Abstract: An inspection device includes an imaging device and a determinator. The imaging device is attached to an operator to image an imaging range, and the determinator is configured to determine a quality of an inspection object. The imaging device is configured to constantly image the imaging range and to sequentially transmit the image data of the imaging range to the determinator. The determinator determines the quality of the inspection object by collating an acquired image data of the inspection object, acquired from the image data transmitted from the imaging device, with a collation image data registered in advance.

Abstract: An inspection device includes an imaging device, a determinator and a communication device. The imaging device is detachably attached to an operator to image an imaging range. The determinator is configured to determine a quality of the inspection object. The communication device is separated from the imaging device to wirelessly transmit image data of the imaging range captured by the imaging device to the determinator. The determinator is configured to collate the image data of the imaging range wirelessly transmitted from the communication device with collation image data registered in advance, and to determine the quality of the inspection object in response to a collation result.

Abstract: An inspection device includes an imaging device attached to an operator to image an imaging range, and a determinator configured to determine a quality of an inspection object. The determinator is configured: to receive image data of the imaging range transmitted from the imaging device; to identify an image area in which the inspection object exists in the image data of the imaging range; to set a predetermined area within the image area in which the inspection object exists, as an inspection area; and to collate the image data of the inspection area with a pre-registered collation image data to determine whether the quality of the inspection object is defective or not. Therefore, it is possible to more accurately determine the quality of the inspection object to be inspected.

Abstract: In a heat exchanger, a liquid resin is applied to an outer surface of the heat exchanger, and then surplus liquid resin is removed from the outer surface. In removing the surplus liquid resin, before air having a first velocity is directed to the heat exchanger for blowing the surplus liquid resin off the heat exchanger, air having a second velocity lower than the first velocity is directed to the heat exchanger to remove the surplus liquid resin from the heat exchanger by moving the surplus liquid resin along the outer surface of the heat exchanger. The air at the second velocity is directed toward the heat exchanger by a second blower before the air at the first velocity is directed toward the heat exchanger by a first blower.

Abstract: A stacked type cooler 1 for cooling a plurality of electronic components 6 from two surfaces of each component includes a plurality of cooling tubes 2 having a flat shape and coolant flow passage 21 for allowing a coolant to flow, and a connecting pipe 3 for communicating these cooling tubes 2. The plurality of cooling tubes 2 is arranged and stacked in such a fashion as to interpose the electronic components 6 between the cooling tubes. The plurality of cooling tubes 2 includes an outside cooling tube 2b and an inside cooling tube 2a. The inside cooling tube 2a includes at least a first coolant flow passage 211 facing a first tube wall 231 constituting a first main surface 221 of the inside cooling tube 2a and a second coolant flow passage 212 facing a second tube wall 232 constituting a second main surface 222 on the opposite side to the first main surface 221. The coolant flow passage 21 is formed into two or more stages in a direction of thickness of the inside cooling tube 2a.

Abstract: A cooler capable of reducing the fabrication cost is provided. In the cooler, in which electronic parts 6 are held between neighboring tubes 1, each of the tubes 1 is formed by joining the edges of plates 1a, 1b, each of which is formed into a predetermined shape by press molding, and fins 5 for accelerating heat exchange are arranged in the tube 1. As an inner wall conventionally exists when the tube 1 is manufactured by extrusion, can be removed, it is no longer necessary to remove the inner wall by machining, therefore, the fabrication cost can be reduced.

Abstract: In a method of manufacturing a heat exchanger, a liquid resin is applied to an outer surface of the heat exchanger, and then surplus liquid resin is removed from the outer surface. In removing the surplus liquid resin, before a first air having a first velocity is directed to the heat exchanger for blowing the surplus liquid resin off the heat exchanger, a second air having a second velocity lower than the first velocity is directed to the heat exchanger to remove the surplus liquid resin from the heat exchanger by moving the surplus liquid resin along the outer surface of the heat exchanger. The second air is directed toward the heat exchanger by a second blower before the first air is directed toward the heat exchanger by a first blower.

Abstract: A cooler capable of reducing the fabrication cost is provided. In the cooler, in which electronic parts 6 are held between neighboring tubes 1, each of the tubes 1 is formed by joining the edges of plates 1a, 1b, each of which is formed into a predetermined shape by press molding, and fins 5 for accelerating heat exchange are arranged in the tube 1. As an inner wall conventionally exists when the tube 1 is manufactured by extrusion, can be removed, it is no longer necessary to remove the inner wall by machining, therefore, the fabrication cost can be reduced.

Abstract: A stacked type cooler 1 for cooling a plurality of electronic components 6 from two surfaces of each component includes a plurality of cooling tubes 2 having a flat shape and coolant flow passage 21 for allowing a coolant to flow, and a connecting pipe 3 for communicating these cooling tubes 2. The plurality of cooling tubes 2 is arranged and stacked in such a fashion as to interpose the electronic components 6 between the cooling tubes. The plurality of cooling tubes 2 includes an outside cooling tube 2b and an inside cooling tube 2a. The inside cooling tube 2a includes at least a first coolant flow passage 211 facing a first tube wall 231 constituting a first main surface 221 of the inside cooling tube 2a and a second coolant flow passage 212 facing a second tube wall 232 constituting a second main surface 222 on the opposite side to the first main surface 221. The coolant flow passage 21 is formed into two or more stages in a direction of thickness of the inside cooling tube 2a.