Patents by Inventor Morio Suzuki

Morio Suzuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11945379
    Abstract: A sound-absorbing material for vehicles that is mounted to a vehicle interior and that is provided with a main body in which at least a fibrous material and a skin material are integrally molded. The sound-absorbing material for vehicles is characterized in that a sound-absorbing section provided to at least part of the main body is formed so as to be mounted to the vehicle interior within a range in which the vertical distance Elh from the lower surface of the head rests of the front seats downward is 0.1-0.4 m, and in that the air flow resistance AFR (Ns/m3) and the vertical distance Elh (m) satisfy 210<AFR+10/Elh<3020.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: April 2, 2024
    Assignee: KOTOBUKIYA FRONTE CO., LTD.
    Inventors: Tomoyuki Hagio, Morio Suzuki, Yoshiaki Suzuki, Satoshi Shimada
  • Publication number: 20210245682
    Abstract: A sound-absorbing material for vehicles that is mounted to a vehicle interior and that is provided with a main body in which at least a fibrous material and a skin material are integrally molded. The sound-absorbing material for vehicles is characterized in that a sound-absorbing section provided to at least part of the main body is formed so as to be mounted to the vehicle interior within a range in which the vertical distance Elh from the lower surface of the head rests of the front seats downward is 0.1-0.4 m, and in that the air flow resistance AFR (Ns/m3) and the vertical distance Elh (m) satisfy 210<AFR+10/Elh<3020.
    Type: Application
    Filed: May 9, 2019
    Publication date: August 12, 2021
    Applicant: MT-TEC LLC
    Inventors: Tomoyuki HAGIO, Morio SUZUKI, Yoshiaki SUZUKI, Satoshi SHIMADA
  • Patent number: 8836340
    Abstract: An assembled battery system is disclosed that includes a plurality of serially-connected battery cells; voltage detecting lines connectable at one ends to electrodes of the battery cells of the assembled battery; electric resistors serially-connected at one ends to the other ends of the voltage detecting lines; capacitors connected to the other ends of the electric resistors, each of the capacitors being configured to electrically interconnect one of the voltage detecting lines and the other voltage detecting line; voltage measuring circuits connected respectively to each of the voltage detecting lines; electrically openable short-circuiting switches arranged between the capacitors and the voltage measuring circuits and parallel-connected to the capacitors; and a monitoring circuit that detects a difference between a first measurement result and a second measurement result with respect to each of the short-circuiting switches and a failure of the voltage detecting lines, the short-circuiting switches or the v
    Type: Grant
    Filed: December 6, 2011
    Date of Patent: September 16, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hironobu Aoki, Mami Mizutani, Yuuki Kuwano, Takehiro Usumori, Morio Suzuki, Takashi Morimoto
  • Publication number: 20120146652
    Abstract: An assembled battery system is disclosed that includes a plurality of serially-connected battery cells; voltage detecting lines connectable at one ends to electrodes of the battery cells of the assembled battery; electric resistors serially-connected at one ends to the other ends of the voltage detecting lines; capacitors connected to the other ends of the electric resistors, each of the capacitors being configured to electrically interconnect one of the voltage detecting lines and the other voltage detecting line; voltage measuring circuits connected respectively to each of the voltage detecting lines; electrically openable short-circuiting switches arranged between the capacitors and the voltage measuring circuits and parallel-connected to the capacitors; and a monitoring circuit that detects a difference between a first measurement result and a second measurement result with respect to each of the short-circuiting switches and a failure of the voltage detecting lines, the short-circuiting switches or the v
    Type: Application
    Filed: December 6, 2011
    Publication date: June 14, 2012
    Inventors: Hironobu Aoki, Mami Mizutani, Yuuki Kuwano, Takehiro Usumori, Morio Suzuki, Takashi Morimoto
  • Patent number: 6310296
    Abstract: A multicore cable includes a plurality of cables in parallel and is formed by fusion-welding the plurality of cables with a resin jacket. Each of the plurality of cables is formed by winding a shield around a signaling core wire, which is covered with an insulating material, and a grounding core wire. The resin jacket and the shield are stripped so that a stair portion is formed. The stair portion is coated with an electrically conductive adhesive. A vibration is exerted on the grounding core wire, thereby connecting the shield with the grounding core wire with the electrically conductive adhesive. Eventually, the shield and the grounding core wire are bonded with the electrically conductive adhesive. This allows an electrical connection between the shield and the grounding core wire to be maintained in a desirable condition, thus making it possible to suppress a characteristic impedance variation of the signaling core wire caused by an external factor.
    Type: Grant
    Filed: November 18, 1999
    Date of Patent: October 30, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Yasushi Nishi, Kiyofumi Tanaka, Morio Suzuki
  • Patent number: 6213786
    Abstract: A multi-pin connector has contact pins fixedly soldered into bottomed connection holes which are in desired positions on a printed board, so that the contact pins are arrayed in a desired form without a housing. The multi-pin connector can be manufactured in a short period of time and can have any pitch, any number of pins and any shape.
    Type: Grant
    Filed: August 3, 2000
    Date of Patent: April 10, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Kiyoshi Matsui, Takayuki Ono, Kenichi Kasai, Tsutomu Imai, Morio Suzuki, Hideyuki Fukasawa, Mitugu Shirai, Toshitaka Murakawa, Takeji Siokawa, Takeshi Kuroda
  • Patent number: 6132221
    Abstract: A multi-pin connector for mounting other boards or electronic parts on a main board, has contact pins fixedly soldered into bottomed connection holes which are in desired positions on the main board, so that the contact pins are secured separately and arrayed in a desired form without a housing. The contact pins have contact portions and pin portions, with the pin portions being secured in the connection holes.
    Type: Grant
    Filed: April 22, 1998
    Date of Patent: October 17, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Kiyoshi Matsui, Takayuki Ono, Kenichi Kasai, Tsutomu Imai, Morio Suzuki, Hideyuki Fukasawa, Mitugu Shirai, Toshitaka Murakawa, Takeji Siokawa, Takeshi Kuroda
  • Patent number: 6009621
    Abstract: A multicore cable includes a plurality of cables in parallel and is formed by fusion-welding the plurality of cables with a resin jacket. Each of the plurality of cables is formed by winding a shield around a signaling core wire, which is covered with an insulating material, and a grounding core wire. The resin jacket and the shield are stripped so that a stair portion is formed. The stair portion is coated with an electrically conductive adhesive. A vibration is exerted on the grounding core wire, thereby connecting the shield with the grounding core wire with the electrically conductive adhesive. Eventually, the shield and the grounding core wire are bonded with the electrically conductive adhesive. This allows an electrical connection between the shield and the grounding core wire to be maintained in a desirable condition, thus making it possible to suppress a characteristic impedance variation of the signaling core wire caused by an external factor.
    Type: Grant
    Filed: October 8, 1998
    Date of Patent: January 4, 2000
    Assignee: Hitachi, Ltd.
    Inventors: Yasushi Nishi, Kiyofumi Tanaka, Morio Suzuki
  • Patent number: 5957736
    Abstract: An electronic part, particularly a microstructure contact having an overall length of the order of 5 mm for an electrical connector or the like is provided with a nickel oxide layer portion having a nickel oxide layer of the order of 50 to 5000 .ANG. in thickness formed by anode oxidizing process using a solution mainly consisting of an alkaline solution. The nickel oxide layer portion is located between a terminal portion of the electronic part to be soldered as in a surface mounting process and a contact portion continuous to and extending from the terminal portion. The nickel oxide layer has a width of the order of 0.2 to 1 mm in the longitudinal direction of the contact and has a performance preventing the flowing of molten solder, thereby effectively preventing the flowing and wicking due to wetting of solder of the solder-plated portion toward the other portions as in the surface mounting process.
    Type: Grant
    Filed: December 8, 1997
    Date of Patent: September 28, 1999
    Assignees: DDK Ltd., Hitachi, Ltd.
    Inventors: Hiroyuki Moriuchi, Tomonari Otsuki, Sadao Kuboi, Kiyoshi Matsui, Takayuki Ono, Morio Suzuki
  • Patent number: 5888106
    Abstract: A pin contact of a connector includes a parallel portion which touches a contact portion of a contact spring portion of a socket contact when the pin contact is fitted into the socket contact, and an inclined portion to be inserted into the contact spring portion while forcibly opening the contact spring portion at the time of insertion. The inclined portion has a shape which is a combination of a curve portion and a linear portion, the curve portion being moderate in inclination in the area of a boundary point between the curve portion and the parallel portion while sharp in inclination in the area of a contact start point at a pointed end of the contact pin contact. The linear portion has a constant inclination angle.
    Type: Grant
    Filed: November 27, 1995
    Date of Patent: March 30, 1999
    Assignee: Hitachi, Ltd.
    Inventors: Takayuki Ono, Toshiaki Fujino, Kiyoshi Matsui, Kenichi Kasai, Morio Suzuki
  • Patent number: 5743009
    Abstract: Ends of contact pins are inserted into bottomed connection holes which are in desired positions on a printed board, so that the contact pins are arrayed in the desired form. By effecting solder reflow in this state, the contact pins are fixedly soldered to the connection holes. A multi-pin connector is thus provided, which can be manufactured with ease in a short period of time and which can have any pitch, any number of pins and any shape.
    Type: Grant
    Filed: April 4, 1996
    Date of Patent: April 28, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Kiyoshi Matsui, Takayuki Ono, Kenichi Kasai, Tsutomu Imai, Morio Suzuki, Hideyuki Fukasawa, Mitugu Shirai, Toshitaka Murakawa, Takeji Siokawa, Takeshi Kuroda
  • Patent number: 5211571
    Abstract: A print substrate connector having a main body comprising a pair of supporting portions. A lock arm 26 is provided on a sidewall of a substrate mounting groove 22 formed in the main body of the substrate connector, into which groove 22 a terminal connecting portion 30 of the print substrate 29 is inserted. The part of the sidewall of the substrate mounting groove 22, on which part the lock arm 26 is placed, faces a vacant portion at the sides of the terminal connecting portion 30 of the print substrate 29, on which vacant portion no element is mounted. In operation or when the print substrate 29 is inserted into the mounting groove 22 of the main body, a locking claw 28 formed on the lock arm 26 is adapted to engage with a locking hole 32 formed on the vacant portion of the print conveniently used as a locking means of the substrate without a bad influence on a high density mounting of elements mounted on the substrate.
    Type: Grant
    Filed: February 15, 1991
    Date of Patent: May 18, 1993
    Assignees: Hirose Electric Co., Ltd., Hitachi, Ltd.
    Inventors: Tatsuya Arai, Hiroshi Ohkawa, Hirokatsu Yaegashi, Morio Suzuki, Hiroshi Kouzai
  • Patent number: 5149871
    Abstract: A novel water-soluble produced by contacting thiourea dioxide with an aqueous solution comprising an amino acid having the general formula NH.sub.2 (CH.sub.2).sub.n COOH wherein n is an integer of 1 to 7 and a sodium, potassium or calcium salt of acetic acid.
    Type: Grant
    Filed: November 25, 1991
    Date of Patent: September 22, 1992
    Assignee: Tokai Denka Kogyo Kabushiki Kaisha
    Inventors: Hirohisa Nitoh, Osami Ohura, Morio Suzuki
  • Patent number: 4943661
    Abstract: An amine-substituted thiourea dioxide is obtained by reacting thiourea dioxide and an aliphatic or aromatic primary amine in a neutral or acidic pH range.
    Type: Grant
    Filed: March 14, 1989
    Date of Patent: July 24, 1990
    Assignee: Tokai Denka Kogyo Kabushiki Kaisha
    Inventors: Hirohisa Nitoh, Osami Ohura, Morio Suzuki
  • Patent number: 4943516
    Abstract: A photosensitive thermosetting resin composition, comprising (A) a photosensitive prepolymer containing at least two ethylenically unsaturated bonds in the molecular unit thereof, (B) a photoinitiator, (C) a photopolymerizable vinyl monomer and/or an organic solvent as a diluent, (D) a finely powdered epoxy compound containing at least two epoxy groups in the molecular unit thereof and exhibiting sparing solubility in the diluent to be used, and optionally (E) a curing agent for epoxy resin, excels in developing property and sensitivity and enjoys a long shelf life.By subjecting this photosensitive thermosetting resin composition to coating, exposure, development, and postcuring, there can be formed a solder resist pattern which excels in adhesion, insulation resistance, resistance to electrolytic corrosion, resistance to soldering temperature, resistance to chemicals, and resistance to plating.
    Type: Grant
    Filed: November 22, 1988
    Date of Patent: July 24, 1990
    Assignee: Taiyo Ink Manufacturing Co., Ltd.
    Inventors: Yuichi Kamayachi, Kenji Sawazaki, Morio Suzuki, Shoji Inagaki
  • Patent number: 4717044
    Abstract: A plurality of cassette cases for accommodating coin packages are vertically arranged in a coin package dispensing apparatus. An elevator device is disposed to be vertically movable so that it is adapted to be aligned with each of cassette case. The elevator has a discharge cam which transfers coin packages from the cassette cases to the elevator.
    Type: Grant
    Filed: July 11, 1986
    Date of Patent: January 5, 1988
    Assignee: Laurel Bank Machines Co., Ltd.
    Inventors: Morio Suzuki, Kenzi Okada
  • Patent number: 4662432
    Abstract: A vibration damping system of an automotive vehicle consists of a radiator which is fluidly connected through flexible radiator hoses to an engine and elastically supported through elastic members to a vehicle body. The radiator hoses are fixed at the vicinity of an end section thereof to the vehicle body in such a manner that the radiator has a pitching natural frequency separate from a bouncing natural frequency. Additionally, the elastic members are so constructed and arranged to allow the bouncing natural frequency of the radiator to be separate from the vehicle body flexural vibration resonance frequency and from the resonance frequency of a steering column, thereby effectively damping low frequency vibration of the vehicle.
    Type: Grant
    Filed: June 17, 1985
    Date of Patent: May 5, 1987
    Assignee: Nissan Motor Co., Ltd.
    Inventor: Morio Suzuki
  • Patent number: 4632478
    Abstract: A contact of a connector made of an elongated resilient material and having an inner end fixed to a connector housing and a midway to be in contact with a mating contact of another connector. According to the invention, the contact comprises a substantially straight portion extending from a contacting portion of the midway with the mating contact to the fixed inner end, and an outer portion being bent in zigzag extending from the contacting portion to the distal end abutting against a surface of the connector housing, thereby obtaining a sufficient contacting resilient pressure to realize stable and reliable connecting condition with the mating contact and simultaneously achieving small-sized connectors and high speed signal transmission.
    Type: Grant
    Filed: February 26, 1985
    Date of Patent: December 30, 1986
    Assignees: Hitachi, Ltd., Daiichi Denshi Kogyo Kabushiki Kaisha
    Inventors: Hiroshi Kozai, Morio Suzuki, Matsuo Katoh, Toshiaki Suzuki
  • Patent number: 4015066
    Abstract: Crystalline N.sup.6,2'-O-dibutyryl-adenosine-3',5'-cyclic monophosphate monosodium salt (DB.sub.c -AMP-N.sub.a), and a process for producing the same which may comprise the step of causing at least one solvent selected from an ether, ketone, and an ester, constituting a crystallizing organic solvent, to contact an alcoholic solution, aqueous alcoholic solution, or a simple aqueous solution of DB.sub.c -AMP-N.sub.a or may comprise the step of dissolving crude crystalline or amorphous DB.sub.c -AMP-N.sub.a in a mixture of an alcoholic solvent and the crystallizing organic solvent.
    Type: Grant
    Filed: April 8, 1974
    Date of Patent: March 29, 1977
    Assignee: Yamasa Shoyu Kabushiki Kaisha
    Inventors: Takashi Nagata, Goro Motoki, Morio Suzuki, Hiroshi Yoshino