Abstract: A base material for a printed circuit board includes: an insulating base film; and a sintered body layer of metal particles layered on one side surface of the base film; wherein an arithmetic mean roughness (Sa) of a surface of the sintered body layer that is opposite to the base film is greater than or equal to 0.005 ?m and less than or equal to 0.10 ?m.

Abstract: A method of manufacturing a copper nano-ink includes: a step of preparing a copper nanoparticle aqueous dispersion liquid including copper nanoparticles and anions; and a step of storing the copper nanoparticle aqueous dispersion liquid at 5° C. or less after the step of preparing, wherein in the step of storing, a copper ion concentration of the copper nanoparticle aqueous dispersion liquid is controlled to be greater than or equal to 0.1 g/L and less than or equal to 1.0 g/L and an anion concentration is controlled to be greater than or equal to 0.5 g/L and less than or equal to 8.0 g/L.

Abstract: A method for manufacturing a dielectric sheet, includes the steps of extrusion molding a mixture including powder polytetrafluoroethylene and spherical silica at a temperature lower than or equal to a melting point of the polytetrafluoroethylene, and calendering a sheet body obtained by the extrusion molding. A mass ratio of the silica with respect to the polytetrafluoroethylene is 1.3 or greater. An average particle diameter of the silica is 0.1 ?m or greater but 3.0 ?m or less. A reduction ratio of the extrusion molding is 8 or less.

Abstract: A method of manufacturing a copper nano-ink includes: a step of preparing a copper nanoparticle aqueous dispersion liquid including copper nanoparticles and anions; and a step of storing the copper nanoparticle aqueous dispersion liquid at 5° C. or less after the step of preparing, wherein in the step of storing, a copper ion concentration of the copper nanoparticle aqueous dispersion liquid is controlled to be greater than or equal to 0.1 g/L and less than or equal to 1.0 g/L and an anion concentration is controlled to be greater than or equal to 0.5 g/L and less than or equal to 8.0 g/L.

Abstract: According to the present invention, a base material for a printed circuit board includes: an insulating base film; and a metal layer that is layered on at least one surface of the base film and that includes copper as a main component, wherein in a content per unit area in a region of 100 nm or less from an interface of the metal layer with the base film, Cr<0.1 mg/m2, and Ni<0.1 mg/m2, wherein an arithmetic mean roughness (Sa) of the surface of the base film on which the metal layer is layered is less than 0.10 ?m.

Abstract: The base material for printed circuit board according to one aspect of the present disclosure is a base material for printed circuit board comprising a base film having an insulating property, a sintering layer inducing a plurality of copper particles and formed on at least one surface of the base film and an electroless copper plating layer formed on a surface of the sintering layer, the surface being on an opposite side to the base film, and filled in the sintering layer, and wherein a lightness L* of a surface of the electroless copper plating layer, the surface being on an opposite side to the sintering layer, is 45.0 or more and 85.0 or less, a chromaticity a* thereof is 5.0 or more and 25.0 or less, and a chromaticity b* thereof is 5.0 or more and 25.0 or less.

Abstract: According to the present invention, a base material for a printed circuit board includes: an insulating base film; and a metal layer that is layered on at least one surface of the base film and that includes copper as a main component, wherein in a content per unit area in a region of 100 nm or less from an interface of the metal layer with the base film, Cr<0.1 mg/m2, and Ni<0.1 mg/m2, wherein an arithmetic mean roughness (Sa) of the surface of the base film on which the metal layer is layered is less than 0.10 ?m.

Abstract: According to one aspect of the present disclosure, a method of manufacturing a substrate for a printed circuit board, including an insulating base film and a metal layer that is layered on at least one surface side of the base film, includes: an application step of applying, to the at least one surface side of the base film, a dispersion liquid containing fine metal particles; a drying step of drying a coating film of the applied dispersion liquid; a sintering step of sintering the dried coating film by a far-infrared heater under a low oxygen atmosphere with an oxygen concentration of 600 ppm by volume or less; and a cooling step of cooling a layered structure of the sintered coating film and the base film under a low oxygen atmosphere with an oxygen concentration of 600 ppm by volume or less.

Abstract: A base material for a printed circuit board includes: an insulating base film; and a sintered body layer of metal particles layered on one side surface of the base film; wherein an arithmetic mean roughness (Sa) of a surface of the sintered body layer that is opposite to the base film is greater than or equal to 0.005 ?m and less than or equal to 0.10 ?m.

Abstract: A coating liquid for forming a conductive layer according to the present invention is a coating liquid for forming a conductive layer, the coating liquid containing fine metal particles, a dispersant, and a dispersion medium. In the coating liquid for forming a conductive layer, the fine metal particles contain copper or a copper alloy as a main component, the dispersant is a polyethyleneimine-polyethylene oxide graft copolymer, a polyethyleneimine moiety in the graft copolymer has a weight-average molecular weight of 300 or more and 1,000 or less, a molar ratio of polyethylene oxide chains to nitrogen atoms in the polyethyleneimine moiety is 10 or more and 50 or less, and the graft copolymer has a weight-average molecular weight of 3,000 or more and 54,000 or less.

Abstract: According to one aspect of the present disclosure, a base material for a printed circuit board includes: an insulating base film; a sintered body layer that is layered on at least one surface of the base film and that is formed of a plurality of sintered metal particles; and an electroless plating layer that is layered on a surface of the sintered body layer that is opposite to the base film, wherein an area rate of sintered bodies of the metal particles in a cross section of the sintered body layer is greater than or equal to 50% and less than or equal to 90%.

Abstract: A powder for a conductive material according to an embodiment of the present invention includes a large number of particles that contain copper as a main component and having an average primary particle diameter of 1 nm or more and 200 nm or less. The particles contain titanium on surfaces or inside thereof, and a content of the titanium is 0.003 atomic percent or more and 0.5 atomic percent or less.

Abstract: A coating liquid for forming a conductive layer according to the present invention is a coating liquid for forming a conductive layer, the coating liquid containing fine metal particles, a dispersant, and a dispersion medium. In the coating liquid for forming a conductive layer, the fine metal particles contain copper or a copper alloy as a main component, the dispersant is a polyethyleneimine-polyethylene oxide graft copolymer, a polyethyleneimine moiety in the graft copolymer has a weight-average molecular weight of 300 or more and 1,000 or less, a molar ratio of polyethylene oxide chains to nitrogen atoms in the polyethyleneimine moiety is 10 or more and 50 or less, and the graft copolymer has a weight-average molecular weight of 3,000 or more and 54,000 or less.

Abstract: A powder for a conductive material according to an embodiment of the present invention includes a large number of particles that contain copper as a main component and having an average primary particle diameter of 1 nm or more and 200 nm or less. The particles contain titanium on surfaces or inside thereof, and a content of the titanium is 0.003 atomic percent or more and 0.5 atomic percent or less.

Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a metal layer formed on at least one surface side of the base film. In the substrate for a printed circuit board, a plurality of fine particles are disposed between the base film and the metal layer, and the fine particles are formed of a metal the same as a main metal of the metal layer or formed of a metal compound of the main metal. The fine particles preferably have an average particle size of 0.1 nm or more and 20 nm or less. The fine particles are preferably formed of a metal oxide or a metal hydroxide. The fine particles are preferably present between the base film and the metal layer so as to form a layer. The metal layer preferably includes a metal grain layer formed by firing metal nanoparticles.

Abstract: A coating liquid for forming a conductive layer according to an embodiment of the present invention contains fine metal particles, a dispersion medium, and a dispersant. The coating liquid has a pH of 4 or more and 8 or less, an electrical conductivity of 100 ?S/cm or more and 800 ?S/cm or less, and a content of the fine metal particles of 20% by mass or more and 80% by mass or less. A method for manufacturing a conductive layer according to another embodiment of the present invention is a method for manufacturing a conductive layer using a coating liquid for forming a conductive layer, the coating liquid containing fine metal particles, a dispersion medium, and a dispersant. The method includes an application step of applying the coating liquid for forming a conductive layer, and a heating step of heating the coating liquid for forming a conductive layer after application.

Abstract: A method for manufacturing a titanium trichloride solution according to an embodiment of the present invention is a method for manufacturing a titanium trichloride solution, the method including reducing titanium tetrachloride in an electrolyte solution by using an ion-exchange electrolytic reduction method. In the method, an aqueous solution containing sulfate ions is used as an electrolyte solution on the anode side. A device for manufacturing a titanium trichloride solution according to another embodiment of the present invention is a device for manufacturing a titanium trichloride solution by electrolytic reduction of titanium tetrachloride in an aqueous solution.

Abstract: A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a metal layer formed on at least one surface side of the base film. In the substrate for a printed circuit board, a plurality of fine particles are disposed between the base film and the metal layer, and the fine particles are formed of a metal the same as a main metal of the metal layer or formed of a metal compound of the main metal. The fine particles preferably have an average particle size of 0.1 nm or more and 20 nm or less. The fine particles are preferably formed of a metal oxide or a metal hydroxide. The fine particles are preferably present between the base film and the metal layer so as to form a layer. The metal layer preferably includes a metal grain layer formed by firing metal nanoparticles.

Abstract: A metal nanoparticle dispersion for forming a metal coating film by application and sintering contains metal nanoparticles having an average particle size of 200 nm or less and a solvent used to disperse the metal nanoparticles. The metal nanoparticle dispersion further contains a water soluble resin. The amount of the water soluble resin contained is preferably 0.1 parts by mass or more and 10 parts by mass or less per 100 parts by mass of the metal nanoparticles.