Abstract: A substrate is made of resin or a composite material. Pins with Au plating on their surface are soldered, with a soldering material made of Sn and Sb, to a substrate body having a first main surface, and formed into substantially a rectangular shape to project over the first main surface of the substrate body. Wettability of the soldering material for securing the pins and the substrate body is relatively low as compared with that of a Pb—Sn soldering material. Therefore, the height of upward movement of the soldering material along the pin can be reduced. Thus, the pins can be deeply inserted into socket so that the gap between the first main surface of the substrate body and the upper surface of the socket is reduced. As a result, the overall height realized the substrate made of resin has been joined to the socket can be reduced.

Abstract: A resin substrate is made of resin or a composite material containing resin. Pins each having the surface, on which Au plating is formed, are, with a soldering material made of Sn and Sb, soldered to a substrate body having a first main surface and formed into substantially a rectangular shape to project over the first main surface 2A of the substrate body. Wettability of the soldering material for securing the pins and the substrate body to one another is relatively low as compared with that of a Pb—Sn soldering material. Therefore, the height of upward movement of the soldering material along the pin can be reduced. Hence it follows that the pins can sufficiently deeply be inserted into the socket so that the gap between the first main surface of the substrate body and the upper surface of the socket is reduced.

Abstract: A printed circuit board includes a number of ball-shaped terminals provided on one main surface of the board. Each of the ball-shaped terminals includes a metallic ball brazed on a pad provided on the main surface of the board. A thin gold layer is deposited by plating on the surface of the metallic ball.

Abstract: A resin substrate is made of resin or a composite material containing resin. Pins each having the surface, on which Au plating is formed, are, with a soldering material made of Sn and Sb, soldered to a substrate body having a first main surface and formed into substantially a rectangular shape to project over the first main surface 2A of the substrate body. Wettability of the soldering material for securing the pins and the substrate body to one another is relatively low as compared with that of a Pb—Sn soldering material. Therefore, the height of upward movement of the soldering material along the pin can be reduced. Hence it follows that the pins can sufficiently deeply be inserted into the socket so that the gap between the first main surface of the substrate body and the upper surface of the socket is reduced.

Abstract: A resin substrate is made of resin or a composite material containing resin. Pins each having the surface, on which Au plating is formed, are, with a soldering material made of Sn and Sb, soldered to a substrate body having a first main surface and formed into substantially a rectangular shape to project over the first main surface 2A of the substrate body. Wettability of the soldering material for securing the pins and the substrate body to one another is relatively low as compared with that of a Pb—Sn soldering material. Therefore, the height of upward movement of the soldering material along the pin can be reduced. Hence it follows that the pins can sufficiently deeply be inserted into the socket so that the gap between the first main surface of the substrate body and the upper surface of the socket is reduced.

Abstract: A method of making a laminate ceramic substrate with domed pads is provided. In the method, a ceramic green sheet is prepared which has a pair of first and second opposite main surfaces and a plurality of through holes extending between the first and second main surfaces. The ceramic green sheet is placed upon a flat elastic sheet in such a manner that the first main surface of the ceramic green sheet is in contact with the flat elastic sheet. Metallizing ink is filled into the through hole so that a portion of the ink protrudes beyond the first main surface to form domed protruded portions by elastic deformation of the elastic sheet. The green sheet (optionally placed upon at least one other green sheet in such a manner that the second main surface is in contact with the other green sheet) is then sintered, thereby forming the domed, protruded portions of the metallizing ink into domed pads.

Abstract: A ceramic substrate having on the surface thereof a plurality of pads to be attached to terminal members is provided. Each pad includes a metallic layer formed on the surface of the substrate and a connecting layer made of a nickel base alloy and formed on the metallic layer. A gold-nickel layer made of a gold base alloy containing nickel is formed on the connecting layer. The gold-nickel layer may be formed by first forming a gold layer on the connecting layer and then making nickel in the connecting layer to diffuse into the gold layer by heat treatment. A method of producing such a ceramic substrate is also provided.