Patents by Inventor Motohiro Enokida

Motohiro Enokida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6383583
    Abstract: A laminate having a layer structure of A/C/B/C/D, which is obtained by coextruding a saponified ethylene-vinyl acetate copolymer (B) and an adhesive resin (C) on one side of a polypropylene film (A) oriented at least uniaxially, to give a laminate having a layer structure of A/C/B/C, stretching this laminate in the transverse direction, and laminating a heat sealing layer (D) on a surface of the adhesive resin (C) of the laminate, and a production method thereof. The laminate of the present invention is superior in gas barrier property, moisture proof, aromatic proof and the like under particularly high humidity, and particularly when formed into a packaging bag, the packing bag shows superior sealing performance and appearance. Hence, the laminate of the present invention is useful for various packaging applications and as a packaging bag and the like for food and pharmaceutical preparations.
    Type: Grant
    Filed: September 30, 1999
    Date of Patent: May 7, 2002
    Assignees: Nippon Synthetic Chemical Industry Co., Ltd., Futamura Chemical Industries Co., Ltd.
    Inventors: Kenji Ninomiya, Tomoyuki Yamamoto, Motohiro Enokida