Abstract: A probe apparatus 10 comprises a probe card 13, a main chuck 12, an X-stage 14 and a Y-stage 15. A vertical drive mechanism 18 is provided such that an extension line from a center for inspection of the probe card 13 coincides with an axis of the vertical drive mechanism. A static-pressure thrust air bearing 19, which is coaxial with the vertical drive mechanism 18 and vertically drives a main chuck 12, is provided as a vertically movable member. A gap-maintaining means 23 is provided to maintain a gap at a constant size between the static thrust air bearing 19 and the main chuck 12.

Abstract: An electrical inspecting apparatus includes an apparatus body having a housing section for housing a cassette in which a plurality of wafers are housed, an inspecting section provided with probes for applying an electrical inspection to the wafer, and a transfer section provided with a transfer arm for transferring the wafer between the housing section and the inspecting section. The housing section, inspecting section and transfer section are arranged side by side within the apparatus body, fan filters are mounted on the apparatus body for blowing air in a lateral direction through the housing section, inspecting section and transfer section, and an exhaust duct is mounted on the apparatus body for discharging the air flowing through the sections to the outside of the apparatus body.

Abstract: A probe system tests the electrical characteristics of chips arranged in a matrix on a semiconductor wafer. An XYZ stage movable in the directions of three-dimensional axes is disposed under a probe card having probes to be brought into contact with the electrode pads of the chips. A wafer table rotatable within a horizontal plane is disposed on the XYZ stage. A first image pickup means for picking up the probe images is mounted on the XYZ stage. A second image pickup means for picking up a wafer image is disposed above the table. The second image pickup means is movable horizontally to and from a use position under the probe card. A target is supported and moved by a driving member mounted on the XYZ stage, for aligning the focal points and optical axes of the first and second image pickup means. The target is moved between forward and retreat positions within and outside the field of view of the first image pickup means.

Abstract: A probe system tests the electrical characteristics of chips arranged in a matrix on a semiconductor wafer. An XYZ stage movable in the directions of three-dimensional axes is disposed under a probe card having probes to be brought into contact with the electrode pads of the chips. A wafer table rotatable within a horizontal plane is disposed on the XYZ stage. A first image pickup means for picking up the probe images is mounted on the XYZ stage. A second image pickup means for picking up a wafer image is disposed above the table. The second image pickup means is movable horizontally to and from a use position under the probe card. A target is supported and moved by a driving member mounted on the XYZ stage, for aligning the focal points and optical axes of the first and second image pickup means. The target is moved between forward and retreat positions within and outside the field of view of the first image pickup means.