Abstract: A circular integrated circuit package which allows a large number of internal and external connections to be made to an integrated circuit chip by arranging the pin connections as rings of concentric circles. This arrangement provides the highest possible packing density and minimizes parasitic inductances and capacitances. The circular geometry also provides for greater predictability of parasitic effects and propagation delays due to the circular symmetry of the packaging. Insertion into a printed circuit board is facilitated by decreasing the length of each successive ring of pins as the radial distance from the center of the concentric rings increases so that one ring of pins is inserted at a time. Internally, the length of internal pins may similarly be arranged, but in reverse order, so that lead length is minimized. A variety of keyway types is provided.