directed in an X direction perpendicular to the Y direction are made to be approximately equal to each other number in the entire wafer (W2), whereby the film stress upon embedding of a conductive film into the interior of the conductive grooves is reduced, and generation of exfoliation and micro-cracks in the conductive film or warpage and cracks of the wafer (W2) are prevented.Type: GrantFiled: August 25, 2006Date of Patent: May 24, 2011Assignees: Hitachi, Ltd., Honda Motor Co., Ltd.Inventors: Toshio Saito, Satoshi Moriya, Morio Nakamura, Goichi Yokoyama, Tatsuyuki Saito, Nobuaki Miyakawa
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Publication number: 20090174080Abstract: In order to improve the manufacturing yield of a semiconductor device having a three-dimensional structure in which a plurality of chips are stacked and attached to each other, the opening shape of each of conductive grooves (4A) formed in each chip (C2) obtained from a wafer (W2) is rectangular, and the number of the conductive grooves (4A) whose long-sides are directed in a Y direction and the number of the conductive grooves (4A) whose long-sides are directed in an X direction perpendicular to the Y direction are made to be approximately equal to each other number in the entire wafer (W2), whereby the film stress upon embedding of a conductive film into the interior of the conductive grooves is reduced, and generation of exfoliation and micro-cracks in the conductive film or warpage and cracks of the wafer (W2) are prevented.Type: ApplicationFiled: August 25, 2006Publication date: July 9, 2009Inventors: Toshio Saito, Satoshi Moriya, Morio Nakamura, Goichi Yokoyama, Tatsuyuki Saito, Nobuaki Miyakawa
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Patent number: 6573330Abstract: A process for preparing a water-absorbent resin is provided which enables the water-absorbent resin to ensure the reduction in the release amount of liquid and the increase in the liquid diffusibility. In the preparation process, the water-absorbent resin is prepared by polymerization of a water-soluble ethylenic unsaturated monomer. The polymerization of the water-soluble ethylenic unsaturated monomer is allowed to take place in the presence of a water-absorbent resin having a water-absorbing rate different from that of a water-absorbent resin resulting from polymerization of the water-soluble ethylenic unsaturated monomer. In a preferred mode, the polymerization is performed by a reversed-phase suspension polymerization method.Type: GrantFiled: December 10, 1998Date of Patent: June 3, 2003Assignee: Sumitomo Seika Chemicals, Co., Ltd.Inventors: Masato Fujikake, Yasuhiro Nawata, Magoto Shirakawa, Masakazu Yamamori, Shioko Yoshinaka, Morio Nakamura
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Patent number: 6235828Abstract: A method for producing a highly concentrated aqueous acrylic amide-based polymer dispersion which is inexpensive, good in fluidity and easy to handle is provided. The method comprises polymerizing a water-soluble monomer composition containing an acrylic amide monomer in an aqueous solution of an inorganic salt in the presence of a homopolymer of vinylpyrrolidone and/or a copolymer of vinylpyrrolidone and other monomer(s).Type: GrantFiled: August 31, 1999Date of Patent: May 22, 2001Assignees: Sumitomo Seika Chemicals Co., Ltd., Taki Chemical Co., Ltd.Inventors: Masato Fujikake, Shigeki Hamamoto, Nobutaka Fujimoto, Kimihiko Kondo, Morio Nakamura, Takao Okada
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Patent number: 6166436Abstract: A high frequency semiconductor device includes: a substrate having a substantially flat principal surface, with a predetermined circuit pattern including at least an input line, an output line, and a ground electrode provided on the principal surface; and a transistor which has a drain electrode, a source electrode, and a gate electrode and is mounted on the substrate by a flip chip mounting. The source electrode and the ground electrode are connected to each other by a first bump in the flip chip mounting.Type: GrantFiled: April 15, 1998Date of Patent: December 26, 2000Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masahiro Maeda, Morio Nakamura, Takayuki Yoshida, Masazumi Yamazaki
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Patent number: 5901042Abstract: A semiconductor chip is mounted on the central portion of a metal heat radiator. A pair of metal projecting members are provided on the heat radiator externally of the pair of opposed sides of the semiconductor chip to extend therealong beyond both ends of the semiconductor chip. A circuit board is mounted on the side of each of the pair of projecting members opposed to the semiconductor chip. The top surface of the semiconductor chip and the top surface of each of the projecting members are connected to each other by a third bonding wire for grounding.Type: GrantFiled: April 20, 1998Date of Patent: May 4, 1999Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yorito Ota, Masahiro Maeda, Shigeru Morimoto, Morio Nakamura
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Patent number: 5838543Abstract: A radio frequency power amplification module includes: a radiation section; a printed circuit board attached to the radiation section; a semiconductor device for power amplification, mounted on the printed circuit board; and a cap. The radiation section includes a plurality of radiation boards, the plurality of radiation boards at least including a first radiation board as a lowermost layer, and a second radiation board attached onto the first radiation board, the first radiation board being coupled to the cap.Type: GrantFiled: March 6, 1997Date of Patent: November 17, 1998Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Morio Nakamura, Masahiro Maeda
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Patent number: 5736901Abstract: In a radio frequency amplifier, a resistor and an inductor are connected to a gate terminal of transistor such as an FET. Another resistor for preventing oscillation is connected to the inductor. A capacitor and a third resistor connected to each other in parallel are connected to the first resistor while the other ends thereof are grounded. A resistance value of the resistor for preventing oscillation is in the range of about 30 .OMEGA. to about 70 .OMEGA.. An inductance value of the inductor is such that an impedance value for a low frequency becomes negligibly small.Type: GrantFiled: April 3, 1996Date of Patent: April 7, 1998Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Morio Nakamura, Masahiro Maeda, Yorito Ota
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Patent number: 5629395Abstract: There is provided an industrially advantageous process for producing a crosslinked polymer containing carboxyl groups which comprises (a) polymerizing an .alpha.,.beta.-unsaturated carboxylic acid and a crosslinking agent copolymerizable with it in the presence of a radical polymerization catalyst in an inert solvent, (b) heating the polymerized product in the presence of a radical scavenger and (c) removing the solvent. The polymer dissolved in water has high viscosity and excellent flowing properties.Type: GrantFiled: March 25, 1996Date of Patent: May 13, 1997Assignee: Sumitomo Seika Chemicals Co., Ltd.Inventors: Masato Fujikake, Shinji Kobayashi, Shigeki Hamamoto, Mitsutaka Tabata, Morio Nakamura
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Patent number: 5334679Abstract: The present invention is directed to a method for production of a water-soluble cationic polymer comprising polymerizing a cationic vinyl monomer; either a cationic acrylate monomer alone or a mixture of said monomer and another monomer copolymerizable therewith, in dispersion medium in the presence of a surfactant by suspension polymerization method. The present invention offers an industrially advantageous method to obtain the water-soluble cationic polymer with a high degree of cationization and a high viscosity in water solution which can be used for flocculants, antistatic agents, retention aids for paper manufacturing and other purposes.Type: GrantFiled: July 22, 1993Date of Patent: August 2, 1994Assignee: Sumitomo Seika Chemicals Co., Ltd.Inventors: Takushi Yamamoto, Hiroari Hara, Nobuhiro Maeda, Morio Nakamura
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Patent number: 5326852Abstract: The present invention is directed to a method for production of alkylene oxide polymers comprising reacting an alkylene oxide in an inert hydrocarbon solvent in the presence of a catalyst. The method of the present invention offers alkylene oxide polymers with a great commercial value and a high degree of polymerization which can be produced industrially advantageously with high reproducibility by the use of a catalyst obtained by a simple procedure of applying heat treatment to the product obtained by reacting an organic zinc compound with particular aliphatic polyhydric alcohol and monohydric alcohol.Type: GrantFiled: July 1, 1992Date of Patent: July 5, 1994Assignee: Sumitomo Seika Chemicals Co., Ltd.Inventors: Masato Fujikake, Morio Nakamura, Shinji Kobayashi, Katsunori Tanaka, Masahiro Suzuki
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Patent number: 5180798Abstract: An improved process for the production of a water-absorbent resin by reversed phase suspension polymerization of a water-soluble ethylenic unsaturated monomer is disclosed. The process is conducted by subjecting an aqueous solution of a water-soluble ethylenic unsaturated monomer to reversed phase suspension polymerization reaction of a first stage in a petroleum hydrocarbon solvent in the presence of a surfactant and/or polymeric protective colloid by using a radical polymerization initiator optionally in the presence of a crosslinking agent, cooling the resulting slurry to precipitate the surfactant and/or polymeric protective colloid, and adding an aqueous solution of a water-soluble ethylenic unsaturated monomer containing a radical polymerization initiator and optionally a crosslinking agent to the first polymerization reaction system to further carry out the reversed phase suspension polymerization reaction, at least, once.Type: GrantFiled: January 3, 1991Date of Patent: January 19, 1993Assignee: Sumitomo Seika Chemicals Co., Ltd.Inventors: Morio Nakamura, Takushi Yamamoto, Hitoshi Tanaka, Hitoshi Ozawa, Yasuhiro Shimada
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Patent number: 5075373Abstract: A water retention material with water-absorbency which comprises finely divided particles of water-absorbent resin having a water absorption capacity of 2 to 50-fold and a particle size of 100.mu. or finer and a hydrophobic material such as a thermoplastic resin, elastomer, sealant, paint or adhesive.Type: GrantFiled: January 30, 1989Date of Patent: December 24, 1991Assignee: Seitetsu Kagaku Co., Ltd.Inventors: Shinichi Takemori, Shigeji Obayashi, Morio Nakamura, Kosaku Yamada, Tetsurou Motooka
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Patent number: 4972019Abstract: A water-absorbent resin composition having superior gel stability which comprises a water-absorbent resin, at least one oxygen-containing reducing inorganic salt and, optionally, at least one organic antioxidant.Type: GrantFiled: June 20, 1989Date of Patent: November 20, 1990Assignee: Seitetsu Kagaku Co., Ltd.Inventors: Shigeji Obayashi, Morio Nakamura, Takushi Yamamoto, Hitoshi Tanaka, Yuji Sakamoto
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Patent number: 4880888Abstract: A water-absorbent resin having excellent physical properties can be produced by a process wherein an aqueous solution containing an .alpha.,.beta.-unsaturated carboxylic acid and an alkali metal salt thereof in a total amount of 25% by weight or more is subjected to polymerization with a radical polymerization initiator in a petroleum-based hydrocarbon solvent in the presence or absence of a crosslinking agent, characterized by using, as a surfactant, a polyglycerine--fatty acid ester having an HLB of 2 to 16 and represented by the general formula ##STR1## (wherein R is an acyl group or hydrogen atom and n is an integer of 0 to 8).Type: GrantFiled: January 5, 1987Date of Patent: November 14, 1989Assignee: Seitetsu Kagaku Co., Ltd.Inventors: Shigeji Obayashi, Morio Nakamura, Takushi Yamamoto, Hitoshi Tanaka, Yuji Sakamoto
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Patent number: 4863989Abstract: A water-absorbent resin composition having superior gel stability which comprises a water-absorbent resin, at least one oxygen-containing reducing inorganic salt and, optionally, at least one organic antioxidant.Type: GrantFiled: May 26, 1987Date of Patent: September 5, 1989Assignee: Seitetsu Kagaku Co., Ltd.Inventors: Shigeji Obayashi, Morio Nakamura, Takushi Yamamoto, Hitoshi Tanaka, Yuji Sakamoto
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Patent number: 4810419Abstract: A shaped electroconductive aromatic imide polymer article comprising an aromatic imide polymer matrix and 10% to 40% by weight of short cut carbon fibers 1 to 30 .mu.m thick and 0.05 to 3.0 mm long dispersed in the matrix, is produced by admixing a slurry of the short cut carbon fibers having a limited moisture content of 1.0% or less in a polymerization medium, with a polymerization mixture containing an aromatic tetracarboxylic acid component and an aromatic diamine component, by subjecting the resultant admixture to a polymerization procedure to prepare a dope comprising a resultant polymerization product, the carbon fibers and the polymerization medium, and by subjecting the dope to shaped article-producing procedures in which the dope is shaped into a desired form and the shaped dope is solidified by removing the polymerization medium to provide a desired shaped article.Type: GrantFiled: November 2, 1987Date of Patent: March 7, 1989Assignee: Ube Industries Ltd.Inventors: Akihiro Kunimoto, Seiichirou Takabayashi, Morio Nakamura, Tatuaki Maeda
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Patent number: 4732968Abstract: A water-absorbent resin having an appropriate particle size and a narrow particle size distribution can be obtained by adding a powdered inorganic material in a proportion of 0.000005-0.2 part by weight to 1 part by weight of a water-absorbent resin containing therein a carboxylate as a component of the polymer with agitation in an inert solvent in the presence of 0.1-5.0 parts by weight of water and 0.005-0.2 part by weight of a surfactant and then removing water and the inert solvent by distillation.Type: GrantFiled: December 3, 1986Date of Patent: March 22, 1988Assignee: Seitetsu Kagaku Co., Ltd.Inventors: Shigeji Obayashi, Morio Nakamura, Takushi Yamamoto, Hitoshi Tanaka, Yuji Sakamoto, Yasuhiro Shimada
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Patent number: 4683274Abstract: A water-absorbent resin usable as a suitable water absorbent in sanitary materials and other fields can be produced by subjecting an aqueous solution of an .alpha.,.beta.-unsaturated carboxylic acid and of an alkali metal salt thereof to polymerization with a radical polymerization initiator in a petroleum-based hydrocarbon solvent in the presence or absence of a crosslinking agent and, in this polymerization, using a saccharose-fatty acid ester as a protective colloid agent.Type: GrantFiled: May 28, 1985Date of Patent: July 28, 1987Assignee: Seitetsu Kagaku Co., Ltd.Inventors: Morio Nakamura, Shigeji Obayashi, Takushi Yamamoto, Toshikazu Nakanishi, Hitoshi Tanaka, Yuji Sakamoto
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Patent number: 4590227Abstract: Water-swellable elastomer composition consisting essentially of a homogeneous mixture of an elastomer, a water-absorbent resin and a water-soluble resin. Said composition exhibits a high degree of swelling and a high swelling rate when it is soaked in water. Also, said composition retains swellability even when it is put in contact with water for a long period of time.Type: GrantFiled: October 24, 1984Date of Patent: May 20, 1986Assignee: Seitetsu Kagaku Co., Ltd.Inventors: Morio Nakamura, Shigeji Obayashi, Shinichi Takemori, Hitoshi Tanaka, Motomu Hirakawa