Patents by Inventor Motohiro NEGISHI

Motohiro NEGISHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11890681
    Abstract: An embodiment of the present invention provides a method for producing a bonded object. The method comprises a step for preparing a laminate in which a first member, a copper bonding paste, and a second member are laminated in order and a step for sintering the copper bonding paste under a pressure of 0.1-1 MPa. The copper bonding paste contains metal particles and a dispersion medium, wherein the content of metal particles is at 50 mass % or more with respect to the total mass of the copper bonding paste, and the metal particles contain 95 mass % or more of submicro copper particles with respect to the total mass of the metal particles.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: February 6, 2024
    Assignee: RESONAC CORPORATION
    Inventors: Yuki Kawana, Hideo Nakako, Motohiro Negishi, Chie Sugama, Yoshinori Ejiri, Yuichi Yanaka
  • Patent number: 11887960
    Abstract: This member connection method includes a printing step. In the printing step, a coating film-formed region in which the coating film is formed, and a coating film non-formed region in which the coating film is not formed are formed in the print pattern, and the coating film-formed region is divided into a plurality of concentric regions and a plurality of radial regions by means of a plurality of line-shaped regions provided so as to connect various points, which are separated apart from one another in the marginal part of the connection region.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: January 30, 2024
    Assignee: RESONAC CORPORATION
    Inventors: Motohiro Negishi, Hideo Nakako, Yuki Kawana, Dai Ishikawa, Chie Sugama, Yoshinori Ejiri
  • Patent number: 11575076
    Abstract: A method for manufacturing a thermoelectric conversion module of the present invention is a method for manufacturing a thermoelectric conversion module including a thermoelectric semiconductor part in which a plurality of p-type semiconductors and a plurality of n-type semiconductors are alternately arranged, and a high temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a high temperature heat source side and a low temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a low temperature heat source side, which electrically connect the p-type semiconductor and the n-type semiconductor adjacent to each other in series, and includes a binding step of binding at least one of the high temperature side electrode and the low temperature side electrode, and the p-type semiconductor and the n-type semiconductor together, by sintering a binding layer containing metal particles, which is provided bet
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: February 7, 2023
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Motohiro Negishi, Yuki Kawana, Dai Ishikawa, Chie Sugama, Hideo Nakako, Yoshinori Ejiri
  • Publication number: 20220371087
    Abstract: A copper paste for joining contains metal particles and a dispersion medium, in which the copper paste for joining contains copper particles as the metal particles, and the copper paste for joining contains dihydroterpineol as the dispersion medium. A method for manufacturing a joined body is a method for manufacturing a joined body which includes a first member, a second member, and a joining portion that joins the first member and the second member, the method including: a first step of printing the above-described copper paste for joining to at least one joining surface of the first member and the second member to prepare a laminate having a laminate structure in which the first member, the copper paste for joining, and the second member are laminated in this order; and a second step of sintering the copper paste for joining of the laminate.
    Type: Application
    Filed: September 30, 2019
    Publication date: November 24, 2022
    Inventors: Motohiro NEGISHI, Hideo NAKAKO, Michiko NATORI, Dai ISHIKAWA, Chie SUGAMA, Yuki KAWANA
  • Patent number: 11483936
    Abstract: Provided is a method for producing a joined body, the method including a first step of preparing a laminated body which includes a first member having a metal pillar provided on a surface thereof, a second member having an electrode pad provided on a surface thereof, and a joining material provided between the metal pillar and the electrode pad and containing metal particles and an organic compound, and a second step of heating the laminated body to sinter the joining material at a predetermined sintering temperature, in which the joining material satisfies the condition of the following Formula (I): (M1?M2)/M1×100?1.0??(I) [in Formula (I), M1 represents a mass of the joining material when a temperature of the joining material reaches the sintering temperature in the second step, and M2 represents a non-volatile content in the joining material.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: October 25, 2022
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Hideo Nakako, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama, Yuki Kawana, Motohiro Negishi, Yuichi Yanaka
  • Patent number: 11462502
    Abstract: Provided is a metal paste for joints, containing: metal particles; and linear or branched monovalent aliphatic alcohol having 1 to 20 carbon atoms, in which the metal particles include sub-micro copper particles having a volume average particle diameter of 0.12 ?m to 0.8 ?M.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: October 4, 2022
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Yuki Kawana, Hideo Nakako, Motohiro Negishi, Dai Ishikawa, Chie Sugama, Yoshinori Ejiri
  • Patent number: 11370066
    Abstract: Provided is A metal paste for joints, containing: metal particles; and monovalent carboxylic acid having 1 to 9 carbon atoms, in which the metal particles include sub-micro copper particles having a volume average particle diameter of 0.12 ?m to 0.8 ?m, and a content of the monovalent carboxylic acid having 1 to 9 carbon atoms is 0.015 part by mass to 0.2 part by mass with respect to 100 parts by mass of the metal particles.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: June 28, 2022
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Yuki Kawana, Hideo Nakako, Motohiro Negishi, Dai Ishikawa, Chie Sugama, Yoshinori Ejiri
  • Publication number: 20220028824
    Abstract: An embodiment of the present invention provides a method for producing a bonded object. The method comprises a step for preparing a laminate in which a first member, a copper bonding paste, and a second member are laminated in order and a step for sintering the copper bonding paste under a pressure of 0.1-1 MPa. The copper bonding paste contains metal particles and a dispersion medium, wherein the content of metal particles is at 50 mass % or more with respect to the total mass of the copper bonding paste, and the metal particles contain 95 mass % or more of submicro copper particles with respect to the total mass of the metal particles.
    Type: Application
    Filed: November 29, 2018
    Publication date: January 27, 2022
    Applicant: Showa Denko Materials Co., Ltd.
    Inventors: Yuki KAWANA, Hideo NAKAKO, Motohiro NEGISHI, Chie SUGAMA, Yoshinori EJIRI, Yuichi YANAKA
  • Publication number: 20210351157
    Abstract: This member connection method includes a printing step. In the printing step, a coating film-formed region in which the coating film is formed, and a coating film non-formed region in which the coating film is not formed are formed in the print pattern, and the coating film-formed region is divided into a plurality of concentric regions and a plurality of radial regions by means of a plurality of line-shaped regions provided so as to connect various points, which are separated apart from one another in the marginal part of the connection region.
    Type: Application
    Filed: October 23, 2018
    Publication date: November 11, 2021
    Inventors: Motohiro NEGISHI, Hideo NAKAKO, Yuki KAWANA, Dai ISHIKAWA, Chie SUGAMA, Yoshinori EJIRI
  • Publication number: 20200344893
    Abstract: Provided is a method for producing a joined body, the method including a first step of preparing a laminated body which includes a first member having a metal pillar provided on a surface thereof, a second member having an electrode pad provided on a surface thereof, and a joining material provided between the metal pillar and the electrode pad and containing metal particles and an organic compound, and a second step of heating the laminated body to sinter the joining material at a predetermined sintering temperature, in which the joining material satisfies the condition of the following Formula (I): (M1?M2)/M1×100?1.0??(I) [in Formula (I), M1 represents a mass of the joining material when a temperature of the joining material reaches the sintering temperature in the second step, and M2 represents a non-volatile content in the joining material.
    Type: Application
    Filed: November 8, 2018
    Publication date: October 29, 2020
    Inventors: Hideo NAKAKO, Yoshinori EJIRI, Dai ISHIKAWA, Chie SUGAMA, Yuki KAWANA, Motohiro NEGISHI, Yuichi YANAKA
  • Publication number: 20200295248
    Abstract: A method for manufacturing a thermoelectric conversion module of the present invention is a method for manufacturing a thermoelectric conversion module including a thermoelectric semiconductor part in which a plurality of p-type semiconductors and a plurality of n-type semiconductors are alternately arranged, and a high temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a high temperature heat source side and a low temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a low temperature heat source side, which electrically connect the p-type semiconductor and the n-type semiconductor adjacent to each other in series, and includes a binding step of binding at least one of the high temperature side electrode and the low temperature side electrode, and the p-type semiconductor and the n-type semiconductor together, by sintering a binding layer containing metal particles, which is provided bet
    Type: Application
    Filed: October 24, 2018
    Publication date: September 17, 2020
    Inventors: Motohiro NEGISHI, Yuki KAWANA, Dai ISHIKAWA, Chie SUGAMA, Hideo NAKAKO, Yoshinori EJIRI
  • Publication number: 20200130109
    Abstract: Provided is A metal paste for joints, containing: metal particles; and monovalent carboxylic acid having 1 to 9 carbon atoms, in which the metal particles include sub-micro copper particles having a volume average particle diameter of 0.12 ?m to 0.8 ?m, and a content of the monovalent carboxylic acid having 1 to 9 carbon atoms is 0.015 part by mass to 0.2 part by mass with respect to 100 parts by mass of the metal particles.
    Type: Application
    Filed: January 18, 2018
    Publication date: April 30, 2020
    Inventors: Yuki KAWANA, Hideo NAKAKO, Motohiro NEGISHI, Dai ISHIKAWA, Chie SUGAMA, Yoshinori EJIRI
  • Publication number: 20200075528
    Abstract: Provided is a metal paste for joints, containing: metal particles; and linear or branched monovalent aliphatic alcohol having 1 to 20 carbon atoms, in which the metal particles include sub-micro copper particles having a volume average particle diameter of 0.12 ?m to 0.8 ?M.
    Type: Application
    Filed: January 18, 2018
    Publication date: March 5, 2020
    Inventors: Yuki KAWANA, Hideo NAKAKO, Motohiro NEGISHI, Dai ISHIKAWA, Chie SUGAMA, Yoshinori EJIRI
  • Publication number: 20160293820
    Abstract: There is provided a thermoelectric conversion element and a thermoelectric conversion module capable of ensuring a temperature difference between the front and the rear of the thermoelectric conversion element even in a high-temperature environment and presenting a high power generation performance. The thermoelectric conversion element including a sintered body constitutes a crystal grain laminated in a transverse direction in which a length in a longitudinal direction of the crystal grain is longer than a length in the transverse direction using at least some of crystal grains constituting the sintered body.
    Type: Application
    Filed: July 2, 2015
    Publication date: October 6, 2016
    Applicant: Hitachi Chemical Company, Ltd.
    Inventors: Tomotake TOHEI, Shinichi FUJIWARA, Etsuko TAKANE, Zenzou ISHIJIMA, Takahiro JINUSHI, Motohiro NEGISHI