Abstract: In a cylinder having a piston 2 and a cylinder body 3 having a piston chamber 4 in which said piston 2 is slidably accommodated, a guide shaft 9 extending toward the piston chamber 4 is provided on a head-side end wall 8 of the cylinder body 3, and the piston 2 includes a guide hole 2c in which the guide shaft 9 is accommodated. A plurality of grooves 9a and 2d respectively extending in axial directions are provided between an outer peripheral surface of the guide shaft 9 and an inner peripheral surface of the guide hole 2c. A plurality of steel balls 13 are provided between the grooves 9a and 2d.

Abstract: A plurality of connecting members are provided to a tool adaptor to which a tool is mounted, a plurality of connecting jaw members having inclined faces which are engaged with and detached from the connecting members when the connecting jaw members are displaced in radial directions, a rod that expands and contracts due to operation of air pressure, and a cam-type converting mechanism for converting the expanding/contracting operation of the rod to operations of displacement of the jaw members are provided to a mounting unit mounted to a robot hand, and a stopper portion for preventing the connecting member from being detached and falling from the inclined face when the air pressure reduces is provided to each the jaw member.

Abstract: In a cylinder having a piston 2 and a cylinder body 3 having a piston chamber 4 in which said piston 2 is slidably accommodated, a guide shaft 9 extending toward the piston chamber 4 is provided on a head-side end wall 8 of the cylinder body 3, and the piston 2 includes a guide hole 2c in which the guide shaft 9 is accommodated. A plurality of grooves 9a and 2d respectively extending in axial directions are provided between an outer peripheral surface of the guide shaft 9 and an inner peripheral surface of the guide hole 2c. A plurality of steel balls 13 are provided between the grooves 9a and 2d.

Abstract: An electronic computer cooling system having a cooling apparatus to cool an electronic computer and cooling members for thermally connecting semiconductor devices whose operating speeds are raised by cooling to a low temperature source of the cooling apparatus. Circuit boards onto which the semiconductor devices and the like constructing the electronic computer are mounted and the cooling apparatus such as a refrigerating apparatus and the like are compactly enclosed in a single casing. Or, the circuit boards and the cooling apparatus are compactly enclosed in separate detachable casings, respectively. Thus, a structure in which desired semiconductor devices can be certainly cooled by using the cooling members is obtained.

Abstract: A cooling apparatus for an electronic device of high calorific density including an elastomer interposed between a semiconductor chip and a heat sink so as to connect them thermally. The elastomer may also be in close contact with a large number of semiconductor chips having various configurations which are mounted on a board, so that the elastomer is thermally connected with them, whereby the elastomer absorbs thermal deformations.

Abstract: A semiconductor cooling unit for directly jetting a cooling medium against surfaces of semiconductor devices for use in a high-speed computer or the like to effectively remove heat from the semiconductor devices, in which partition members for partitioning a space into regions where semiconductor devices are placed. Each partitioned region has an opening at its ceiling side, and a pipe for supplying or discharging the cooling medium through the opening is disposed so as to project toward a central portion of the back surface of each semiconductor device. This pipe is utilized to also section a cooling medium supply header or a cooling medium return header so that bubbles generated from the semiconductor device surfaces can be smoothly removed, and so that the cooling medium can flow smoothly onto the semiconductor devices.

Abstract: A heat transfer member has a heat transfer unit mounted on a mounting sheet. The heat transfer unit comprises a plurality of layers of wire mesh laminated and bonded together and to the mounting sheet. The spaces between the wires of the mesh layers of the heat transfer unit permit liquid to pass through the heat transfer unit so as to conduct heat. A semiconductor element (IC chip) is mounted on the mounting sheet, and to a base. The resulting assembly is immersed in a liquid. Preferably, the planes of the mesh layers are generally perpendicular to the mounting sheet and the semiconductor element and the material of the mounting sheet chosen to have a thermal expansion coefficient between that of the semiconductor element and the heat transfer unit to reduce thermal stresses. The wires of the mesh layers are preferably of copper as this is inexpensive and provides satisfactory heat conduction.

Abstract: A multi-chip module or a like device having a sealed structure for being cooled with a liquid cooling medium, and in which the semiconductor integrated circuit chips or the chip carriers mounting the chips are individually cooled with the forced convection cooling using a cooling liquid. The cooling liquid injection ports are so arranged that the cooling liquid flows substantially in parallel with the back surfaces of the chips.

Abstract: High heat generation member of electronic integrated circuit etc. is boiled and cooled. A refrigerant steam is generated by cooling of the heat generation member and is condensed by a condenser which is provided an upper portion. A refrigerant steam flow path and a condensed refrigerant flow path from the condenser are separated with a partition wall. The condensed liquid sent back to the partition wall is supplied to the heat generation member through the partition wall.

Abstract: A cooling device for providing cooling of integrated circuit semiconductor chips is so arranged as to transfer a heat via thin fin members which are fitted with each other with a small clearance. The bottom surface of one of thermal conductive members which is provided integrally with the fin members is made greater in surface area than a back planar surface of the semiconductor chip, and the thermal conductive member and the semiconductor chip are kept at all times in plane contact with each other, thereby enhancing the cooling performance.

Abstract: A cooling device for providing cooling of integrated circuit semiconductor chips is so arranged as to transfer a heat via thin fin members which are fitted with each other with a small clearance. The bottom surface of one of thermal conductive members which is provided integrally with the fin members is made greater in surface area than a back planar surface of the semiconductor chip, and the thermal conductive member and the semiconductor chip are kept at all times in plane contact with each other, thereby enhancing the cooling performance.