Patents by Inventor Motoji TSUDA

Motoji TSUDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12047106
    Abstract: A radio-frequency module (1) includes a module substrate (70) having major surfaces (701 and 702) opposite to each other, external connection terminals (90a and 90b) disposed on the major surface (702), a power amplifier (11) having major surfaces (111 and 112) opposite to each other and being disposed on the major surface (702) such that the major surface (111) is a mounting surface on the module substrate (70), a bonding wire (45) coupled to the major surface (112), and a heat dissipation electrode (91) disposed apart from the power amplifier (11) on the major surface (112) side with respect to the power amplifier (11) and coupled to the bonding wire (45).
    Type: Grant
    Filed: January 4, 2022
    Date of Patent: July 23, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Motoji Tsuda, Yukiya Yamaguchi
  • Publication number: 20240204808
    Abstract: A radio-frequency module includes: a module substrate; multiple external connection terminals that are arranged on a main surface of the module substrate; an integrated circuit that is arranged on a main surface of the module substrate; a shield layer that is arranged above the main surface of the integrated circuit; and a metal member that is arranged between the main surface of the integrated circuit and the shield layer. The integrated circuit includes transistors arranged on the main surface and constituting a power amplifier and via conductors connecting the transistors to the metal member. The metal member at least partially overlaps the via conductors and at least partially overlaps the shield layer in a plan view of the module substrate.
    Type: Application
    Filed: December 12, 2023
    Publication date: June 20, 2024
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Mayuka ONO, Motoji TSUDA, Yoshiaki SUKEMORI
  • Publication number: 20240178871
    Abstract: A radio-frequency module including a module substrate, a plurality of electronic components, a plurality of external connection terminals, a resin member, and a plurality of electrodes. The module substrate has first and second major surfaces that are opposite to each other. The plurality of electronic components are disposed at the major surface and at the major surface. The external connection terminals are disposed at the major surface and include a first external connection terminal. The resin member is disposed at the major surface. The plurality of electrodes are disposed at the major surface and coupled to the plurality of external connection terminals. The plurality of electronic components include a passive component disposed at the major surface. At least a portion of the first external connection terminal overlaps at least a portion of the passive component in plan view of the module substrate.
    Type: Application
    Filed: February 9, 2024
    Publication date: May 30, 2024
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Takashi YAMADA, Kiyoshi AIKAWA, Motoji TSUDA
  • Patent number: 11942973
    Abstract: A radio frequency module includes a substrate, a power amplifier that amplifies a transmission signal in a first communication band, a power amplifier that amplifies a transmission signal in a second communication band, and a power amplifier that amplifies a transmission signal in a third communication band. Simultaneous transmission can be performed in a combination of the first communication band and the third communication band. Simultaneous transmission cannot be performed in a combination of the first communication band and the second communication band and a combination of the second communication band and the third communication band. In plan view of the substrate, a distance between the output terminals of the power amplifier and the power amplifier is longer than a distance between the output terminals of the power amplifier and the power amplifier and a distance between the output terminals of the power amplifier and the power amplifier.
    Type: Grant
    Filed: February 15, 2022
    Date of Patent: March 26, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Motoji Tsuda
  • Publication number: 20240048163
    Abstract: A radio frequency circuit performs MIMO transmission in a band A and uplink communications in the band A and a band B and includes a power amplifier that amplifies a signal in the band A; a power amplifier that amplifies signals in the bands A and B; a filter that has a pass band including the band A; a filter that has a pass band including the band B; a filter that has a pass band including the band A; and a switch that simultaneously connects a terminal to a terminal and a terminal to a terminal and simultaneously connects the terminal to the terminal (32c) and the terminal to a terminal. The terminal is connected to the power amplifier, the terminal is connected to the power amplifier, the terminal is connected to the filter, the terminal is connected to the filter, and the terminal is connected to the filter.
    Type: Application
    Filed: October 23, 2023
    Publication date: February 8, 2024
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Motoji TSUDA
  • Patent number: 11863215
    Abstract: A high-frequency front end module includes a primary antenna terminal and a secondary antenna terminal, a first multiplexer and a second multiplexer, a switch circuit, and a first amplifier and a second amplifier. The first multiplexer has a first transmission filter and a first reception filter. The second multiplexer has a second transmission filter and a second reception filter. The switch circuit exclusively switches connection between the primary antenna terminal and the first multiplexer and connection between the primary antenna terminal and the second multiplexer, and exclusively switches connection between the secondary antenna terminal and the first multiplexer and connection between the secondary antenna terminal and the second multiplexer.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: January 2, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Motoji Tsuda, Takayuki Nakamura, Daerok Oh
  • Publication number: 20230396278
    Abstract: In a radio-frequency module, an electronic component includes a first transmission filter, a second transmission filter, a first input terminal and a first output terminal, and a second input terminal and a second output terminal. The first input terminal is connected to an input end of a signal path of the first transmission filter. The second input terminal is connected to an input end of a signal path of the second transmission filter. The first transmission filter includes a first substrate. The second transmission filter includes a second substrate. The first substrate and the second substrate are common. The electronic component further includes a metallic member at ground potential. In the electronic component, the metallic member is arranged between the first input terminal and the second input terminal in a side view.
    Type: Application
    Filed: August 22, 2023
    Publication date: December 7, 2023
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Motoji TSUDA
  • Publication number: 20230307458
    Abstract: An integrated circuit includes a first base that has at least a part formed of a first semiconductor material and that, in plan view, has a central area and a peripheral area surrounding the central area, and a second base that has at least a part formed of a second semiconductor material different from the first semiconductor material and that includes a power amplifier circuit. In plan view, the second base is overlain by the central area, and does not overlap the peripheral area.
    Type: Application
    Filed: May 30, 2023
    Publication date: September 28, 2023
    Inventors: Motoji TSUDA, Mikiko FUKASAWA, Satoshi GOTO, Shunji YOSHIMI, Toshiki MATSUI
  • Publication number: 20230308121
    Abstract: Heat dissipation properties of a power amplifier is improved. A high-frequency module includes a mounting substrate, at least one power amplifier, an electronic component, a resin layer, a conductive member, and a plurality of via conductors. The power amplifier is mounted on a first main surface of the mounting substrate. The electronic component is mounted on a second main surface of the mounting substrate. The resin layer is disposed on the first main surface of the mounting substrate, and covers at least a part of the power amplifier. The conductive member covers at least a part of the resin layer, and covers at least a part of an outer peripheral surface of the mounting substrate. The plurality of via conductors is connected to the power amplifier, and passes through the mounting substrate. At least one via conductor of the plurality of via conductors is in contact with the conductive member.
    Type: Application
    Filed: May 17, 2023
    Publication date: September 28, 2023
    Inventors: Mayuka ONO, Motoji TSUDA, Keisuke ARIMA
  • Publication number: 20230299061
    Abstract: A radio frequency module includes a module substrate having major surfaces that face each other, a first base part that is at least partially comprised of a first semiconductor material and in which an electronic circuit is formed, a second base part that is at least partially comprised of a second semiconductor material different from the first semiconductor material and in which a power amplifier is formed, and a switch connected to an output terminal of the power amplifier. The first base part is disposed on or over the major surface; the second base part is disposed between the module substrate and the first base part, is joined to the first base part, and is connected to the major surface via an electrode; and the switch is disposed on or over the major surface.
    Type: Application
    Filed: May 25, 2023
    Publication date: September 21, 2023
    Inventors: Yukiya YAMAGUCHI, Takanori UEJIMA, Motoji TSUDA, Yuji TAKEMATSU, Shunji YOSHIMI, Satoshi ARAYASHIKI, Mitsunori SAMATA, Satoshi GOTO, Masayuki AOIKE
  • Publication number: 20230299804
    Abstract: A radio-frequency module includes a module substrate that has a principal surface, an integrated circuit on the principal surface that includes a power amplifier circuit, and an SMD on the principal surface that includes a circuit device directly connected to the power amplifier circuit. The integrated circuit includes a first base that has at least a part formed of a first semiconductor material, and a second base that has at least a part formed of a second semiconductor material and that includes the power amplifier circuit. The first base has two sides that are opposite each other in plan view. The SMD is closer to one side than the other side in plan view. In plan view, the second base is smaller than the first base and is overlain by the first base at a position closer to the one side than to the other side.
    Type: Application
    Filed: May 25, 2023
    Publication date: September 21, 2023
    Inventors: Motoji TSUDA, Mikiko FUKASAWA, Shunji YOSHIMI, Satoshi GOTO
  • Publication number: 20230282620
    Abstract: An integrated circuit includes a first base that has at least a part formed of a first semiconductor material and that includes an electric circuit, a second base that has at least a part formed of a second semiconductor material having a thermal conductivity lower than the first semiconductor material and that includes a power amplifier circuit, and a high thermal conductive member that has at least a part formed of a high thermal conductive material having a thermal conductivity higher than the first semiconductor material and that is disposed between the electric circuit and the power amplifier circuit. At least a part of the high thermal conductive member overlaps at least a part of the first base and at least a part of the second base in plan view. The high thermal conductive member is in contact with the first base and the second base.
    Type: Application
    Filed: May 11, 2023
    Publication date: September 7, 2023
    Inventors: Yukiya YAMAGUCHI, Takanori UEJIMA, Motoji TSUDA, Yuji TAKEMATSU, Shunji YOSHIMI, Satoshi ARAYASHIKI, Mitsunori SAMATA, Satoshi GOTO, Yutaka SASAKI, Masayuki AOIKE
  • Publication number: 20230231582
    Abstract: A radio frequency module includes a module substrate; a power amplifier disposed on or over the module substrate, amplifies a radio frequency signal, and outputs the amplified radio frequency signal as the first transmission signal; a power amplifier disposed on or over the module substrate, amplifies a radio frequency signal, and outputs the amplified radio frequency signal as the second transmission signal; a temperature sensor disposed on or over the module substrate; and a PA control circuit disposed on or over the module substrate and controls amplification operations of the power amplifiers according to a measurement value of the temperature sensor. The maximum output power of the power amplifier is greater than the maximum output power of the power amplifier, and the distance between the temperature sensor and the power amplifier is less than or equal to the distance between the temperature sensor and the power amplifier.
    Type: Application
    Filed: March 22, 2023
    Publication date: July 20, 2023
    Inventors: Motoji TSUDA, Hayato NAKAMURA
  • Publication number: 20230223970
    Abstract: In a radio-frequency module, a conductive layer covers a major surface opposite to the mounting board side of a resin layer and a major surface opposite to the mounting board side of an electronic component. The electronic component includes an electronic component body and a plurality of outer electrodes. The electronic component body includes an electrical insulating portion and a conductive portion provided inside the electrical insulating portion, forming at least a portion of a circuit element of the electronic component. The electronic component body has a third major surface and a fourth major surface opposite to each other, and an outer side surface. The third major surface forms the major surface of the electronic component, and the third major surface is in contact with the conductive layer. The plurality of outer electrodes are provided on the fourth major surface, but are not extended over the third major surface.
    Type: Application
    Filed: March 14, 2023
    Publication date: July 13, 2023
    Inventors: Takanori UEJIMA, Dai NAKAGAWA, Yukiya YAMAGUCHI, Yuji TAKEMATSU, Motoji TSUDA, Mayuka ONO, Hiroki FUJIWARA, Kiyoshi AIKAWA, Takashi YAMADA
  • Publication number: 20230223968
    Abstract: A radio-frequency module includes a first base, which has at least a part formed of a first semiconductor material and which includes a low-noise amplifier circuit, a second base, which has at least a part formed of a second semiconductor material having a thermal conductivity lower than that of the first semiconductor material and which includes a power amplifier circuit, and a module substrate, which has a principal surface on which the first base and the second base are disposed. The first base is joined to the principal surface with electrodes interposed in between. The second base is disposed between the module substrate and the first base in cross-sectional view, and is joined to the principal surface with an electrode interposed in between. At least a part of the first base overlaps at least a part of the second base in plan view.
    Type: Application
    Filed: March 14, 2023
    Publication date: July 13, 2023
    Inventors: Motoji TSUDA, Yukiya YAMAGUCHI, Takanori UEJIMA
  • Publication number: 20230208452
    Abstract: A high-frequency front end module includes a primary antenna terminal and a secondary antenna terminal, a first multiplexer and a second multiplexer, a switch circuit, and a first amplifier and a second amplifier. The first multiplexer has a first transmission filter and a first reception filter. The second multiplexer has a second transmission filter and a second reception filter. The switch circuit exclusively switches connection between the primary antenna terminal and the first multiplexer and connection between the primary antenna terminal and the second multiplexer, and exclusively switches connection between the secondary antenna terminal and the first multiplexer and connection between the secondary antenna terminal and the second multiplexer.
    Type: Application
    Filed: February 16, 2023
    Publication date: June 29, 2023
    Inventors: Motoji TSUDA, Takayuki NAKAMURA, Daerok OH
  • Publication number: 20230145698
    Abstract: A radio-frequency module includes a power amplifier, a power amplifier, a low noise amplifier, a duplexer that has a passband including a communication band A included in a communication band group X and that is connected to the power amplifier and the low noise amplifier, a duplexer that has a passband including a communication band C included in a communication band group Y lower than the communication band group X and that is connected to the power amplifier, and a module substrate having the power amplifier, the power amplifier, the low noise amplifier, and the duplexers arranged thereon. In a plan view of the module substrate, a distance between the power amplifier and the low noise amplifier is longer than a distance between the power amplifier and the low noise amplifier.
    Type: Application
    Filed: January 13, 2023
    Publication date: May 11, 2023
    Inventors: Hiromichi KITAJIMA, Takanori UEJIMA, Kunitoshi HANAOKA, Motoji TSUDA
  • Patent number: 11631659
    Abstract: A high-frequency module includes a mounting substrate having main surfaces 30a and 30b, a first circuit component mounted on the main surface 30a, a second circuit component mounted on the main surface 30b, an external connection terminal arranged on the main surface 30b side relative to the main surface 30a with respect to the mounting substrate, a long via conductor connected to the first circuit component, passing through the mounting substrate, and having a substantially long shape when the mounting substrate is viewed in a plan view, and a metal block arranged on the main surface 30b side relative to the main surface 30a with respect to the mounting substrate and connecting the long via conductor and the external connection terminal. When the mounting substrate is viewed in a plan view, the first circuit component overlaps the long via conductor and the metal block overlaps the long via conductor.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: April 18, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Motoji Tsuda, Takanori Uejima, Yuji Takematsu, Katsunari Nakazawa, Masahide Takebe, Shou Matsumoto, Naoya Matsumoto, Yutaka Sasaki, Yuuki Fukuda
  • Patent number: 11621732
    Abstract: A high-frequency front end module includes a primary antenna terminal and a secondary antenna terminal, a first multiplexer and a second multiplexer, a switch circuit, and a first amplifier and a second amplifier. The first multiplexer has a first transmission filter and a first reception filter. The second multiplexer has a second transmission filter and a second reception filter. The switch circuit exclusively switches connection between the primary antenna terminal and the first multiplexer and connection between the primary antenna terminal and the second multiplexer, and exclusively switches connection between the secondary antenna terminal and the first multiplexer and connection between the secondary antenna terminal and the second multiplexer.
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: April 4, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Motoji Tsuda, Takayuki Nakamura, Daerok Oh
  • Patent number: 11528000
    Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides; a transmission input terminal; a transmission power amplifier that amplifies a transmission signal input from the transmission input terminal; a switch that switches between connecting and disconnecting the transmission input terminal and the transmission power amplifier, and a control circuit that controls the transmission power amplifier using digital control signals. The switch is disposed on the first principal surface, and the control circuit is disposed on the second principal surface.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: December 13, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Motoji Tsuda