Patents by Inventor Motohisa Taguchi
Motohisa Taguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7786541Abstract: A semiconductor pressure sensor comprises a silicon support substrate (1), an insulating layer (2) formed on the silicon support substrate (1), and a silicon thin plate (3) formed on the insulating layer (2). A through-hole (1a) extending in the thickness direction of the silicon support substrate (1) is formed in the silicon support substrate (1). The silicon thin plate (3) located on an extension of the through-hole (1a) functions as a diaphragm (23) that is deformed by an external pressure. The insulating layer (2) remains over the entire lower surface of the diaphragm (23). The thickness of the insulating layer (2) decreases from the peripheral portion toward the central portion of the diaphragm (23). This provides the semiconductor pressure sensor capable of reducing both the offset voltage and the variation of output voltage caused by the variation of temperature and its fabrication method.Type: GrantFiled: August 30, 2006Date of Patent: August 31, 2010Assignee: Mitsubishi Electric CorporationInventors: Shinichi Izuo, Motohisa Taguchi, Akira Yamashita, Yukihisa Yoshida
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Publication number: 20090140355Abstract: A semiconductor pressure sensor comprises a silicon support substrate (1), an insulating layer (2) formed on the silicon support substrate (1), and a silicon thin plate (3) formed on the insulating layer (2). A through-hole (1a) extending in the thickness direction of the silicon support substrate (1) is formed in the silicon support substrate (1). The silicon thin plate (3) located on an extension of the through-hole (1a) functions as a diaphragm (23) that is deformed by an external pressure. The insulating layer (2) remains over the entire lower surface of the diaphragm (23). The thickness of the insulating layer (2) decreases from the peripheral portion toward the central portion of the diaphragm (23). This provides the semiconductor pressure sensor capable of reducing both the offset voltage and the variation of output voltage caused by the variation of temperature and its fabrication method.Type: ApplicationFiled: August 30, 2006Publication date: June 4, 2009Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Shinichi Izuo, Motohisa Taguchi, Akira Yamashita, Yukihisa Yoshida
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Patent number: 6891368Abstract: A magnetoresistive sensor device including a substrate, and a sensing portion and a signal processing circuit formed above the substrate with a resin film being disposed between the sensing portion and the signal processing circuit. The sensing portion detects changes in a magnetic field induced by a moving body, is located at a position for effectively detecting changes in a magnetic field induced by the moving body, and is constituted by a magnetoresistive sensor element.Type: GrantFiled: November 5, 2002Date of Patent: May 10, 2005Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Yuji Kawano, Naoki Yasuda, Motohisa Taguchi, Ikuya Kawakita, Shinichi Hosomi, Tatsuya Fukami
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Patent number: 6845662Abstract: A dummy pattern is constituted by frame-shaped first patterns formed on a flat substrate so as to surround a resistance heater and a fluid temperature resistance thermometer, and frame-shaped second patterns formed on inner perimeter sides of the first patterns, edge portions of first and second diaphragm portions being positioned between the first patterns and the second patterns.Type: GrantFiled: March 5, 2003Date of Patent: January 25, 2005Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Masahiro Kawai, Motohisa Taguchi
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Patent number: 6762672Abstract: A supporting film is formed over an entire front surface of a base material, a heating resistor composed of a platinum film having a predetermined pattern is formed on the supporting film, and a protecting film is formed over an entire surface of the supporting film so as to cover the heating resistor. A heating structure having a diaphragm construction is constructed by forming a cavity under a region where the heating resistor is formed by removing a portion of the base material so as to extend to the supporting film from the rear surface side of the base material. The supporting film and the protecting film are each constituted by a silicon nitride film having an index of refraction of less than 2.25.Type: GrantFiled: November 5, 2003Date of Patent: July 13, 2004Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Motohisa Taguchi, Masahiro Kawai
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Publication number: 20040090305Abstract: A supporting film is formed over an entire front surface of a base material, a heating resistor composed of a platinum film having a predetermined pattern is formed on the supporting film, and a protecting film is formed over an entire surface of the supporting film so as to cover the heating resistor. A heating structure having a diaphragm construction is constructed by forming a cavity under a region where the heating resistor is formed by removing a portion of the base material so as to extend to the supporting film from the rear surface side of the base material. The supporting film and the protecting film are each constituted by a silicon nitride film having an index of refraction of less than 2.25.Type: ApplicationFiled: November 5, 2003Publication date: May 13, 2004Applicant: MITSUBISHI DENKI KABUSHIKI KAISHAInventors: Motohisa Taguchi, Masahiro Kawai
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Patent number: 6732583Abstract: The present invention provides a sensor element having a sensor substrate and a sensing portion supported by the sensor substrate. A resin film is provided between the sensor substrate and the sensing portion. The resin film has a high heat resistance to the temperature of the fabrication process and the use of sensor element, has excellent coverage of a three-dimensional structure, has a flat surface, applies a low stress to the sensing portion, is formed at low temperature, and prevents the sensing portion from being adversely affected in its fabrication process.Type: GrantFiled: April 1, 2002Date of Patent: May 11, 2004Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Naoki Yasuda, Tatsuya Fukami, Motohisa Taguchi, Yuji Kawano
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Patent number: 6703132Abstract: The invention provides a sensor element having a sensor substrate and a flat sensor portion supported by the sensor substrate in which the surface of the flat sensing portion is covered with a silicone resin film. The silicone resin film is excellent in step coverage of the flat sensing portion, having low stress applied to the sensing portion, can be formed at low temperature and can prevent the sensing portion from being effected with adverse influence even in the fabrication steps.Type: GrantFiled: September 25, 2001Date of Patent: March 9, 2004Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Naoki Yasuda, Tatsuya Fukami, Motohisa Taguchi, Yuji Kawano
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Patent number: 6661221Abstract: A magnetic field sensing element comprises an underlayer formed on a substrate, a giant magnetoresistance element formed on the underlayer for detecting a change in a magnetic field, and an integrated circuit formed on the substrate for carrying out predetermined arithmetic processing based on a change in a magnetic field detected by the giant magnetoresistance element, wherein the giant magnetoresistance element and the integrated circuit are formed on the same surface.Type: GrantFiled: June 5, 2002Date of Patent: December 9, 2003Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Motohisa Taguchi, Izuru Shinjo, Yuji Kawano, Tatsuya Fukami, Kazuhiko Tsutsumi, Yuuichi Sakai, Naoki Hiraoka, Yasuyoshi Hatazawa
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Patent number: 6644113Abstract: A flow-rate detecting device for a heat-sensitive type flow sensor having high reliability. The device includes a planar substrate having first and second through-holes formed therein in juxtaposition with each other, an insulative supporting film formed over one major surface of the substrate so as to cover the through-holes, a fluid temperature measuring resistor formed by a heat-sensitive resistor film deposited at a location of the first through-hole on the supporting film oppositely to the substrate, a heat generating resistor formed of a heat-sensitive resistance film deposited at a location of the second through-hole on the supporting film oppositely to the substrate, an insulative protection film deposited so as to cover the fluid temperature measuring resistor and the heat generating resistor, and a reinforcing film provided for the fluid temperature measuring resistor. The reinforcing film is not provided for the heat generating resistor.Type: GrantFiled: October 23, 2001Date of Patent: November 11, 2003Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Masahiro Kawai, Motohisa Taguchi
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Publication number: 20030197503Abstract: The present invention provides a magnetoresistive sensor device including a substrate, and a sensing portion and a signal processing circuit formed above the substrate with a resin film being disposed between the sensing portion and the signal processing circuit,Type: ApplicationFiled: November 5, 2002Publication date: October 23, 2003Applicant: MITSUBISHI DENKI KABUSHIKI KAISHAInventors: Yuji Kawano, Naoki Yasuda, Motohisa Taguchi, Ikuya Kawakita, Shinichi Hosomi, Tatsuya Fukami
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Publication number: 20030185270Abstract: A dummy pattern is constituted by frame-shaped first patterns formed on a flat substrate so as to surround a resistance heater and a fluid temperature resistance thermometer, and frame-shaped second patterns formed on inner perimeter sides of the first patterns, edge portions of first and second diaphragm portions being positioned between the first patterns and the second patterns.Type: ApplicationFiled: March 5, 2003Publication date: October 2, 2003Applicant: MITSUBISHI DENKI KABUSHIKI KAISHAInventors: Masahiro Kawai, Motohisa Taguchi
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Patent number: 6615655Abstract: A flow rate detecting element measuring the flow rates of various fluids, particularly the intake air of an internal combustion engine. The flow rate detecting element has a thin film layer including a support film and a protective film on one surface of a flat substrate, a heating resistance section and a comparative resistance section thermosensitive resistor having patterns and located between the support film and the protective film. The flat substrate has a recess which penetrates the flat substrate in the thickness direction thereof and facing the heating resistance section and the comparative resistance section. A fluid flow passage communicates with the recess which faces the comparative resistance section for fluid flow into the recess. Flow rate or velocity of a fluid can be measured accurately using the heating resistance section according to the fluid temperature reported by the comparative resistance section.Type: GrantFiled: January 17, 2002Date of Patent: September 9, 2003Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Yuichi Sakai, Akira Yamashita, Motohisa Taguchi, Tomoya Yamakawa, Masahiro Kawai, Kazuhiko Tsutsumi
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Publication number: 20020175803Abstract: A vehicle-mounted magnetoresistive sensor element includes plural plies of a magnetic layer and plural plies of a nonmagnetic layer, the magnetic layer and the nonmagnetic layer are alternately laminated with each other, the magnetic layer mainly contains Ni, Fe and Co, and the nonmagnetic layer mainly contains Cu, in which the magnetic layer has a composition represented by the following formula: Ni(1−x−y)FeyCox, where x and y satisfy the following conditions: x≧0.7, y≦0.3 and (1−x−y)≦0.15, the nonmagnetic layer has a composition represented by the following formula: CuzAl(1−z), where A is an additional element other than Cu, and z≧0.9; the thickness tm (angstrom) of the magnetic layer and the thickness tn (angstrom) of the nonmagnetic layer satisfy the following conditions: 10<tm<25; and 18<tn<25; and, when a guaranteed storage temperature of the magnetoresistive sensor element is T° C.Type: ApplicationFiled: November 30, 2001Publication date: November 28, 2002Applicant: MITSUBISHI DENKI KABUSHIKI KAISHAInventors: Yuji Kawano, Motohisa Taguchi, Ikuya Kawakita, Tatsuya Fukami
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Publication number: 20020157463Abstract: A flow-rate detecting device for a heat-sensitive type flow sensor having high reliability. The device includes a planar substrate having first and second through-holes formed therein in juxtaposition with each other, an insulative supporting film formed over one major surface of the substrate so as to cover the through-holes, a fluid temperature measuring resistor formed by a heat-sensitive resistor film deposited at a location of the first through-hole on the supporting film oppositely to the substrate, a heat generating resistor formed of a heat-sensitive resistance film deposited at a location of the second through-hole on the supporting film oppositely to the substrate, an insulative protection film deposited so as to cover the fluid temperature measuring resistor and the heat generating resistor, and a reinforcing film provided for the fluid temperature measuring resistor. The reinforcing film is not provided for the heat generating resistor.Type: ApplicationFiled: October 23, 2001Publication date: October 31, 2002Applicant: MITSUBISHI DENKI KABUSHIKI KAISHAInventors: Masahiro Kawai, Motohisa Taguchi
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Patent number: 6470742Abstract: To obtain a flow sensor having excellent responsibility, sensitivity and reliability and high flow detection accuracy by suppressing the deformation of a diaphragm, first additional patterns are formed on a side opposite to connection patterns of a heating element so that thin film patterns formed on the diaphragm become almost symmetrical, thereby suppressing the deformation of the diaphragm caused by internal stress between a base film or protective film and a platinum film forming the thin film patterns and the differences of mechanical or thermal properties therebetween.Type: GrantFiled: July 26, 1999Date of Patent: October 29, 2002Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Tomoya Yamakawa, Motohisa Taguchi
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Publication number: 20020153881Abstract: A magnetic field sensing element comprises an underlayer formed on a substrate, a giant magnetoresistance element formed on the underlayer for detecting a change in a magnetic field, and an integrated circuit formed on the substrate for carrying out predetermined arithmetic processing based on a change in a magnetic field detected by the giant magnetoresistance element, wherein the giant magnetoresistance element and the integrated circuit are formed on the same surface.Type: ApplicationFiled: June 5, 2002Publication date: October 24, 2002Applicant: MITSUBISHI DENKI KABUSHIKI KAISHAInventors: Motohisa Taguchi, Izuru Shinjo, Yuji Kawano, Tatsuya Fukami, Kazuhiko Tsutsumi, Yuuichi Sakai, Naoki Hiraoka, Yasuyoshi Hatazawa
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Patent number: 6426620Abstract: A magnetic field sensing element comprises an underlayer formed on a substrate, a giant magnetoresistance element formed on the underlayer for detecting a change in a magnetic field, and an integrated circuit formed on the substrate for carrying out predetermined arithmetic processing based on a change in a magnetic field detected by the giant magnetoresistance element, wherein the giant magnetoresistance element and the integrated circuit are formed on the same surface.Type: GrantFiled: May 10, 1999Date of Patent: July 30, 2002Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Motohisa Taguchi, Izuru Shinjo, Yuji Kawano, Tatsuya Fukami, Kazuhiko Tsutsumi, Yuuichi Sakai, Naoki Hiraoka, Yasuyoshi Hatazawa
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Patent number: 6399733Abstract: A process for preparing a highly pure silicone ladder polymer of the general formula (1): wherein R1 and R2 represent F, H, a lower alkyl group, an alkenyl group, an aryl group, a lower fluorinated alkyl group, a fluorinated alkenyl group or a fluorinated aryl group; R3, R4, R5 and R6 each represents H, a lower alkyl group or a lower fluorinated alkyl group; and n represents an integer of 5 to 10000, which comprises: (a) a step of obtaining a prepolymer in which at least one organosilane compound is dissolved in an organic solvent and hydrolyzed with ultrapure water; (b) a step of washing the obtained prepolymer with ultrapure water; and, (c) a step of dissolving the washed prepolymer in an organic solvent and heating without a catalyst.Type: GrantFiled: October 11, 2000Date of Patent: June 4, 2002Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Shigeyuki Yamamoto, Naoki Yasuda, Motohisa Taguchi
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Patent number: 6323644Abstract: The present invention improves the sensitivity and expands the temperature range of operation of a magnetic detection device used in conjunction with rotary shafts such as those found in automobiles. A magnetic detection element consists of a giant magnetoresistance element and an integrated circuit for performing a predetermined operational processing based on the variation of magnetic field detected by the giant magnetoresistance element, and the magnetic detection element is operated in the magnetic field in the range of exceeding the magnetic field for maximizing the resistance value of the giant magnetoresistance element and below the field obtained by multiplying the saturation magnetic field of the giant magnetoresistance element by 0.8.Type: GrantFiled: October 22, 1999Date of Patent: November 27, 2001Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Motohisa Taguchi, Izuru Shinjo, Yuji Kawano, Tatsuya Fukami, Kazuhiko Tsutsumi, Ikuya Kawakita