Patents by Inventor Motoi YAMAGATA
Motoi YAMAGATA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250122625Abstract: Provided is a substrate processing apparatus that has an improved cooling performance. This substrate processing apparatus comprises: a placing table which is provided in a processing container and on which a substrate is to be placed; a refrigerator that has a contacting surface that makes contact with or is separated from a contact target surface of the placing table, and cools the placing table; and a lifting/lowering device that lifts or lowers the refrigerator and generates a pressing force for pressing the refrigerator against the placing table.Type: ApplicationFiled: January 25, 2023Publication date: April 17, 2025Inventors: Motoi YAMAGATA, Hiroshi SONE, Masato SHINADA, Yusuke KIKUCHI
-
Patent number: 12167542Abstract: There is provided a method for manufacturing a substrate with a sensor in which a sensor is disposed on a plate-shaped substrate. The method comprises: holding the sensor by a magnetic force from a position on an opposite surface of a surface of the plate-shaped substrate on which the sensor is disposed that corresponds to a position where the sensor is fixed; and fixing the sensor to the plate-shaped substrate by curing an adhesive attached to the sensor in a state where the sensor is held by the magnetic force.Type: GrantFiled: November 8, 2021Date of Patent: December 10, 2024Assignee: Tokyo Electron LimitedInventors: Manabu Nakagawasai, Motoi Yamagata
-
Publication number: 20240209509Abstract: A substrate processing apparatus includes: a stage having a first contact surface; a freezing device having a second contact surface; an elevating device to be capable of thermally connecting or separating the second contact surface and the first contact surface; and a heat conductive member interposed between the first contact surface and the second contact surface, wherein the heat conductive member is made of a soft metal that is softer than at least one of a material of the first contact surface or a material of the second contact surface.Type: ApplicationFiled: December 15, 2023Publication date: June 27, 2024Inventors: Naoya FUKUDA, Motoi YAMAGATA, Hiroshi SONE
-
Publication number: 20230249306Abstract: A method of cooling a substrate by bringing a cooler into direct contact with a stage on which the substrate is placed, and processing the substrate while rotating the stage in a state in which the cooler is moved away from the stage, includes: cooling the cooler to a target temperature in a state in which the stage is brought into direct contact with the cooler, and cooling the stage to an initial cooling temperature; raising a temperature of the stage; controlling the temperature of the stage to a steady cooling temperature when the temperature of the stage reaches the steady cooling temperature; and placing the substrate on the stage kept at the steady cooling temperature, and continuously performing a substrate processing on a plurality of substrates while rotating the stage in a state in which the stage is moved away from the cooler.Type: ApplicationFiled: February 3, 2023Publication date: August 10, 2023Inventors: Yusuke KIKUCHI, Masato SHINADA, Motoi YAMAGATA, Hiroshi SONE
-
Patent number: 11532784Abstract: A substrate processing apparatus includes a processing chamber where a substrate support on which a substrate is placed and a target holder configured to hold a target are disposed, a freezing device disposed with a gap with respect to a bottom surface of the substrate support and having a chiller and a cold heat medium laminated on the chiller, and a rotating device configured to rotate the substrate support. The substrate processing apparatus further includes a first elevating device configured to raise and lower the substrate support, a coolant channel formed in the chiller to supply a coolant to the gap, and a cold heat transfer material disposed in the gap and being in contact with the substrate support and the cold heat medium so as to transfer heat therebetween.Type: GrantFiled: March 5, 2021Date of Patent: December 20, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Manabu Nakagawasai, Koji Maeda, Shinji Orimoto, Motoi Yamagata
-
Patent number: 11417504Abstract: A stage device includes a stage configured to hold a target substrate in a vacuum chamber, a cold heat transfer body fixedly disposed below a bottom surface of the stage with a gap between the stage and the cold heat transfer body and cooled to an extremely low temperature by a chiller disposed below the cold heat transfer body, and cooling fluid supplied to the gap to transfer cold heat of the cold heat transfer body to the stage. The stage device further includes a stage support configured to rotatably support the stage and formed in a cylindrical shape to surround an upper part of the cold heat transfer body wherein the stage support has a vacuum insulation structure, and a rotation part configured to support the stage support and rotated by a driving mechanism while being sealed with magnetic fluid.Type: GrantFiled: October 22, 2019Date of Patent: August 16, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Manabu Nakagawasai, Naoyuki Suzuki, Shinji Orimoto, Hiroyuki Yokohara, Motoi Yamagata, Koji Maeda
-
Publication number: 20220238314Abstract: A mounting table structure includes a mounting table on which a substrate is mounted, a refrigerating mechanism configured to cool the substrate, an elevating drive part configured to move the mounting table or the refrigerating mechanism up and down, and at least one contact provided at a position between the refrigerating mechanism and the mounting table which face each other. The refrigerating mechanism and the mounting table are allowed to be brought into contact with each other via the contact by moving the mounting table or the refrigerating mechanism up and down by the elevating drive part.Type: ApplicationFiled: January 13, 2022Publication date: July 28, 2022Inventors: Motoi YAMAGATA, Hiroshi SONE, Masato SHINADA
-
Publication number: 20220220606Abstract: There is provided a method for processing a substrate, comprising: preparing a substrate processing device including a rotatable stage on which a substrate is placed, a frozen heat transfer body fixed on a backside of the stage with a gap interposed therebetween and cooled to an extremely low temperature, a gas supply mechanism configured to supply to the gap a cooling gas for transferring a cold heat of the frozen heat transfer body to the stage, a rotation mechanism configured to rotate the stage, and a processing mechanism configured to process the substrate; preheating the stage such that a temperature of the stage reaches a steady cooling temperature within a fixed range; and after preheating, continuously processing a plurality of substrates by the processing mechanism while rotating the stage that has reached the steady cooling temperature in a state where a substrate having a specific temperature higher than or equal to room temperature is placed on the stage.Type: ApplicationFiled: July 21, 2020Publication date: July 14, 2022Inventors: Tamaki TAKEYAMA, Hiroaki CHIHAYA, Motoi YAMAGATA, Manabu NAKAGAWASAI, Shinji ORIMOTO
-
Publication number: 20220151078Abstract: There is provided a method for manufacturing a substrate with a sensor in which a sensor is disposed on a plate-shaped substrate. The method comprises: holding the sensor by a magnetic force from a position on an opposite surface of a surface of the plate-shaped substrate on which the sensor is disposed that corresponds to a position where the sensor is fixed; and fixing the sensor to the plate-shaped substrate by curing an adhesive attached to the sensor in a state where the sensor is held by the magnetic force.Type: ApplicationFiled: November 8, 2021Publication date: May 12, 2022Inventors: Manabu NAKAGAWASAI, Motoi YAMAGATA
-
Publication number: 20210280777Abstract: A substrate processing apparatus includes a processing chamber where a substrate support on which a substrate is placed and a target holder configured to hold a target are disposed, a freezing device disposed with a gap with respect to a bottom surface of the substrate support and having a chiller and a cold heat medium laminated on the chiller, and a rotating device configured to rotate the substrate support. The substrate processing apparatus further includes a first elevating device configured to raise and lower the substrate support, a coolant channel formed in the chiller to supply a coolant to the gap, and a cold heat transfer material disposed in the gap and being in contact with the substrate support and the cold heat medium so as to transfer heat therebetween.Type: ApplicationFiled: March 5, 2021Publication date: September 9, 2021Inventors: Manabu NAKAGAWASAI, Koji MAEDA, Shinji ORIMOTO, Motoi YAMAGATA
-
Publication number: 20200135434Abstract: A stage device includes a stage configured to hold a target substrate in a vacuum chamber, a cold heat transfer body fixedly disposed below a bottom surface of the stage with a gap between the stage and the cold heat transfer body and cooled to an extremely low temperature by a chiller disposed below the cold heat transfer body, and cooling fluid supplied to the gap to transfer cold heat of the cold heat transfer body to the stage. The stage device further includes a stage support configured to rotatably support the stage and formed in a cylindrical shape to surround an upper part of the cold heat transfer body wherein the stage support has a vacuum insulation structure, and a rotation part configured to support the stage support and rotated by a driving mechanism while being sealed with magnetic fluid.Type: ApplicationFiled: October 22, 2019Publication date: April 30, 2020Inventors: Manabu NAKAGAWASAI, Naoyuki SUZUKI, Shinji ORIMOTO, Hiroyuki YOKOHARA, Motoi YAMAGATA, Koji MAEDA