Patents by Inventor Motoaki NISHIWAKI
Motoaki NISHIWAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230321750Abstract: A laser machining apparatus includes an actuator that changes relative positions of a machining head and a workpiece; a control unit that controls in machining execution the laser oscillator, the machining head, and the actuator based on a machining parameter; a machining state observation unit that detects, from process light that is light generated from the workpiece by laser beam irradiation, light intensities in a plurality of predetermined wavelength bands as a plurality of optical sensor signals; a feature extraction unit that extracts at least one of features, the features being obtainable from an index of correlation between the plurality of optical sensor signals and from one of the optical sensor signals; and a correction quantity calculation unit that determines the machining parameter to be corrected as a correction parameter and a correction quantity for the correction parameter based on the at least one of the features.Type: ApplicationFiled: August 27, 2020Publication date: October 12, 2023Applicant: Mitsubishi Electric CorporationInventors: Kyohei ISHIKAWA, Masaki SEGUCHI, Motoaki NISHIWAKI, Kenta FUJII, Tomotaka KATSURA
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Publication number: 20230211435Abstract: A laser machining system includes a state measurement unit that observes an internal state of a machining head or a varying state of a workpiece and outputs a machining state signal; an inference unit that determines a degree of quality of the laser beam machining as an inference result for each of machining defects concerning at least one type of machining defect on the basis of the machining state signal; a machining monitoring unit that monitors the workpiece for presence or absence of the machining defect and outputs a monitoring signal; a machining decision unit that decides whether there is the machining defect and determines a quality of the machining as a decision result; and a machinery safety unit that outputs, on the basis of the inference result and the decision result, a control signal that gives an instruction on whether to stop or continue the laser beam machining.Type: ApplicationFiled: May 29, 2020Publication date: July 6, 2023Applicant: Mitsubishi Electric CorporationInventors: Motoaki NISHIWAKI, Kenta FUJII, Kyohei ISHIKAWA
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Publication number: 20230080251Abstract: A control device that executes machining to cut a workpiece into a part and a remaining material; a detection unit that determines, as a time-series signal, a result of observing in time series a state of the workpiece; a machining state evaluation unit that determines, as evaluation information, a result of evaluation on a state of the machining for each of sections obtained by dividing the machining path, based on the time-series signal; an evaluation information storage unit that stores contour line evaluation information in which a contour line is associated with the evaluation information; and a sorting operation determination unit that determines a sorting control command for controlling sorting operation in which the part is taken out from a position where the workpiece is machined and moved to a target position, based on the contour line evaluation information; are provided.Type: ApplicationFiled: March 17, 2020Publication date: March 16, 2023Applicant: Mitsubishi Electric CorporationInventors: Kenta FUJII, Motoaki NISHIWAKI, Kyohei ISHIKAWA
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Publication number: 20220226935Abstract: A laser machining system according to the present invention includes a laser machining tool, a detection unit that detects a machining state of the laser machining tool, a test machining condition generation unit that generates a machining condition including at least one control parameter settable to the laser machining tool, a machining determination unit that determines quality of machining based on the machining state detected by the detection unit, a candidate condition generation unit that generates a candidate condition, which is a candidate for a machining condition to be set to the laser machining tool, based on a determination result from the machining determination unit and on a machining condition corresponding to the determination result, and a tolerance check unit that causes check machining to be performed for checking a machining tolerance using the candidate condition, where the machining tolerance indicates robustness of the candidate condition.Type: ApplicationFiled: June 28, 2019Publication date: July 21, 2022Applicant: Mitsubishi Electric CorporationInventors: Motoaki NISHIWAKI, Kenta FUJII, Kyohei ISHIKAWA, Masaki SEGUCHI, Hideyuki MASUI
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Publication number: 20220107629Abstract: A machining condition search device according to the disclosure includes a machining condition generation unit, a practical machining command unit, a machining evaluation unit, a prediction unit, an optimum machining condition calculation unit. The machining condition generation unit generates a machining condition defined by one or more control parameters settable on a machining apparatus. The practical machining command unit causes the machining apparatus to perform machining based on a generated machining condition. The machining evaluation unit generates an evaluation value of performed machining, on the basis of information indicating a machining result of the performed machining. The prediction unit predicts an evaluation value corresponding to a machining condition under which machining is not performed, on the basis of the evaluation value and the machining condition corresponding to the evaluation value.Type: ApplicationFiled: December 17, 2021Publication date: April 7, 2022Applicant: Mitsubishi Electric CorporationInventors: Hideyuki MASUI, Motoaki NISHIWAKI, Kenta FUJII, Kyohei ISHIKAWA, Masaki SEGUCHI
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Publication number: 20210162544Abstract: A laser processing apparatus includes a laser oscillator; a processing head; a driver that controls a relative positional relationship between a workpiece and the processing head; control circuitry that controls the laser oscillator and the driver in order for the laser beam to scan a processing path on the workpiece; detection circuitry that observes a state of the workpiece being processed and outputs a result of observation as a time series signal; processed state observation circuitry that obtains evaluation information including a determination result that indicates whether a processed state of the workpiece is satisfactory or defective by evaluating the processed state of the workpiece on the basis of the time series signal for each of a plurality of sections obtained by dividing the processing path; and estimation circuitry that estimates a cause of a defect on the basis of the evaluation information of two or more of the sections.Type: ApplicationFiled: April 26, 2019Publication date: June 3, 2021Applicant: Mitsubishi Electric CorporationInventors: Kenta FUJII, Motoaki NISHIWAKI, Nobuaki TANAKA, Masaki SEGUCHI, Kyohei ISHIKAWA
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Publication number: 20210031305Abstract: A laser processing machine includes a laser oscillator that emits a laser beam, a processing head that laser processes a workpiece by performing irradiation with the laser beam, a control apparatus that controls the laser oscillator and the processing head, an optical sensor that measures scattered light from the workpiece, the scattered light being generated when the workpiece is irradiated with the laser beam, and outputs a signal corresponding to the scattered light, a threshold setting unit that, on the basis of the signal output during a certain period after a piercing process is started, sets a threshold serving as a criterion for determining whether a hole has penetrated the workpiece by the piercing process, and a penetration determination unit that determines whether a hole has penetrated the workpiece on the basis of the signal and the threshold.Type: ApplicationFiled: May 7, 2018Publication date: February 4, 2021Applicant: Mitsubishi Electric CorporationInventors: Motoaki NISHIWAKI, Toshiki KOSHIMAE, Hiroyoshi OMURA, Takahiro KOZUKI