Patents by Inventor Motohiro Yamashita

Motohiro Yamashita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080075632
    Abstract: There is provided a biological sample analysis plate on which, when a biological sample is transferred by rotating the plate, the biological sample can be easily transferred from an outer circumference side to an inner circumference side with respect to a center of rotation. A chamber part (16) which is provided on the inner circumference side with respect to the center of rotation and a sample holding part (20) which is provided on the outer circumference side are connected by channels (17) and (18), and the sample holding part (20) previously contains air inside, and the air in the sample holding part (20) is compressed and held in the sample holding part (20) when the biological sample moves from the chamber (16) toward the sample holding part (20) due to a centrifugal force that is caused by rotation of the plate.
    Type: Application
    Filed: December 8, 2005
    Publication date: March 27, 2008
    Inventors: Kazuyoshi Mori, Ryuji Shimizu, Motohiro Yamashita, Toshifumi Nanjo
  • Patent number: 7282255
    Abstract: The present invention relates to a flexible printed circuit board which has extremely high adhesion performance and on which very fine circuit patterns can be formed by etching, and to a method for producing the same. In the present invention, in the flexible printed circuit board wherein a copper thin film made of copper or an alloy containing primarily copper is directly formed on at least one side of a plastic film substrate, and copper is formed further on the copper thin film by the electrolytic plating method, the above-mentioned copper thin film has a two-layer structure in which a layer including at least a crystalline structure is formed on the surface side thereof, and the X-ray relative intensity ratio between crystal lattice plane indices (200)/(111) in the above-mentioned crystalline structure is 0.1 or less.
    Type: Grant
    Filed: April 17, 2003
    Date of Patent: October 16, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kouichi Hiranaka, Ryuichi Nakagami, Mitsuhiro Fukuoka, Motohiro Yamashita
  • Publication number: 20060160210
    Abstract: In a biological sample analysis plate, one ends of channels 11 and 12 are connected to a quantitative sorting part 10 having a predetermined volume for taking a predetermined amount of a biological sample. On the other end of the channel 11, a buffer agent storage part 7 for holding a buffer agent to be filled in the channels 11 and 12 is provided in a position that is concentric with the quantitative sorting part 10 with respect to an axial center of the plate. Further, an overflow chamber 17 into which excess buffer agent that cannot be stored in the buffer agent storage part flows is connected to the buffer agent storage part 7. Therefore, it is possible to provide a biological sample analysis plate which can facilitate injection of the buffer agent and the biological sample, and obtain accurate result of detection in a short time, when performing detection by making the biological sample migrate in the buffer agent filled in the channels.
    Type: Application
    Filed: November 28, 2005
    Publication date: July 20, 2006
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazuyoshi Mori, Motohiro Yamashita, Toshifumi Nanjo
  • Publication number: 20050174722
    Abstract: The present invention relates to a flexible printed circuit board which has extremely high adhesion performance and on which very fine circuit patterns can be formed by etching, and to a method for producing the same. In the present invention, in the flexible printed circuit board wherein a copper thin film made of copper or an alloy containing primarily copper is directly formed on at least one side of a plastic film substrate, and copper is formed further on the copper thin film by the electrolytic plating method, the above-mentioned copper thin film has a two-layer structure in which a layer including at least a crystalline structure is formed on the surface side thereof, and the X-ray relative intensity ratio between crystal lattice plane indices (200)/(111) in the above-mentioned crystalline structure is 0.1 or less.
    Type: Application
    Filed: April 17, 2003
    Publication date: August 11, 2005
    Applicant: Matsushita Electric Industrial Co. Ltd.
    Inventors: Kouichi Hiranaka, Ryuichi Nakagami, Mitsuhiro Fukuoka, Motohiro Yamashita
  • Patent number: 6858984
    Abstract: A vacuum container includes a getter filled with a gettering material for maintaining a vacuum condition, and includes a getter support which includes a control plate member, a support leg and a holder. The getter support is arranged in the spreading direction of the getter material in order to limit the directions of the spreading of the getter material. This structure reduces the number of relevant components, simplifies the procedure of fabrication and maintains the degree of vacuum.
    Type: Grant
    Filed: July 24, 2001
    Date of Patent: February 22, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Motohiro Yamashita
  • Publication number: 20020033667
    Abstract: A vacuum container includes a getter 4 filled with a gettering material 6 for maintaining the vacuum state and includes a getter support 7 which comprises a control plate member 9, a support leg 8, and a holder 10 and the getter support 7 is arranged at the spreading direction of the getter material in order to limit the directions of the spreading of the getter material, thereby reducing the number of relevant components, simplifying the procedure of fabrication, and maintaining the degree of vacuum.
    Type: Application
    Filed: July 24, 2001
    Publication date: March 21, 2002
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO.,
    Inventor: Motohiro Yamashita
  • Patent number: 5931337
    Abstract: A semiconductor accommodating device using an embossed tape and a method for inserting and taking out semiconductor devices, without using a top cover tape that had hitherto been used. The semiconductor accommodating device comprises a reel and an embossed tape wound on the reel. The embossed tape has a bottom wall for placing a semiconductor device thereon, two side walls upwardly extending from both side edges of the boom wall, and top walls having an opening. The side walls are formed such that the semiconductor device inserted through the opening is held by the side walls with the semiconductor device placed on the bottom wall.
    Type: Grant
    Filed: October 14, 1997
    Date of Patent: August 3, 1999
    Assignee: Fujitsu Limited
    Inventors: Yukio Ando, Motohiro Yamashita, Kimiko Miura, Ayako Ito