Patents by Inventor Motohisa NOGI

Motohisa NOGI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10475977
    Abstract: A light emitting device includes an element container and a light emitting element. The element container has a first electrode lead, a second electrode lead, and a resin molded body integrated with the first electrode lead and the second electrode lead and includes an indentation at an outer surface, a wire covered with the resin molded body and extending from the first electrode lead to the indentation. The light emitting element is housed in the element container and electrically connected to the first electrode lead and the second electrode lead.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: November 12, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Motohisa Nogi, Saiki Yamamoto
  • Publication number: 20190074420
    Abstract: A light emitting device includes an element container and a light emitting element. The element container has a first electrode lead, a second electrode lead, and a resin molded body integrated with the first electrode lead and the second electrode lead and includes an indentation at an outer surface, a wire covered with the resin molded body and extending from the first electrode lead to the indentation. The light emitting element is housed in the element container and electrically connected to the first electrode lead and the second electrode lead.
    Type: Application
    Filed: October 31, 2018
    Publication date: March 7, 2019
    Applicant: NICHIA CORPORATION
    Inventors: Motohisa NOGI, Saiki YAMAMOTO
  • Patent number: 10147856
    Abstract: A composite substrate includes a plate-like lead frame having a plurality of supporting leads and a plurality of element containers supported by the supporting leads. The plurality of element containers each has a first electrode lead, a second electrode lead, and a resin molded body integrated with the first electrode lead and the second electrode lead, and within the resin molded body, the first electrode lead, the second electrode lead, and the supporting lead are held spaced apart from one another. At least one of the plurality of element containers has a wire that connects the first electrode lead and the supporting lead and is covered with the resin molded body.
    Type: Grant
    Filed: November 18, 2015
    Date of Patent: December 4, 2018
    Assignee: NICHIA CORPORATION
    Inventors: Motohisa Nogi, Saiki Yamamoto
  • Publication number: 20160141475
    Abstract: A composite substrate includes a plate-like lead frame having a plurality of supporting leads and a plurality of element containers supported by the supporting leads. The plurality of element containers each has a first electrode lead, a second electrode lead, and a resin molded body integrated with the first electrode lead and the second electrode lead, and within the resin molded body, the first electrode lead, the second electrode lead, and the supporting lead are held spaced apart from one another. At least one of the plurality of element containers has a wire that connects the first electrode lead and the supporting lead and is covered with the resin molded body.
    Type: Application
    Filed: November 18, 2015
    Publication date: May 19, 2016
    Applicant: NICHIA CORPORATION
    Inventors: Motohisa NOGI, Saiki YAMAMOTO