Abstract: To provide such a base multiplying agent capable of being used for crosslinking reaction, for example of a epoxy compound and the like, that generates another base by action of a base, and can efficiently perform base multiplying reaction, and a base-reactive curable composition using the base multiplying agent. The base generating agent of the invention is represented by the following formula (1): (In the formula (1), X represents a hydrogen atom, a substituted alkyl group or an unsubstituted alkyl group; Y represents a substituted or unsubstituted alkylene chain; and n represents an integer of from 1 to 4.

Abstract: To provide such a base multiplying agent capable of being used for crosslinking reaction, for example of a epoxy compound and the like, that generates another base by action of a base, and can efficiently perform base multiplying reaction, and a base-reactive curable composition using the base multiplying agent. The base generating agent of the invention is represented by the following formula (1): (In the formula (1), X represents a hydrogen atom, a substituted alkyl group or an unsubstituted alkyl group; Y represents a substituted or unsubstituted alkylene chain; and n represents an integer of from 1 to 4.

Abstract: The object is directed toward obtaining a process for preparing a solvent-type acrylic pressure-sensitive adhesive which is able to increase a conversion at polymerization in the preparation of the solvent-type acrylic pressure-sensitive adhesive to thereby solve the problems of odors associated with residual monomers and of attachment of gels on reactor walls, and further to provide improved productivity and workability.In the preparation of the solvent-type acrylic pressure-sensitive adhesives, a monomer composition containing alkyl (meth)acrylate ester as its main component is subjected to solution polymerization under a closed condition at least in a latter stage of the polymerization reaction. In the polymerization, the solution to be polymerized is maintained at temperatures not lower than a boiling point thereof under normal pressures or at 50.degree.-120.degree. C.