Patents by Inventor Morito Kanada

Morito Kanada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9698312
    Abstract: A resin package includes a molded resin housing, a first lead, and a second lead. The molded resin housing includes a cavity open upward. The cavity includes an inner surface. The inner surface includes a curved portion and a stepped portion provided on a lower side of the curved portion. The first lead and the second lead are provided in a bottom portion of the cavity such that at least a part of the first lead and the second lead is exposed from the molded resin housing. The first lead includes an elevated portion on which a light emitting element is mounted. An upper surface of the elevated portion is provided higher than an upper end portion of the stepped portion.
    Type: Grant
    Filed: December 17, 2014
    Date of Patent: July 4, 2017
    Assignee: NICHIA CORPORATION
    Inventors: Ryosuke Wakaki, Morito Kanada
  • Patent number: 9246074
    Abstract: A light emitting device includes a plurality of light emitting elements, a plurality of lead frames, and a package. The light emitting elements are mounted on the lead frames. The package is made of resin. The package has an opening. A part of the lead frames is embedded in an inner portion of the package and another part of the lead frames is exposed on a bottom surface of the opening. A resin bottom surface on which the resin is exposed is provided on the bottom surface of the opening of the package. The package includes a wall portion projecting from the bottom surface of the opening between the light emitting elements in the opening. The light emitting elements are connected by wire that straddles the wall portion.
    Type: Grant
    Filed: January 28, 2013
    Date of Patent: January 26, 2016
    Assignee: NICHIA CORPORATION
    Inventors: Morito Kanada, Kensaku Hamada
  • Publication number: 20150171282
    Abstract: A resin package includes a molded resin housing, a first lead, and a second lead. The molded resin housing includes a cavity open upward. The cavity includes an inner surface. The inner surface includes a curved portion and a stepped portion provided on a lower side of the curved portion. The first lead and the second lead are provided in a bottom portion of the cavity such that at least a part of the first lead and the second lead is exposed from the molded resin housing. The first lead includes an elevated portion on which a light emitting element is mounted. An upper surface of the elevated portion is provided higher than an upper end portion of the stepped portion.
    Type: Application
    Filed: December 17, 2014
    Publication date: June 18, 2015
    Applicant: NICHIA CORPORATION
    Inventors: Ryosuke WAKAKI, Morito KANADA
  • Patent number: 8525208
    Abstract: A light emitting device has a package having an opening provided with a side surface and a bottom surface, and a lead frame exposed to the bottom surface. The lead frame includes a reflection portion bent on the side surface, and a portion of an inner wall surface of the reflection portion is positioned in an inner portion of the package. A light emitting device has a package having a recessed portion on a front surface, a lead frame exposed to a bottom surface of the recessed portion, a light emitting element disposed on the lead frame, and a sealing resin filled into the recessed portion. The lead frame includes a bent portion bent towards the front surface of the package in the recessed portion, and a projecting portion bent to project from the package towards an outer portion, and disposed on a face opposed to the front surface.
    Type: Grant
    Filed: July 8, 2009
    Date of Patent: September 3, 2013
    Assignee: Nichia Corporation
    Inventors: Morito Kanada, Hideo Asakawa
  • Publication number: 20110175127
    Abstract: A light emitting device has a package having an opening provided with a side surface and a bottom surface, and a lead frame exposed to the bottom surface. The lead frame includes a reflection portion bent on the side surface, and a portion of an inner wall surface of the reflection portion is positioned in an inner portion of the package. A light emitting device has a package having a recessed portion on a front surface, a lead frame exposed to a bottom surface of the recessed portion, a light emitting element disposed on the lead frame, and a sealing resin filled into the recessed portion. The lead frame includes a bent portion bent towards the front surface of the package in the recessed portion, and a projecting portion bent to project from the package towards an outer portion, and disposed on a face opposed to the front surface.
    Type: Application
    Filed: July 8, 2009
    Publication date: July 21, 2011
    Applicant: NICHIA CORPORATION
    Inventors: Morito Kanada, Hideo Asakawa
  • Patent number: 7830079
    Abstract: A light emitting device includes a package having a recessed portion defined by a bottom surface and a side surface and a light emitting element mounted on the bottom surface of the recessed portion, in which the package has fibrous fillers, and at least some of the fillers are projected outwards through the side surface and coated with a reflection film made of metal.
    Type: Grant
    Filed: May 4, 2007
    Date of Patent: November 9, 2010
    Inventors: Hiroto Tamaki, Morito Kanada
  • Publication number: 20070262336
    Abstract: A light emitting device includes a package having a recessed portion defined by a bottom surface and a side surface and a light emitting element mounted on the bottom surface of the recessed portion, in which the package has fibrous fillers, and at least some of the fillers are projected outwards through the side surface and coated with a reflection film made of metal.
    Type: Application
    Filed: May 4, 2007
    Publication date: November 15, 2007
    Inventors: Hiroto Tamaki, Morito Kanada