Abstract: A gas sensor element includes a cup-shaped solid electrolyte body having closed and open ends, a reference electrode provided on an inner surface of the solid electrolyte body, and a measurement electrode provided on an outer surface of the solid electrolyte body. The reference electrode has a detection portion located closer to the closed end than to the open end of the solid electrolyte body, a terminal portion located closer to the open end than to the closed end of the solid electrode body, and a lead portion connecting the detection and terminal portions. Moreover, the reference electrode has a first thickness in a large-thickness region and a second thickness smaller than the first thickness in a small-thickness region. The large-thickness region includes at least part of the detection portion of the reference electrode, and the small-thickness region includes at least the lead and terminal portions of the reference electrode.

Abstract: A gas sensor element includes a cup-shaped solid electrolyte body having closed and open ends, a reference electrode provided on an inner surface of the solid electrolyte body, and a measurement electrode provided on an outer surface of the solid electrolyte body. The reference electrode has a detection portion located closer to the closed end than to the open end of the solid electrolyte body, a terminal portion located closer to the open end than to the closed end of the solid electrode body, and a lead portion connecting the detection and terminal portions. Moreover, the reference electrode has a first thickness in a large-thickness region and a second thickness smaller than the first thickness in a small-thickness region. The large-thickness region includes at least part of the detection portion of the reference electrode, and the small-thickness region includes at least the lead and terminal portions of the reference electrode.

Abstract: The present invention provides, as one aspect, a gas sensor element including a solid electrolytic substance having a bottomed cylindrical shape and oxygen ion conductivity, a reference electrode arranged on an inner side surface of the solid electrolytic substance, a measuring electrode arranged on an outer side surface of the solid electrolytic substance, and a protective layer which covers the outer side surface of the solid electrolytic substance together with the measuring electrode and which allows gas to be measured to pass through the protective layer, wherein an end side of the gas sensor element is formed of a leg portion whose profile line is straight on an axial cross section and a bottom portion whose profile line is curved, and the film thickness of the protective layer of the bottom portion is larger than the film thickness of the protective layer of the leg portion.

Abstract: An oxygen sensor element 1 includes: a cup-shaped solid electrolyte body 10, inside of which a reference gas chamber 13 is provided; a measuring electrode 11 that comes into contact with measured gas; and a reference electrode 12. A heater 2 is disposed inside the reference gas chamber 13. The measuring electrode 11 is formed surrounding the outer surface 101 in a tip end section 100 of the solid electrolyte body 10. The reference electrode 12 is formed in a measuring-electrode-opposing-region 102a that is a region on the inner surface 102 of the solid electrolyte body 10 opposing the measuring electrode 11 with the solid electrolyte body 10 therebetween. The area S1 of the measuring electrode 11 and the area S2 of the reference electrode 12 satisfy a relationship 0.010?S2/S1<0.723.

Abstract: The present invention provides, as one aspect, a gas sensor element including a solid electrolytic substance having a bottomed cylindrical shape and oxygen ion conductivity, a reference electrode arranged on an inner side surface of the solid electrolytic substance, a measuring electrode arranged on an outer side surface of the solid electrolytic substance, and a protective layer which covers the outer side surface of the solid electrolytic substance together with the measuring electrode and which allows gas to be measured to pass through the protective layer, wherein an end side of the gas sensor element is formed of a leg portion whose profile line is straight on an axial cross section and a bottom portion whose profile line is curved, and the film thickness of the protective layer of the bottom portion is larger than the film thickness of the protective layer of the leg portion.

Abstract: The semiconductor device includes: a semiconductor chip; a die pad for holding the semiconductor chip; a lead; and a sealing resin material for sealing the semiconductor chip, the die pad and an inner portion of the lead. The die pad has an upset portion protruding upward to form a flat face smaller in area than the semiconductor chip, and the portion of the die pad excluding the upset portion is covered with a buffer resin material smaller in elasticity than the sealing resin material.

Abstract: A semiconductor module is formed by alternately stacking resin boards and sheet members. Each of the resin boards includes first buried conductors. A semiconductor chip is mounted on the upper face of each of the resin boards. Each of the sheet members having an opening for accommodating the semiconductor chip and including second buried conductors electrically connected to the first buried conductors. A first resin board located at the bottom is thicker than second resin boards. Each of the sheet members includes an adhesive member covering the upper and side faces of the semiconductor chip.

Abstract: An imaging module is formed by stacking: a first resin board; a second resin board having a first opening; a first electrically-conductive member electrically connecting the first resin board and the second resin board to each other; a printed circuit board having a second opening; a second electrically-conductive member electrically connecting the second resin board and the printed circuit board to each other; an imaging semiconductor chip mounted on the lower surface of the second resin board to cover the first opening and provided with an imaging sensor, an optical member placed on the upper surface of the second resin board to cover the first opening; a first semiconductor control chip provided with a control device for controlling operation of the imaging sensor and mounted on the lower surface of the first resin board.

Abstract: A semiconductor module is formed by alternately stacking resin boards 3 on which semiconductor chips 2 are mounted and sheet members having openings larger than the semiconductor chips 2 and bonded to the resin boards 3. The resin board 4 located at the bottom out of the resin boards 3 is thicker than the other resin boards 3.

Abstract: A semiconductor module is formed by alternately stacking resin boards on which semiconductor chips are mounted and sheet members having openings larger than the semiconductor chips and bonded to the resin boards. One of the resin boards located at the bottom has a thickness larger than that of each of the other resin boards. First buried conductors formed in each of first resin boards are arranged to form a plurality of lines surrounding a region on which a semiconductor chip is to be mounted. The spacing between the first buried conductors increases in succession toward the outermost line. Second buried conductors formed in each of sheet members are arranged to form a plurality of lines surrounding an opening. The spacing between the second buried conductors increases in succession toward the outermost line.

Abstract: A powder filler is stuffed in a filler space defined between a housing and a gas sensing element so as to airtightly seal a clearance between the housing and the gas sensing element. The powder filler contains grains whose diameter is in a range from 80 ?m to 5,000 ?m when measured before being stuffed into the filler space. A weight percentage of the grains having the diameter of 80 ?m to 5,000 ?m is equal to or larger than 80% with respect to an overall weight of the powder filler.

Abstract: A semiconductor module is formed by alternately stacking resin boards on which semiconductor chips are mounted and sheet members having openings larger than the semiconductor chips and bonded to the resin boards. One of the resin boards located at the bottom has a thickness larger than that of each of the other resin boards. First buried conductors formed in each of first resin boards are arranged to form a plurality of lines surrounding a region on which a semiconductor chip is to be mounted. The spacing between the first buried conductors increases in succession toward the outermost line. Second buried conductors formed in each of sheet members are arranged to form a plurality of lines surrounding an opening. The spacing between the second buried conductors increases in succession toward the outermost line.

Abstract: A lead frame is provided. Although there is a die pad (2) located to deviate from a main plane center line of a resin molding area (10), a die pad connecting portion (6) is located to deviate from the main plane center line of the resin molding area in a direction opposite to the deviation direction of the deviated die pad (2), so that it is possible to reduce a Z-directional vertical variation of the die pad in processes. Accordingly, it is possible to prevent resin molding defects such as package bending, voids, failure of resin filling, wire disconnection, exposure of semiconductor chips, and exposure of die pads.

Abstract: A gas sensor has a sensor element inserted in a cylindrical housing. A measured gas cover, provided at a distal end side of the housing, forms a measured gas environment at a distal end side of the sensor element. An atmospheric air cover, provided at a proximal end side of the housing, forms an atmospheric air environment at a proximal end side of the sensor element. A clearance between an inside surface of the housing and an outside surface of the sensor element is gastightly sealed with a sealing member including a plurality of powder filler layers to separate or isolate the measured gas environment from the atmospheric air environment.

Abstract: A semiconductor module is formed by alternately stacking resin boards and sheet members. Each of the resin boards includes first buried conductors. A semiconductor chip is mounted on the upper face of each of the resin boards. Each of the sheet members having an opening for accommodating the semiconductor chip and including second buried conductors electrically connected to the first buried conductors. A first resin board located at the bottom is thicker than second resin boards. Each of the sheet members includes an adhesive member covering the upper and side faces of the semiconductor chip.

Abstract: A lead frame is provided. Although there is a die pad (2) located to deviate from a main plane center line of a resin molding area (10), a die pad connecting portion (6) is located to deviate from the main plane center line of the resin molding area in a direction opposite to the deviation direction of the deviated die pad (2), so that it is possible to reduce a Z-directional vertical variation of the die pad in processes. Accordingly, it is possible to prevent resin molding defects such as package bending, voids, failure of resin filling, wire disconnection, exposure of semiconductor chips, and exposure of die pads.

Abstract: An imaging module is formed by stacking: a first resin board; a second resin board having a first opening; a first electrically-conductive member electrically connecting the first resin board and the second resin board to each other; a printed circuit board having a second opening; a second electrically-conductive member electrically connecting the second resin board and the printed circuit board to each other; an imaging semiconductor chip mounted on the lower surface of the second resin board to cover the first opening and provided with an imaging sensor, an optical member placed on the upper surface of the second resin board to cover the first opening; a first semiconductor control chip provided with a control device for controlling operation of the imaging sensor and mounted on the lower surface of the first resin board.

Abstract: A semiconductor module is formed by alternately stacking resin boards on which semiconductor chips are mounted and sheet members having openings larger than the semiconductor chips and bonded to the resin boards. One of the resin boards located at the bottom has a thickness larger than that of each of the other resin boards. First buried conductors formed in each of first resin boards are arranged to form a plurality of lines surrounding a region on which a semiconductor chip is to be mounted. The spacing between the first buried conductors increases in succession toward the outermost line. Second buried conductors formed in each of sheet members are arranged to form a plurality of lines surrounding an opening. The spacing between the second buried conductors increases in succession toward the outermost line.

Abstract: A semiconductor module is formed by alternately stacking resin boards 3 on which semiconductor chips 2 are mounted and sheet members having openings larger than the semiconductor chips 2 and bonded to the resin boards 3. The resin board 4 located at the bottom out of the resin boards 3 is thicker than the other resin boards 3.

Abstract: A multi-level semiconductor module according to the present invention is formed by alternately stacking resin boards and sheet members. Each of the resin boards is provided with a semiconductor device. The module includes: a rigid plate provided on one of the sheet members located at the top and having a heat dissipation efficiency higher than those of the resin boards and the sheet members; and a through buried conductor penetrating the resin boards and the sheet members and being in contact with the rigid plate.