Abstract: A metallic composite solid, containing alloys and/or intermetallics, is formed by compacting at moderate pressure a mixture of powder particles, foils or sheets at a temperature close to room temperature, well below the melting temperature of the constituent components and without the addition of low melting metals such as mercury, indium or gallium acting as a sintering agent. This low temperature consolidation of the powder mixture is enhanced by having the surface oxide of the powder particles removed, prior to consolidation, and/or by coating the particles with an oxide-replacing metal such as silver or gold. The coating process may be replacement reactions, autocatalytic reduction or electrolytic reduction. The composite formation is assisted by the addition of a liquid acid such as fluoroboric acid, sulfuric acid, fluoric acid, adipic acid, ascorbic acid, or nitric acid.

Abstract: A metallic composite solid, containing alloys and/or intermetallics, is formed by compacting at moderate pressure a mixture of powder particles, foils or sheets at a temperature close to room temperature, well below the melting temperature of the constituent components and without the addition of low melting metals such as mercury, indium or gallium acting as a sintering agent. This low temperature consolidation of the powder mixture is enhanced by having the surface oxide of the powder particles removed, prior to consolidation, and/or by coating the particles with an oxide-replacing metal such as silver or gold. The coating process may be replacement reactions, autocatalytic reduction or electrolytic reduction. The composite formation is assisted by the addition of a liquid acid such as fluoroboric acid, sulfuric acid, fluoric acid, adipic acid, ascorbic acid, or nitric acid.

Abstract: A metallic composite solid, containing alloys and/or intermetallics, is formed by compacting at moderate pressure a mixture of powder particles, foils or sheets at a temperature close to room temperature, well below the melting temperature of the constituent components and without the addition of low melting metals such as mercury, indium or gallium acting as a sintering agent. This low temperature consolidation of the powder mixture is enhanced by having the surface oxide of the powder particles removed, prior to consolidation, and/or by coating the particles with an oxide-replacing metal such as silver or gold. The coating process may be replacement reactions, autocatalytic reduction or electrolytic reduction. The composite formation is assisted by the addition of a liquid acid such as fluoroboric acid, sulfuric acid, fluoric acid, adipic acid, ascorbic acid, or nitric acid.

Abstract: A metallic composite solid, containing alloys and/or intermetallics, is formed by compacting at moderate pressure a mixture of powder particles, foils or sheets at a temperature close to room temperature, well below the melting temperature of the constituent components and without the addition of low melting metals such as mercury, indium or gallium acting as a sintering agent. This low temperature consolidation of the powder mixture is enhanced by having the surface oxide of the powder particles removed, prior to consolidation, and/or by coating the particles with an oxide-replacing metal such as silver or gold. The coating process may be replacement reactions, autocatalytic reduction or electrolytic reduction. The composite formation is assisted by the addition of a liquid acid such as fluoroboric acid, sulfuric acid, fluoric acid, adipic acid, ascorbic acid, or nitric acid.

Abstract: A process for the production of a composition modulated alloy having a predetermined concentration is disclosed, in which alternating layers of at least two metals are successively deposited upon a substrate by electrodeposition, vacuum deposition, vapor deposition, or sputtering. The individual thicknesses of at least one metal's layers are varied in a predetermined manner. Pulsed galvanostatic electrodeposition using a tailored waveform is preferred. A copper-nickel concentration graded alloy is disclosed. Concentration graded alloys of predetermined concentration having at least one region of local homogeneity are also disclosed. The region of local homogeneity has a thickness corresponding to the thickness of two adjacent layers of different metals which have been diffusion annealed together. A pulsed electrodeposition/diffusion anneal process for production of such alloys is also disclosed.

Abstract: Oxide-free metallic, alloy or intermetallic compound formed by coating a powder of at least one member selected from the group consisting of elemental metallic, alloy and intermetallic compound with an oxide-replacing metal. The oxide-free compound may be compacted without the addition of a liquid sintering agent and at temperatures below the melting point of the compound, under sufficient pressure to form a uniform, consolidated intermetallic body.

Abstract: A process for the production of a composition modulated alloy having a predetermined concentration is disclosed, in which alternating layers of at least two metals are successively deposited upon a substrate by electrodeposition, vacuum deposition, vapor deposition, or sputtering. The individual thicknesses of at least one metal's layers are varied in a predetermined manner. Pulsed galvanostatic electrodeposition using a tailored waveform is preferred. A copper-nickel concentration graded alloy is disclosed. Concentration graded alloys of predetermined concentration having at least one region of local homogeneity are also disclosed. The region of local homogeneity has a thickness corresponding to the thickness of two adjacent layers of different metals which have been diffusion annealed together. A pulsed electrodeposition/diffusion anneal process for production of such alloys is also disclosed.

Abstract: A process for the production of a composition modulated alloy having a predetermined concentration is disclosed, in which alternating layers of at least two metals are successively deposited upon a substrate by electrodeposition, vacuum deposition, vapor deposition, or sputtering. The individual thicknesses of at least one metal's layers are varied in a predetermined manner. Pulsed galvanostatic electrodeposition using a tailored waveform is preferred. A copper-nickel concentration graded alloy is disclosed. Concentration graded alloys of predetermined concentration having at least one region of local homogeneity are also disclosed. The region of local homogeneity has a thickness corresponding to the thickness of two adjacent layers of different metals which have been diffusion annealed together. A pulsed electrodeposition/diffusion anneal process for production of such alloys is also disclosed.