Abstract: The present disclosure relates to riveting apparatuses, riveting devices, and methods for their use. An example riveting apparatus includes a pneumatically operated riveting tool having a working end for squeezing a rivet. The riveting apparatus includes a support bracket connected to the riveting tool proximate the working end, the support bracket having arms projecting on each side of the riveting tool. The riveting apparatus also includes a pair of spaced-apart edge rollers coupled to the support arms. The edge rollers are configured to rollably engage an edge of a work-piece so as to support the weight of the riveting tool and enable movable adjustment of the working end relative to the work-piece. The riveting apparatus includes a handle rotatably mounted to the riveting tool to enable axial rotation of the handle, the handle having an actuatable switch configured to selectively operate the riveting tool.

Abstract: The present disclosure relates to riveting apparatuses, riveting devices, and methods for their use. An example riveting apparatus includes a pneumatically operated riveting tool having a working end for squeezing a rivet. The riveting apparatus includes a support bracket connected to the riveting tool proximate the working end, the support bracket having arms projecting on each side of the riveting tool. The riveting apparatus also includes a pair of spaced-apart edge rollers coupled to the support arms. The edge rollers are configured to rollably engage an edge of a work-piece so as to support the weight of the riveting tool and enable movable adjustment of the working end relative to the work-piece. The riveting apparatus includes a handle rotatably mounted to the riveting tool to enable axial rotation of the handle, the handle having an actuatable switch configured to selectively operate the riveting tool.

Abstract: Ultrasonic sensing approaches are described with integrated MEMS-CMOS implementations. Embodiments include ultrasonic sensor arrays for which PMUT structures of individual detector elements are at least partially integrated into the CMOS ASIC wafer. MEMS heating elements are integrated with the PMUT structures by integrating under the PMUT structures in the CMOS wafer and/or over the PMUT structures (e.g., in the protective layer). For example, embodiments can avoid wafer bonding and can reduce other post processing involved with conventional manufacturing of PMUT ultrasonic sensors, while also improving thermal response.

Abstract: Ultrasonic sensing approaches are described with integrated MEMS-CMOS implementations. Embodiments include ultrasonic sensor arrays for which PMUT structures of individual detector elements are at least partially integrated into the CMOS ASIC wafer. MEMS heating elements are integrated with the PMUT structures by integrating under the PMUT structures in the CMOS wafer and/or over the PMUT structures (e.g., in the protective layer). For example, embodiments can avoid wafer bonding and can reduce other post processing involved with conventional manufacturing of PMUT ultrasonic sensors, while also improving thermal response.

Abstract: The present disclosure relates to riveting apparatuses, riveting devices, and methods for their use. An example riveting apparatus includes a pneumatically operated riveting tool having a working end for squeezing a rivet. The riveting apparatus includes a support bracket connected to the riveting tool proximate the working end, the support bracket having arms projecting on each side of the riveting tool. The riveting apparatus also includes a pair of spaced-apart edge rollers coupled to the support arms. The edge rollers are configured to rollably engage an edge of a work-piece so as to support the weight of the riveting tool and enable movable adjustment of the working end relative to the work-piece. The riveting apparatus includes a handle rotatably mounted to the riveting tool to enable axial rotation of the handle, the handle having an actuatable switch configured to selectively operate the riveting tool.

Abstract: A vibration-based power generator has a variable stiffness oscillator connected to a base. The oscillator comprises an inertial mass moving relative to the base in response to vibrations. The oscillator has a neutral position corresponding to a position of the oscillator when no vibrations are transmitted to the base. The oscillator has a first position where the mass is at a first distance and a second position where the inertial mass is at a second distance from a position of the mass when the oscillator is in neutral position. The second distance is greater than the first distance. A stiffness of the oscillator at the second position is greater than a stiffness of the oscillator at the first position. A transducer generating electric power in response to movement of the inertial mass is associated with the oscillator. A method of optimizing a vibration-based power generator is also presented.