Abstract: A radio frequency circuit includes an antenna connection terminal, an input terminal, an output terminal, a filter having a pass band including at least part of a transmission band of Band A for FDD, a filter having a pass band including at least part of a reception band of the Band A, and a switch that includes terminals. The antenna connection terminal is connected to the terminal. The filter is connected between the terminal and the input terminal. The filter is connected between the terminal and the output terminal. The switch is configured to switch between first connection, second connection, and third connection. In the first connection, the terminal is connected to the terminal and the terminal is not connected to the terminal. In the second connection, the terminal is connected to the terminal and the terminal is not connected to the terminal.

Abstract: A semiconductor device comprises a heat-radiating electrode plate, a semiconductor element soldered to the depressed portion formed in the heat-radiating electrode plate, a header lead soldered onto the semiconductor element, a terminal board of insulating material fixed on the heat-radiating electrode plate, and a lead terminal secured to the terminal board and with the one end thereof electrically and mechanically connected to the header lead. The semiconductor device further comprises means for mitigating the transmission to the solder of the stress generated along the length of the header lead by the difference in the coefficient of thermal expansion among the component parts, and means for alleviating the lateral stress generated in the solder by the difference in the coefficient of thermal expansion between the header lead and the semiconductor element.