Abstract: A brushless motor includes a motor part and a gear part. The motor part includes: a rotating shaft, having a first gear; a rotor, having a bottom wall and a side wall, the bottom wall being fixed to the rotating shaft; magnets, fixed to the side wall and arranged side by side in a circumferential direction of the rotor; a stator, provided between the rotating shaft and the magnets in a radial direction of the rotor and wound with a coil; and a motor housing, rotatably supporting the rotating shaft, and accommodating the rotor and the stator. The gear part includes: a second gear, meshed with the first gear; an output shaft, having an output part, having a base end side thereof fixed to the second gear, and parallel to the rotating shaft; and a gear housing, rotatably supporting the output shaft, and accommodating the second gear.

Abstract: An LED array includes: a substrate having a depressing-projecting structure formed on a surface of the substrate; a planarization layer formed on the depressing-projecting structure; a plurality of micro LED elements each of which is formed on the planarization layer; and a stray light attenuating groove formed between a pair of adjacent micro LED elements among the plurality of micro LED elements, and extending from toward the pair of micro LED elements to toward the depressing-projecting structure at least part way of the planarization layer.

Abstract: A drug that inhibits aggregation of amyloid-?, which causes Alzheimer's disease and the like. The amyloid-? aggregation inhibitor is characterized by containing at least one of a peptide having an amino acid sequence of Sequence ID No. 1 or a peptide having an amino acid sequence of Sequence ID No. 2. A pharmaceutical composition for an amyloid-? aggregation disease is characterized by containing at least one of a peptide having an amino acid sequence of Sequence ID No. 1: GSGNR, and a peptide having an amino acid sequence of Sequence ID No. 2: GSGFK.

Abstract: Various side effects are reported for existing overactive bladder therapeutic drugs, and prophylactic or therapeutic agents for overactive bladder without side effects have been eagerly desired. The present invention provides a prophylactic or therapeutic agent for overactive bladder that comprises 5-aminolevulinic acids (ALAs) as the active ingredient.

Abstract: A processor module includes a first circuit substrate and a second circuit substrate each having a processor mounting area and a memory mounting area on one surface thereof. One processor is mounted in the processor mounting area, while comb-like arranged memory modules are mounted in the memory mounting area. The surface of the first circuit substrate and the surface of the second circuit substrate are combined face-to-face and positioned such that the processor mounting area and the memory mounting area of the first circuit substrate are placed face-to-face respectively with the processor mounting area and the memory mounting area of the second circuit substrate, and end parts of the plurality of comb-like arranged memory modules of the first circuit substrate and end parts of the plurality of comb-like arranged memory modules of the second circuit substrate are alternately arranged with clearances produced between adjacent memory modules.

Abstract: A processor module includes a first circuit substrate and a second circuit substrate each having a processor mounting area and a memory mounting area on one surface thereof. One processor is mounted in the processor mounting area, while comb-like arranged memory modules are mounted in the memory mounting area. The surface of the first circuit substrate and the surface of the second circuit substrate are combined face-to-face and positioned such that the processor mounting area and the memory mounting area of the first circuit substrate are placed face-to-face respectively with the processor mounting area and the memory mounting area of the second circuit substrate, and end parts of the plurality of comb-like arranged memory modules of the first circuit substrate and end parts of the plurality of comb-like arranged memory modules of the second circuit substrate are alternately arranged with clearances produced between adjacent memory modules.

Abstract: Provided is a cooling system capable of effectively avoiding generation of bubbles in the flow passage including the piping unit that climbs over the barrier upon start of the pump that has been in the stopped state. The cooling system 100 includes a cooling tank 11 filled with a coolant C, flow passages 15, 16 through which the coolant discharged from an outlet of the cooling tank 11 returns to an inlet of the cooling tank 11, an inverted U-like piping unit 16a disposed in the middle of the flow passage 16, a main pump 31, an auxiliary pump 33 disposed opposite the main pump 31 while interposing the inverted U-like piping unit 16a with the main pump 31, and a controller 35 which controls driving operations of the main pump 31 and the auxiliary pump 33. The controller 35 drives the auxiliary pump 33 for a predetermined time period before starting the main pump 31.

Abstract: Provided is a power supply unit which is immersed and directly cooled in a coolant filled in a cooling apparatus. The power supply unit includes a unit substrate, and a voltage step-down device mounted on the unit substrate. The unit substrate includes a voltage input terminal for supplying an external power supply voltage, and a voltage output terminal. The voltage output terminal is electrically connected to a voltage input terminal of an electronic device. The power supply unit is mounted on a bottom of a cooling tank of the cooling apparatus so that the electronic device is positioned at an upper part of the power supply unit upon electrical connection between the electronic device and the power supply unit, and cooled by the coolant flowing from the bottom, or flowing from another section of the cooling tank. The unit substrate may be disposed apart from the bottom so as to form a flow channel which allows passage of the coolant between one surface of the unit substrate and the bottom.

Abstract: An electronic device is immersed in a coolant filled in a cooling apparatus, and directly cooled. The electronic device is configured to be housed in a housing part of the cooling apparatus, and includes a base board, storage substrates to be arranged on at least one surface of the base board, a backplane mounted orthogonally onto the one surface of the base board, and flash storage units mounted on the respective storage substrates. The backplane includes a combination of backplane units each including a signal connector and a power connector. The signal connector and the power connector are disposed separately for each of the backplane units. The flash storage units are arranged on a surface parallel to at least one surface of each of the storage substrates so as to be adjacent one another in a width or a length direction of the flash storage unit.

Abstract: Provided is a cooling system capable of effectively avoiding generation of bubbles in the flow passage including the piping unit that climbs over the barrier upon start of the pump that has been in the stopped state. The cooling system 100 includes a cooling tank 11 filled with a coolant C, flow passages 15, 16 through which the coolant discharged from an outlet of the cooling tank 11 returns to an inlet of the cooling tank 11, an inverted U-like piping unit 16a disposed in the middle of the flow passage 16, a main pump 31, an auxiliary pump 33 disposed opposite the main pump 31 while interposing the inverted U-like piping unit 16a with the main pump 31, and a controller 35 which controls driving operations of the main pump 31 and the auxiliary pump 33. The controller 35 drives the auxiliary pump 33 for a predetermined time period before starting the main pump 31.

Abstract: A cooling system 100 for directly cooling an electronic device immersed in a coolant includes a cooling tank 11 containing the coolant C, a leakage receiving portion 21 disposed between the cooling tank 11 and a floor surface so as to receive the coolant L leaked from the cooling tank 11, an additional leakage receiving portion 22 disposed to receive the coolant L overflown from the leakage receiving portion 21 which stores the leaked coolant by a volume in excess of a predetermined volume, and a passage 25 that connects the leakage receiving portions 21 and 23 for passing the overflown coolant L by the volume in excess of the predetermined volume. The system facilitates collection of the accidentally leaked coolant, and ensures to keep the low height of the device for temporarily accumulating the leaked coolant L until it is collected.

Abstract: A set of the dies and the package are provided with a plurality of dies each including at least an accelerator core or a CPU core, an external interface, memory interfaces, and a die interface for connecting to another die. At least two dies of the set of dies include a first type die and a second type die each including both the accelerator core and the CPU core, and the core number ratio between the accelerator core and the CPU core in the first type die differs from that in the second type die. The memory interfaces include an interface conforming to TCI. The memory interfaces further include an interface conforming to HBM.

Abstract: Provided are an electronic device and a power supply unit, both of which are immersed and directly cooled in a coolant filled in a cooling apparatus. The electronic device includes a carrier substrate having a voltage input terminal for supplying a DC voltage for the electronic device, a plurality of module connectors arranged on one surface of the carrier substrate, a plurality of module substrates, a plurality of supporting plates for holding both ends of the respective module substrates, and a supporting member for supporting the carrier substrate. The voltage input terminal is electrically connected to a voltage output terminal of the power supply unit. Each of the module substrates includes a module connector plug electrically coupled to each of the module connectors.

Abstract: Provided efficiently and at low cost are: a package for core number ratios appropriate for all types of computers; and dies included in the package. This package includes at least one die provided with: at least one of a first core formed of a CPU core or a latency core and a second core formed of an accelerator core or a throughput core; an external interface; memory interfaces 24 to 26; and a die interface 23 which is connected to another die. The die includes a first type die and a second type die each including both the first core and the second core and the core number ratio between the first core and the second core in the first type die differs from that in the second type die. Moreover, the memory interfaces include an interface conforming to TCI. In addition, the memory interfaces further include an interface conforming to HBM.

Abstract: various side effects are reported for existing overactive bladder therapeutic drugs, and prophylactic or therapeutic agents for overactive bladder without side effects have been eagerly desired. The present invention provides a prophylactic or therapeutic agent for overactive bladder that comprises 5-aminolevulinic acids (ALAs) as the active ingredient.

Abstract: A processor module includes a first circuit substrate and a second circuit substrate each having a processor mounting area and a memory mounting area on one surface thereof. One processor is mounted in the processor mounting area, while comb-like arranged memory modules are mounted in the memory mounting area. The surface of the first circuit substrate and the surface of the second circuit substrate are combined face-to-face and positioned such that the processor mounting area and the memory mounting area of the first circuit substrate are placed face-to-face respectively with the processor mounting area and the memory mounting area of the second circuit substrate, and end parts of the plurality of comb-like arranged memory modules of the first circuit substrate and end parts of the plurality of comb-like arranged memory modules of the second circuit substrate are alternately arranged with clearances produced between adjacent memory modules.

Abstract: An electronic device, immersed in a coolant filled in a cooling apparatus, and directly cooled, is configured to be housed in a housing part of the cooling apparatus, and includes a pair of substrate groups that includes a first circuit board having at least one processor and main memories mounted onto one surface of the board, coprocessors, each having a housing with a rectangular cross-section, and an electric connection terminal, and a connector for electric connection between the first circuit board and the coprocessors. When each of the electric connection terminals of the coprocessors is inserted into the connector, a distance between the one surface of the first circuit board and a housing bottom surface of each of the coprocessors is longer than a height of the processor and each height of the main memories.

Abstract: An electronic device is immersed in a coolant filled in a cooling apparatus, and directly cooled. The electronic device is configured to be housed in each of housing parts of the cooling apparatus, and includes a metal board held with a pair of board retainers disposed in the housing part, one or more substrate groups attached to a first surface of the metal board and a second surface opposite the first surface, and a plurality of slots disposed above the one or more substrate groups, and arranged onto the metal board in parallel, each of which allows a power unit to be housed. The third circuit board is disposed so that the slots are interposed between the third circuit board and the metal board, and the network cable sockets are arranged in parallel on one side of the third circuit board, located at an opening side of the slots.

Abstract: A signal bridge device is provided with a plurality of bridge signal transmission/reception units, a plurality of bridge signal transmission/reception terminals, and a bridge signal distribution unit. Non-contact reception signals received by the bridge signal transmission/reception units are input into the bridge signal distribution unit. Contact reception signals received by the bridge signal transmission/reception terminals are input into the bridge signal distribution unit. The bridge signal distribution unit can output the non-contact reception signals to the bridge signal transmission/reception terminals and can output the contact reception signals to the bridge signal transmission/reception units.

Abstract: Provided is a power supply unit which is immersed and directly cooled in a coolant filled in a cooling apparatus. The power supply unit includes a unit substrate, and a voltage step-down device mounted on the unit substrate. The unit substrate includes a voltage input terminal for supplying an external power supply voltage, and a voltage output terminal. The voltage output terminal is electrically connected to a voltage input terminal of an electronic device. The power supply unit is mounted on a bottom of a cooling tank of the cooling apparatus so that the electronic device is positioned at an upper part of the power supply unit upon electrical connection between the electronic device and the power supply unit, and cooled by the coolant flowing from the bottom, or flowing from another section of the cooling tank. The unit substrate may be disposed apart from the bottom so as to form a flow channel which allows passage of the coolant between one surface of the unit substrate and the bottom.