Abstract: A substrate carrier made of glass for processing a transparent or transmissive substrate by electromagnetic radiation includes a first upper side serving as a substrate support and a lower side facing away from the upper side. The substrate support and/or the lower side of the substrate carrier has a structuring produced by modifications in the substrate carrier and a material removal by action of an etching medium in respective regions of the modifications in the substrate carrier. The structuring has a plurality of adjacent and/or merging conical recesses. At least one of the conical recesses is configured as a through-hole of the substrate carrier between the substrate support and the lower side, and a plurality of other ones of the conical recesses are configured as depressions.

Abstract: A method for introducing a recess into a substrate, and/or for reducing a material, includes spatially beam shaping a focus of a laser beam along a beam axis, whereby defects are produced in the substrate along the beam axis without there being any material removal. One or more of the defects forms a modification in the substrate, so that subsequently the recess and/or the material thickness reduction is produced by action of an etching medium by an anisotropic material removal. An additional modification is introduced into the substrate along an additional beam axis that is parallel to and spaced from the beam axis, the additional modification having an extent between a first outer surface of the substrate and a position within the substrate that is at a distance from a second, opposite outer surface of the substrate.

Abstract: A method for producing a technical mask includes: providing a technical mask including at least one plate-shaped substrate, the plate-shaped substrate being transparent to at least one laser wavelength; and producing at least one opening in the mask by laser-induced deep etching. In an embodiment, an etching attack takes place at least temporarily on one side during laser-induced deep etching.

Abstract: A method for producing a technical mask includes: providing a technical mask including at least one plate-shaped substrate, the plate-shaped substrate being transparent to at least one laser wavelength; and producing at least one opening in the mask by laser-induced deep etching. In an embodiment, an etching attack takes place at least temporarily on one side during laser-induced deep etching.