Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a logic cell layout design for high density transistors and methods of manufacture. The structure includes a plurality of active gates in a high density transistor, and at least one dummy gate which is continuous and is adjacent to at least one active gate of the active gates in a multi-row cell of the high density transistor.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a dual airgap structure and methods of manufacture. The structure includes: a lower metal line; a plurality of upper metal lines; and a first airgap between the lower metal line and at least one upper metal line of the plurality of upper metal lines.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a dual airgap structure and methods of manufacture. The structure includes: a lower metal line; a plurality of upper metal lines; and a first airgap between the lower metal line and at least one upper metal line of the plurality of upper metal lines.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a dual airgap structure and methods of manufacture. The structure includes: a lower metal line; a plurality of upper metal lines; and a first airgap between the lower metal line and at least one upper metal line of the plurality of upper metal lines.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a dual airgap structure and methods of manufacture. The structure includes: a lower metal line; a plurality of upper metal lines; and a first airgap between the lower metal line and at least one upper metal line of the plurality of upper metal lines.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a static random access memory assist circuit and methods of implementation and manufacture. The structure includes at least one static random access memory (SRAM) cell and a read assist circuit structured to apply a negative voltage to the at least one SRAM cell upon asserting of a wordline of the at least one SRAM cell.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a static random access memory assist circuit and methods of implementation and manufacture. The structure includes at least one static random access memory (SRAM) cell and a read assist circuit structured to apply a negative voltage to the at least one SRAM cell upon asserting of a wordline of the at least one SRAM cell.

Abstract: A semiconductor memory structure includes adjacent cross-sectionally rectangular-shaped bottom source and drain electrodes, the electrodes including n-type electrode(s) and p-type electrode(s), and vertical channel transistors on one or more of the n-type electrode(s) and one or more of the p-type electrode(s); each vertical channel transistor including a vertical channel and a gate electrode wrapped therearound, some of the transistors including pull-up transistors. The semiconductor memory structure further includes a routing gate electrode for each gate electrode, and a shared contact having at least two parts, each part situated over the routing gate electrodes for the pull-up transistors. A unit semiconductor memory cell, the semiconductor memory structure and a corresponding method of forming the memory structure are also provided.

Abstract: A semiconductor memory structure (e.g., SRAM) includes vertical channels with a circular, square or rectangular cross-sectional shape. Each unit cell can include a single pull-up vertical transistor and either: one pull-down vertical transistor and one pass-gate vertical transistor; or two or more of each of the pull-down and pass-gate vertical transistors. The structure may be realized by providing adjacent layers of undoped semiconductor material, forming vertical channels for vertical transistors, the vertical channels situated on each of the adjacent layers, doping a first half of each of the adjacent layers with a n-type or p-type dopant, doping a second half of each of the adjacent layers with an opposite type dopant to that of the first half, forming wrap-around gates surrounding the vertical channels, and forming top electrodes for the vertical transistors.

Abstract: A 4B5B encoder converts an inputted 4-bit data into a pattern of a 5-bit data in which (i) the number of bits of consecutive “0” data values is permitted to be maximum two, and, simultaneously, (ii) maximum one bit of head end two bits is permitted to have a “0” data value and maximum one bit of tail end two bits is permitted to have a “0” data value. A 5N-bit command encoder converts a command into a command pattern in which the number of bits contained in consecutive “0” data values is permitted to be maximum two. The data after the conversion and the command after the conversion are converted into NRZI codes by an NRZI encoder.

Abstract: A communication network system including a plurality of nodes disposed on a communication bus, and where each of the nodes is capable of transitioning between a normal operation mode and a low electricity consumption mode. The communication network system controls only a required node, in order to communicate with such required node, by transitioning the required node from the low power mode to the normal operation mode. To control the mode of the required nodes, a controlling node keeps a signal change state of the communication bus for a period that is longer than a normal communication frame length. The required node determines whether the period of the signal change state is longer than a threshold of the required node itself, to output a wakeup signal to a control circuit.

Abstract: A 4B5B encoder converts an inputted 4-bit data into a pattern of a 5-bit data in which (i) the number of bits of consecutive “0” data values is permitted to be maximum two, and, simultaneously, (ii) maximum one bit of head end two bits is permitted to have a “0” data value and maximum one bit of tail end two bits is permitted to have a “0” data value. A 5N-bit command encoder converts a command into a command pattern in which the number of bits contained in consecutive “0” data values is permitted to be maximum two. The data after the conversion and the command after the conversion are converted into NRZI codes by an NRZI encoder.

Abstract: Disclosed is a semiconductor integrated circuit realizing improved operating speed, reduced power consumption in an active mode, reduced power consumption in a standby mode, and reduced area of a chip. A first logic gate using a first pair of potentials VDDL, VSSL having a relatively small potential difference as an operation power source and a second logic gate using a second pair of potentials VDDH, VSSH having a relatively large potential difference as an operation power source commonly use substrate potentials VBP, VBN of MIS transistors. The second logic gate has a relatively high driving capability, and the first logic gate can operate on relatively low power. The MIS transistor has a threshold voltage which increases by a reverse substrate bias and decreases by a forward substrate bias. By commonly using the substrate potential, even in the case where different substrate bias states are generated at both of the logic gates, MOS transistors of the logic gates can be formed in the common well region.

Abstract: Disclosed is a semiconductor integrated circuit realizing improved operating speed, reduced power consumption in an active mode, reduced power consumption in a standby mode, and reduced area of a chip. A first logic gate using a first pair of potentials VDDL, VSSL having a relatively small potential difference as an operation power source and a second logic gate using a second pair of potentials VDDH, VSSH having a relatively large potential difference as an operation power source commonly use substrate potentials VBP, VBN of MIS transistors. The second logic gate has a relatively high driving capability, and the first logic gate can operate on relatively low power. The MIS transistor has a threshold voltage which increases by a reverse substrate bias and decreases by a forward substrate bias. By commonly using the substrate potential, even in the case where different substrate bias states are generated at both of the logic gates, MOS transistors of the logic gates can be formed in the common well region.

Abstract: Disclosed is a semiconductor integrated circuit realizing improved operating speed, reduced power consumption in an active mode, reduced power consumption in a standby mode, and reduced area of a chip. A first logic gate using a first pair of potentials VDDL, VSSL having a relatively small potential difference as an operation power source and a second logic gate using a second pair of potentials VDDH, VSSH having a relatively large potential difference as an operation power source commonly use substrate potentials VBP, VBN of MIS transistors. The second logic gate has a relatively high driving capability, and the first logic gate can operate on relatively low power. The MIS transistor has a threshold voltage which increases by a reverse substrate bias and decreases by a forward substrate bias. By commonly using the substrate potential, even in the case where different substrate bias states are generated at both of the logic gates, MOS transistors of the logic gates can be formed in the common well region.

Abstract: Disclosed is a semiconductor integrated circuit realizing improved operating speed, reduced power consumption in an active mode, reduced power consumption in a standby mode, and reduced area of a chip. A first logic gate using a first pair of potentials VDDL, VSSL having a relatively small potential difference as an operation power source and a second logic gate using a second pair of potentials VDDH, VSSH having a relatively large potential difference as an operation power source commonly use substrate potentials VBP, VBN of MIS transistors. The second logic gate has a relatively high driving capability, and the first logic gate can operate on relatively low power. The MIS transistor has a threshold voltage which increases by a reverse substrate bias and decreases by a forward substrate bias. By commonly using the substrate potential, even in the case where different substrate bias states are generated at both of the logic gates, MOS transistors of the logic gates can be formed in the common well region.

Abstract: Disclosed is a semiconductor integrated circuit realizing improved operating speed, reduced power consumption in an active mode, reduced power consumption in a standby mode, and reduced area of a chip. A first logic gate using a first pair of potentials VDDL, VSSL having a relatively small potential difference as an operation power source and a second logic gate using a second pair of potentials VDDH, VSSH having a relatively large potential difference as an operation power source commonly use substrate potentials VBP, VBN of MIS transistors. The second logic gate has a relatively high driving capability, and the first logic gate can operate on relatively low power. The MIS transistor has a threshold voltage which increases by a reverse substrate bias and decreases by a forward substrate bias. By commonly using the substrate potential, even in the case where different substrate bias states are generated at both of the logic gates, MOS transistors of the logic gates can be formed in the common well region.

Abstract: Disclosed is a semiconductor integrated circuit realizing improved operating speed, reduced power consumption in an active mode, reduced power consumption in a standby mode, and reduced area of a chip. A first logic gate using a first pair of potentials VDDL, VSSL having a relatively small potential difference as an operation power source and a second logic gate using a second pair of potentials VDDH, VSSH having a relatively large potential difference as an operation power source commonly use substrate potentials VBP, VBN of MIS transistors. The second logic gate has a relatively high driving capability, and the first logic gate can operate on relatively low power. The MIS transistor has a threshold voltage which increases by a reverse substrate bias and decreases by a forward substrate bias. By commonly using the substrate potential, even in the case where different substrate bias states are generated at both of the logic gates, MOS transistors of the logic gates can be formed in the common well region.