Abstract: According to one embodiment, a transfer apparatus includes a suction hand, a moving device, a first detector, and a controller. The suction hand includes a first and second suction units. The first and second suction units are configured to contact with an article in a first direction and a second direction, respectively. the first suction unit and the second suction unit each are provided multiply in a third direction. The controller performs at least a first operation and a second operation. In the first operation, the first suction units respectively suction first surfaces of the articles, the second suction units respectively suction second surfaces of the articles, and the articles are moved. In the second operation, one of the first suction units suctions the first surface of one of the articles, the second suction units do not suction the articles, and the one of the articles is moved.

Abstract: According to one embodiment, a hand includes a first holding unit, and a second holding unit. The first holding unit includes a plurality of first holding portions capable of holding an article. A plurality of the first holding units is provided in a second direction and is movable independently of each other in a first direction crossing the second direction. The second holding unit is movable in a third direction crossing a plane parallel to the first direction and the second direction. The second holding unit includes a plurality of second holding portions capable of holding the article.

Abstract: According to one embodiment, a holding device includes a first holder configured to hold an upper surface of an article, and a second holder configured to hold a side surface of the article. The holding device performs at least a first operation of the first and second holders holding the article, and a second operation of only the first holder holding the article.

Abstract: A semiconductor-chip exfoliating device for exfoliating a semiconductor chip 1 from an adhesive sheet 6 is provided. The device includes a backup holder 28 for holding the adhesive sheet 6 so that semiconductor chips 1 turn upward, a pair of needle pins arranged on a backside of the holder 28 to lift off the adhesive sheet 6 from the holder 28 through through-holes 31a, 31b in the holder 28 and a sliding unit 33 arranged on the backside of the holder 28 to slide one needle pin 30b in a direction to depart from the other needle pin 30a. By the sliding unit 33, the interval between the needle pins 30a, 30b can be changed so as to cope with a variation of semiconductor chips 1, 1A.

Abstract: A semiconductor-chip exfoliating device for exfoliating a semiconductor chip 1 from an adhesive sheet 6 is provided. The device includes a backup holder 28 for holding the adhesive sheet 6 so that semiconductor chips 1 turn upward, a pair of needle pins arranged on a backside of the holder 28 to lift off the adhesive sheet 6 from the holder 28 through through-holes 31a, 31b in the holder 28 and a sliding unit 33 arranged on the backside of the holder 28 to slide one needle pin 30b in a direction to depart from the other needle pin 30a. By the sliding unit 33, the interval between the needle pins 30a, 30b can be changed so as to cope with a variation of semiconductor chips 1, 1A.

Abstract: An apparatus for manufacturing a semiconductor device comprises a planarization mechanism section which pressurizes a top of a bump that is provided onto at least one of a substrate and a semiconductor chip and makes the top of the bump flat, and a bonding mechanism section which bonds the substrate with the semiconductor chip via the bump whose top has been made flat by the planarization mechanism section. The planarization mechanism section has a bump recognition camera which takes an image of bumps, a planarization tool with a pressurizing surface which pressurizes the top of the bump, and a driving mechanism which controls to move the planarization tool to a position of the bump detected by the bump recognition camera, the driving mechanism comprising a pressurization mechanism which presses the pressurizing surface of the planarization tool against the bump.

Abstract: A method of bonding a semiconductor chip, including step of photographing a surface of a semiconductor chip, on which an electrode is formed, and detecting a relative position of the electrode with respect to the semiconductor chip, a bonding step of making the electrode of the semiconductor chip to face a circuit pattern provided on a substrate, and bonding the electrode to the circuit pattern, a step of photographing the substrate on which the semiconductor chip is formed, and detecting a relative position of the semiconductor chip with respect to the substrate. Also included is a step of evaluating a bonding accuracy by calculating a relative position of the electrode with respect to the substrate from the relative position of the semiconductor chip with respect to the substrate and the relative position of the electrode with respect to the semiconductor chip.