Abstract: The present disclosure relates to a novel semiconductor edge and bevel inspection tool system of a wafer comprising a first illumination setup, an imaging sensor unit, and a second illumination setup. At least a portion of the second illumination radiation is configured for interacting with at least a portion of the wafer edge and bevel region surface. The second illumination setup has different radiation parameters than the first illumination setup. The first and the second illumination radiations have substantially opposite directions.

Abstract: An apparatus and methods of additive manufacturing are provided. The apparatus may include at least one frame for supporting at least one print head configured to deposit fluidic additive manufacturing material layer by layer, at least one reservoir in communication with the at least one print head, the at least one reservoir being configured to contain the additive manufacturing material, a printing table including at least one printing region for supporting at least one removable substrate for printing at least one three-dimensional object, the at least one removable substrate is made from a material other than the additive manufacturing material, and at least one processor configured to: control a rotational movement between the at least one print head and the printing table; and control vertical movement between the at least one print head and the printing table.

Abstract: Methods and systems for authenticating items and remotely detecting counterfeit items. Methods and systems for detecting counterfeit copies of genuine items.