Abstract: During operation of a gas turbine engine, the airfoils of turbine blades are exposed to very high temperatures. Embodiments of a turbine blade may comprise an outer cooling channel, which supplies coolant to the leading edge and tip of the airfoil, and wraps around inner cooling channel(s), which supply coolant to the middle of the airfoil. These outer and inner cooling channels may merge in a merge channel with an aft cooling channel that supplies coolant to the trailing edge and tip of the airfoil. In an embodiment, discrete pressure-side and suction-side inner cooling channels may provide a flow path for coolant in opposing directions to thereby reduce temperature gradients within the airfoil. Embodiments may also comprise other cooling features, including cooling holes, trip strips, and/or pins.

Abstract: In a gas turbine engine, turbine blades are subjected to extremely high gas temperatures and mechanical stresses. Disclosed embodiments utilize one or more cooling and/or stress-reduction features. For example, flared and/or shaped cooling apertures may be provided through a platform, adjacent to a leading edge of a fillet of the airfoil of the turbine blade, and/or through the leading edge of the fillet. As another example, an aperture may provide coolant from an under-platform cavity to a trailing edge of the fillet. As another example, a tip flag may be provided in the interior of the airfoil, with trip strips to turbulate the flow of coolant through the tip flag and a reduced spar height to reduce stress. As another example, the aft axial end of a pin seal slot may axially extend beyond the fillet, in the aft direction, to reduce stiffness and produce beneficial transient behavior.

Abstract: A MEMS inertial sensor device, method of operation, and fabrication process are described with a MEMS inertial sensor, drive actuation unit, drive measurement unit, and PLL circuit coupled together in operational engagement, where the MEMS inertial sensor includes a substrate, a proof mass positioned in spaced apart relationship above the substrate, a proof mass suspension member connected on a first end to the proof mass and connected on a second end to an anchor fixed to the substrate to enable the proof mass to laterally oscillate over the surface of the substrate, and a compliant stop structure positioned in relation to the proof mass suspension member to physically engage with lateral oscillating movement of the proof mass suspension member past a desired stroke travel distance without physically preventing lateral oscillating movement of the proof mass, thereby stiffening a spring stiffness measure of the proof mass suspension member.

Abstract: A MEMS device and method of forming the same includes paired masses suspended above a substrate includes linkages that couple pairs of masses to each other. Inner sense linkages couple interior edges of adjacent masses to each other. The inner sense linkages are configured to exhibit a first stiffness when the adjacent masses coupled to each inner sense linkage move out-of-phase relative to each other along a preferred axis of the inner sense linkages and to exhibit a second, increased stiffness in response to in-phase motion of the adjacent masses coupled to each inner sense linkage.

Abstract: Embodiments of an angular rate sensor are described, including a MEMS structure having a first set of proof masses arranged in a first two-dimensional array, a second set of proof masses arranged in a second two-dimensional array, and drive actuators, each configured to drive a respective proof mass of the first set of proof masses and a respective proof mass of the second set of proof masses. At least two proof masses of the first set of proof masses are disposed at opposite sides of the second set of proof masses.

Abstract: A MEMS inertial sensor device, method of operation, and fabrication process are described with a MEMS inertial sensor, drive actuation unit, drive measurement unit, and PLL circuit coupled together in operational engagement, where the MEMS inertial sensor includes a substrate, a proof mass positioned in spaced apart relationship above the substrate, a proof mass suspension member connected on a first end to the proof mass and connected on a second end to an anchor fixed to the substrate to enable the proof mass to laterally oscillate over the surface of the substrate, and a compliant stop structure positioned in relation to the proof mass suspension member to physically engage with lateral oscillating movement of the proof mass suspension member past a desired stroke travel distance without physically preventing lateral oscillating movement of the proof mass, thereby stiffening a spring stiffness measure of the proof mass suspension member.

Abstract: A MEMS device and method of forming the same includes paired masses suspended above a substrate includes linkages that couple pairs of masses to each other. Inner sense linkages couple interior edges of adjacent masses to each other. The inner sense linkages are configured to exhibit a first stiffness when the adjacent masses coupled to each inner sense linkage move out-of-phase relative to each other along a preferred axis of the inner sense linkages and to exhibit a second, increased stiffness in response to in-phase motion of the adjacent masses coupled to each inner sense linkage.

Abstract: Ultrasonic sensing approaches are described with integrated MEMS-CMOS implementations. Embodiments include ultrasonic sensor arrays for which PMUT structures of individual detector elements are at least partially integrated into the CMOS ASIC wafer. MEMS heating elements are integrated with the PMUT structures by integrating under the PMUT structures in the CMOS wafer and/or over the PMUT structures (e.g., in the protective layer). For example, embodiments can avoid wafer bonding and can reduce other post processing involved with conventional manufacturing of PMUT ultrasonic sensors, while also improving thermal response.

Abstract: Ultrasonic sensing approaches are described with integrated MEMS-CMOS implementations. Embodiments include ultrasonic sensor arrays for which PMUT structures of individual detector elements are at least partially integrated into the CMOS ASIC wafer. MEMS heating elements are integrated with the PMUT structures by integrating under the PMUT structures in the CMOS wafer and/or over the PMUT structures (e.g., in the protective layer). For example, embodiments can avoid wafer bonding and can reduce other post processing involved with conventional manufacturing of PMUT ultrasonic sensors, while also improving thermal response.

Abstract: A vibration-based power generator has a variable stiffness oscillator connected to a base. The oscillator comprises an inertial mass moving relative to the base in response to vibrations. The oscillator has a neutral position corresponding to a position of the oscillator when no vibrations are transmitted to the base. The oscillator has a first position where the mass is at a first distance and a second position where the inertial mass is at a second distance from a position of the mass when the oscillator is in neutral position. The second distance is greater than the first distance. A stiffness of the oscillator at the second position is greater than a stiffness of the oscillator at the first position. A transducer generating electric power in response to movement of the inertial mass is associated with the oscillator. A method of optimizing a vibration-based power generator is also presented.