Patents by Inventor Moritoshi Akino

Moritoshi Akino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit chip package for logic circuits
    Patent number: 4398208
    Abstract: An integrated circuit (IC) chip package comprises a plurality of IC chips mounted on a multilayer substrate. A plurality of covers are provided on the substrate and are positioned so as to cover at least one of the IC chips. External pins are provided on each of the covers, and each of the pins is connected to selected chips via first signal lines on the covers connecting the pins to the substrate, and second signal lines within the substrate connecting the first signal lines to the selected chips. The substrate may be provided with a heat exchanger or heat sinks at the underside thereof, the overall construction resulting in a cool operating IC chip package with numerous external terminals having short wiring lengths to the chips.
    Type: Grant
    Filed: July 10, 1980
    Date of Patent: August 9, 1983
    Assignee: Nippon Electric Co., Ltd.
    Inventors: Hiroshi Murano, Moritoshi Akino