Abstract: A computer-implemented method determines a quality state of a wafer. The method includes providing at least three process control monitoring metrics of the wafer. Each process control monitoring metric is collected on the wafer at a different process control monitoring coordinate. The method further includes inputting the at least three process control monitoring metrics and the different process control monitoring coordinates of the process control monitoring metrics into at least one machine learning algorithm, and outputting at least three approximated wafer level test values by the at least one machine learning algorithm. The method also includes determining the quality state of the wafer based on the at least three approximated wafer level test values.