Patents by Inventor Motohisa Kotani

Motohisa Kotani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7969741
    Abstract: It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure 20 of the first embodiment is provided with a substrate 21, a plurality of electronic components 22 mounted along the substrate 21, and a resin part 25 that covers the electronic components 22 and is in close contact with the substrate 21. In the substrate structure 20, the resin part 25 is provided with a reinforcing heat discharge layer 26 covering the electronic components 22 and having a heat conductivity and a reinforcing property and a shield layer 27 covering the reinforcing heat discharge layer 26, and a surface o28 of the shield layer 27 is formed into a predetermined shape corresponding to a surface structure of the display device 30 adjacent to the resin part 25.
    Type: Grant
    Filed: February 20, 2006
    Date of Patent: June 28, 2011
    Assignee: Panasonic Corporation
    Inventors: Haruo Hayakawa, Masahiro Ono, Seiji Yamaguchi, Yoshihiro Uda, Kazuhiro Shinchi, Satoru Tomekawa, Kiyoshi Nakanishi, Kosuke Kubota, Atsushi Katagiri, Motohisa Kotani, Kazuhiro Konishi, Eiji Nishimura, Takeo Matsuki
  • Publication number: 20100020497
    Abstract: It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure 20 of the first embodiment is provided with a substrate 21, a plurality of electronic components 22 mounted along the substrate 21, and a resin part 25 that covers the electronic components 22 and is in close contact with the substrate 21. In the substrate structure 20, the resin part 25 is provided with a reinforcing heat discharge layer 26 covering the electronic components 22 and having a heat conductivity and a reinforcing property and a shield layer 27 covering the reinforcing heat discharge layer 26, and a surface o28 of the shield layer 27 is formed into a predetermined shape corresponding to a surface structure of the display device 30 adjacent to the resin part 25.
    Type: Application
    Filed: February 20, 2006
    Publication date: January 28, 2010
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Haruo Hayakawa, Masahiro Ono, Seiji Yamaguchi, Yoshihiro Uda, Kazuhiro Shinchi, Satoru Tomekawa, Kiyoshi Nakanishi, Kosuke Kubota, Atsushi Katagiri, Motohisa Kotani, Kazuhiro Konishi, Eiji Nishimura, Takeo Matsuki