Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides; a transmission input terminal; a transmission power amplifier that amplifies a transmission signal input from the transmission input terminal; a switch that switches between connecting and disconnecting the transmission input terminal and the transmission power amplifier, and a control circuit that controls the transmission power amplifier using digital control signals. The switch is disposed on the first principal surface, and the control circuit is disposed on the second principal surface.

Abstract: A radio-frequency module includes a switch performing switching of the connection between a common terminal and a selection terminal, a reception filter having a reception band in a band A as a passband, a transmission filter that has a transmission band in a band B as a passband and has an output terminal connected to the selection terminal, a filter that has the transmission band in a band B as an attenuation band and has an input terminal connected to the selection terminal, a reception path which connects the selection terminal and an input terminal of the reception filter and on which the filter is disposed, a bypass path which connects the selection terminal and the input terminal of the reception filter and on which no filter is disposed, and a transmission path which connects the selection terminal and a transmission terminal and on which the transmission filter is disposed.

Abstract: A radio-frequency module includes a transmission path which has one end connected to a transmission terminal and on which a transmission signal in Band A is transmitted; a reception path (62) which has one end connected to a reception terminal (120B) and on which a reception signal in Band B is transmitted; a reception path (63) which has one end connected to a reception terminal (120C) and on which a reception signal in Band C is transmitted; a switch (11) having a common terminal (11a) and selection terminals (11b and 11c); and a switch (12) having a common terminal (12a) and selection terminals (12b and 12c).

Abstract: A high-frequency front end module includes a primary antenna terminal and a secondary antenna terminal, a first multiplexer and a second multiplexer, a switch circuit, and a first amplifier and a second amplifier. The first multiplexer has a first transmission filter and a first reception filter. The second multiplexer has a second transmission filter and a second reception filter. The switch circuit exclusively switches connection between the primary antenna terminal and the first multiplexer and connection between the primary antenna terminal and the second multiplexer, and exclusively switches connection between the secondary antenna terminal and the first multiplexer and connection between the secondary antenna terminal and the second multiplexer.

Abstract: A radio frequency module includes a substrate, a power amplifier that amplifies a transmission signal in a first communication band, a power amplifier that amplifies a transmission signal in a second communication band, and a power amplifier that amplifies a transmission signal in a third communication band. Simultaneous transmission can be performed in a combination of the first communication band and the third communication band. Simultaneous transmission cannot be performed in a combination of the first communication band and the second communication band and a combination of the second communication band and the third communication band. In plan view of the substrate, a distance between the output terminals of the power amplifier and the power amplifier is longer than a distance between the output terminals of the power amplifier and the power amplifier and a distance between the output terminals of the power amplifier and the power amplifier.

Abstract: A mounting substrate has one main surface (a first main surface). An electronic component has a first face, a second face, and a side face, and is provided on the one main surface of the mounting substrate. A solder bump is disposed between the mounting substrate and the electronic component, and electrically connects the mounting substrate and the electronic component. A resin layer is provided on the one main surface of the mounting substrate to cover the electronic component. The first face is a face of the electronic component at a side opposite to the mounting substrate. The side face of the electronic component is in contact with the resin layer. A space is provided between at least a part of the first face and the resin layer in a thickness direction of the mounting substrate.

Abstract: A radio-frequency module (1) includes a module substrate (70) having major surfaces (701 and 702) opposite to each other, external connection terminals (90a and 90b) disposed on the major surface (702), a power amplifier (11) having major surfaces (111 and 112) opposite to each other and being disposed on the major surface (702) such that the major surface (111) is a mounting surface on the module substrate (70), a bonding wire (45) coupled to the major surface (112), and a heat dissipation electrode (91) disposed apart from the power amplifier (11) on the major surface (112) side with respect to the power amplifier (11) and coupled to the bonding wire (45).

Abstract: A high-frequency front end module includes a primary antenna terminal and a secondary antenna terminal, a first multiplexer and a second multiplexer, a switch circuit, and a first amplifier and a second amplifier. The first multiplexer has a first transmission filter and a first reception filter. The second multiplexer has a second transmission filter and a second reception filter. The switch circuit exclusively switches connection between the primary antenna terminal and the first multiplexer and connection between the primary antenna terminal and the second multiplexer, and exclusively switches connection between the secondary antenna terminal and the first multiplexer and connection between the secondary antenna terminal and the second multiplexer.

Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier configured to amplify a radio frequency transmission signal that has been input through a transmission input terminal; a low noise amplifier configured to amplify a radio frequency reception signal; a switch disposed on the second principal surface and connected between the transmission input terminal and the power amplifier; and an inductor of a matching circuit connected to an input terminal of the low noise amplifier. In the radio frequency module, at least one of the low noise amplifier or the inductor is disposed on the first principal surface.

Abstract: A high-frequency front-end module includes transmission amplifier circuits, a transmission filter that is connected between a common terminal and the transmission amplifier circuit and has a transmission band of a band A as a pass band, a reception filter that is connected to the common terminal and has a reception band of a predetermined communication band as a pass band, in which a frequency of an intermodulation distortion generated by a transmission signal from the transmission amplifier circuit and a transmission signal from the transmission amplifier circuit overlaps the pass band, and a band elimination filter that is disposed in a signal path connecting an output terminal of the transmission amplifier circuit and the transmission filter, and has a transmission band of the band A as a pass band and a transmission band of a band B as an attenuation band.

Abstract: A radio-frequency module includes a transmission path which has one end connected to a transmission terminal and on which a transmission signal in Band A is transmitted; a reception path (62) which has one end connected to a reception terminal (120B) and on which a reception signal in Band B is transmitted; a reception path (63) which has one end connected to a reception terminal (120C) and on which a reception signal in Band C is transmitted; a switch (11) having a common terminal (11a) and selection terminals (11b and 11c); and a switch (12) having a common terminal (12a) and selection terminals (12b and 12c).

Abstract: A radio-frequency module includes a switch performing switching of the connection between a common terminal and a selection terminal, a reception filter having a reception band in a band A as a passband, a transmission filter that has a transmission band in a band B as a passband and has an output terminal connected to the selection terminal, a filter that has the transmission band in a band B as an attenuation band and has an input terminal connected to the selection terminal, a reception path which connects the selection terminal and an input terminal of the reception filter and on which the filter is disposed, a bypass path which connects the selection terminal and the input terminal of the reception filter and on which no filter is disposed, and a transmission path which connects the selection terminal and a transmission terminal and on which the transmission filter is disposed.

Abstract: A high-frequency front end module includes a primary antenna terminal and a secondary antenna terminal, a first multiplexer and a second multiplexer, a switch circuit, and a first amplifier and a second amplifier. The first multiplexer has a first transmission filter and a first reception filter. The second multiplexer has a second transmission filter and a second reception filter. The switch circuit exclusively switches connection between the primary antenna terminal and the first multiplexer and connection between the primary antenna terminal and the second multiplexer, and exclusively switches connection between the secondary antenna terminal and the first multiplexer and connection between the secondary antenna terminal and the second multiplexer.

Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides; a transmission input terminal; a transmission power amplifier that amplifies a transmission signal input from the transmission input terminal; a switch that switches between connecting and disconnecting the transmission input terminal and the transmission power amplifier, and a control circuit that controls the transmission power amplifier using digital control signals. The switch is disposed on the first principal surface, and the control circuit is disposed on the second principal surface.

Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier configured to amplify a radio frequency transmission signal that has been input through a transmission input terminal; a low noise amplifier configured to amplify a radio frequency reception signal; a switch disposed on the second principal surface and connected between the transmission input terminal and the power amplifier; and an inductor of a matching circuit connected to an input terminal of the low noise amplifier. In the radio frequency module, at least one of the low noise amplifier or the inductor is disposed on the first principal surface.

Abstract: A high-frequency front end module includes a primary antenna and a secondary antenna, a first multiplexer and a second multiplexer, and a switch circuit, in which the first multiplexer has a transmission filter of a band A and a reception filter of the band A, and does not have a transmission filter of a band B, the second multiplexer has a transmission filter of the band B and a reception filter of the band B, and does not have a transmission filter of the band A, and the switch circuit exclusively switches connection between the primary antenna and the first multiplexer and connection between the primary antenna and the second multiplexer, and exclusively switches connection between the secondary antenna and the first multiplexer and connection between the secondary antenna and the second multiplexer.

Abstract: A high frequency module includes a transmission power amplifier, a bump electrode connected to the transmission power amplifier, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view of the mounting board, a board main part placed outside the via conductor, and an insulating part placed inside the via conductor, and the bump electrode and the via conductor are connected while at least partially overlapping each other in the foregoing plan view, and the board main part and the insulating part are each composed of an insulating material of the same kind.

Abstract: A radio-frequency module includes: a transmission power amplifier that includes first and second amplification transistors that are cascade connected to each other; and a mounting substrate that has first and second main surface that face each other, the transmission power amplifier being mounted on the first main surface. The first amplification transistor is arranged in a final stage and has a first emitter terminal. The second amplification transistor is arranged in a stage preceding the first amplification transistor and has a second emitter terminal. The mounting substrate has first to fourth ground electrode layers in order of proximity to the first main surface. The first emitter terminal and the second emitter terminal are not electrically connected to each other via an electrode on the first main surface and are not electrically connected to each other via the first ground electrode layer.

Abstract: A high frequency module includes a transmission power amplifier, a bump electrode connected to a principal surface of the transmission power amplifier and having an elongated shape in a plan view of the principal surface, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view, the length direction of the bump electrode and the length direction of the via conductor are aligned in the plan view, and the bump electrode and the via conductor are connected in an overlapping area where the bump electrode and the via conductor overlap at least partially in the plan view, and the overlapping area is an area elongated in the length direction.

Abstract: A high-frequency front-end module includes transmission amplifier circuits, a transmission filter that is connected between a common terminal and the transmission amplifier circuit and has a transmission band of a band A as a pass band, a reception filter that is connected to the common terminal and has a reception band of a predetermined communication band as a pass band, in which a frequency of an intermodulation distortion generated by a transmission signal from the transmission amplifier circuit and a transmission signal from the transmission amplifier circuit overlaps the pass band, and a band elimination filter that is disposed in a signal path connecting an output terminal of the transmission amplifier circuit and the transmission filter, and has a transmission band of the band A as a pass band and a transmission band of a band B as an attenuation band.