Patents by Inventor Motoi Nedu

Motoi Nedu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Machining quality judging method for wafer grinding machine and wafer grinding machine
    Patent number: 8055374
    Abstract: A machining quality judging method for a wafer grinding machine and wafer grinding machine are disclosed. The thickness of a wafer 2 is acquired from the feed amount of a grinding unit 3 while at the same time actually measuring the thickness of the wafer 2 appropriately. The wafer grinding machine includes a machining quality judging unit 20 for comparing the thickness of the wafer 2 based on the feed amount of the grinding unit 3 with the actually measured thickness of the wafer 2 and judges the machining quality of the ground surface of the wafer 2. Upon judgment of a machining failure, a command is issued to stop the back surface grinding operation.
    Type: Grant
    Filed: February 12, 2009
    Date of Patent: November 8, 2011
    Assignee: Tokyo Seimitsu Co., Ltd.
    Inventor: Motoi Nedu
  • MACHINING QUALITY JUDGING METHOD FOR WAFER GRINDING MACHINE AND WAFER GRINDING MACHINE
    Publication number: 20090239448
    Abstract: A machining quality judging method for a wafer grinding machine and wafer grinding machine are disclosed. The thickness of a wafer 2 is acquired from the feed amount of a grinding unit 3 while at the same time actually measuring the thickness of the wafer 2 appropriately. The wafer grinding machine includes a machining quality judging unit 20 for comparing the thickness of the wafer 2 based on the feed amount of the grinding unit 3 with the actually measured thickness of the wafer 2 and judges the machining quality of the ground surface of the wafer 2. Upon judgment of a machining failure, a command is issued to stop the back surface grinding operation.
    Type: Application
    Filed: February 12, 2009
    Publication date: September 24, 2009
    Inventor: Motoi Nedu