Patents by Inventor Motohide Sasaki

Motohide Sasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flux, resin flux cored solder, and solder paste
    Patent number: 11541485
    Abstract: A flux according to the present invention includes a phosphine oxide. It is thereby possible to provide a flux capable of improving solder wettability, a resin flux cored solder including the flux, and a solder paste including the flux.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: January 3, 2023
    Assignee: KOKI Company Limited
    Inventors: Kazuhiro Yukikata, Motohide Sasaki
  • Flux and solder composition
    Patent number: 11407069
    Abstract: A flux containing terpene phenolic resin and having an acid value of 120 mgKOH/g or more is provided. The acid value can be 250 mgKOH/g or less. The terpene phenolic resin can be contained by 0.05 mass % or more and 30 mass % or less. The flux can contain the terpene phenolic resin and another resin component as a rosin component, and an amount of the terpene phenolic resin contained in the rosin component can be 0.1 mass % or more and 80 mass % or less.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: August 9, 2022
    Assignee: KOKI COMPANY LIMITED
    Inventors: Yuri Misumi, Takeshi Yahagi, Motohide Sasaki, Tatsuya Baba, Kazuma Karube
  • Solder paste containing solder powder and flux
    Patent number: 10933495
    Abstract: Provided is a flux that contains at least one of an amine compound containing at least one acetylated amino group and an amino acid compound containing at least one acetylated amino group, as an activator.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: March 2, 2021
    Assignee: KOKI COMPANY LIMITED
    Inventors: Motohide Sasaki, Takeshi Yahagi, Noriyoshi Uchida
  • FLUX, RESIN FLUX CORED SOLDER, AND SOLDER PASTE
    Publication number: 20200114477
    Abstract: A flux according to the present invention includes a phosphine oxide. It is thereby possible to provide a flux capable of improving solder wettability, a resin flux cored solder including the flux, and a solder paste including the flux.
    Type: Application
    Filed: June 29, 2018
    Publication date: April 16, 2020
    Inventors: Kazuhiro YUKIKATA, Motohide SASAKI
  • Flux and Solder Composition
    Publication number: 20200094354
    Abstract: A flux containing terpene phenolic resin and having an acid value of 120 mgKOH/g or more is provided. The acid value can be 250 mgKOH/g or less. The terpene phenolic resin can be contained by 0.05 mass % or more and 30 mass % or less. The flux can contain the terpene phenolic resin and another resin component as a rosin component, and an amount of the terpene phenolic resin contained in the rosin component can be 0.1 mass % or more and 80 mass % or less.
    Type: Application
    Filed: January 15, 2018
    Publication date: March 26, 2020
    Inventors: Yuri Misumi, Takeshi Yahagi, Motohide Sasaki, Tatsuya Baba, Kazuma Karube
  • Flux and Solder Composition
    Publication number: 20180147675
    Abstract: Provided is a flux that contains at least one of an amine compound containing at least one acetylated amino group and an amino acid compound containing at least one acetylated amino group, as an activator.
    Type: Application
    Filed: October 25, 2016
    Publication date: May 31, 2018
    Inventors: Motohide Sasaki, Takeshi Yahagi, Noriyoshi Uchida