Abstract: According to the sewing system of the present embodiment, the sewing machine and the robot arm are fixedly supported at the fixed positions by the base. Therefore, when a target position of the robot arm for the sewing operation is set once, a relative positional relation between the robot arm and the sewing machine is kept by the base even though the sewing system is entirely moved. Therefore, it is not necessary to again perform a setting operation of the target position for the sewing operation, so that the burdens on the teaching operation and the other setting operations are reduced.

Abstract: According to the sewing system of the present embodiment, the sewing machine and the robot arm are fixedly supported at the fixed positions by the base. Therefore, when a target position of the robot arm for the sewing operation is set once, a relative positional relation between the robot arm and the sewing machine is kept by the base even though the sewing system is entirely moved. Therefore, it is not necessary to again perform a setting operation of the target position for the sewing operation, so that the burdens on the teaching operation and the other setting operations are reduced.

Abstract: A light receiving device includes an optical substrate disposed over a light receiving surface. In the optical substrate, a first optical multilayer film is formed on an incident surface, a second optical multilayer film is formed on a surface opposite the incident surface, and a third optical multilayer film is formed on the light receiving surface. Light of two wavelength regions separated from each other is transmitted, and light of wavelength regions other than the two wavelength regions is blocked. The two wavelength regions include a first wavelength region on the short wavelength side and a second wavelength region on the long wavelength side. At least a predetermined proportion of light of the second wavelength region is transmitted, and the transmittance of light of the first wavelength region is limited within a predetermined range less than the predetermined proportion.

Abstract: A light receiving device includes an optical substrate disposed over a light receiving surface. In the optical substrate, a first optical multilayer film is formed on an incident surface, a second optical multilayer film is formed on a surface opposite the incident surface, and a third optical multilayer film is formed on the light receiving surface. Light of two wavelength regions separated from each other is transmitted, and light of wavelength regions other than the two wavelength regions is blocked. The two wavelength regions include a first wavelength region on the short wavelength side and a second wavelength region on the long wavelength side. At least a predetermined proportion of light of the second wavelength region is transmitted, and the transmittance of light of the first wavelength region is limited within a predetermined range less than the predetermined proportion.

Abstract: An operation body is oscillatably supported by a fulcrum member. One side of the operation body is in contact with a projection of an actuator of a pressing force sensor, and a preload is applied to another side of the operation body by a compression coil spring as a preloading elastic member. By the preload, a detection output of the pressing force sensor is set at a neutral point. An operating force by which the one side of the operation body is pressed and an operating force by which the other side of the operation body is pressed can be distinctly detected with the single pressing force sensor.

Abstract: A sensor substrate includes a plurality of piezoresistance elements. The electrical resistance of each piezoresistance element changes in accordance with an amount of displacement of a displacement portion displaced by an external load applied through a pressure receiving unit. A base substrate supports the sensor substrate. The sensor substrate and the base substrate each include a support supporting the displacement portion such that the displacement portion can be displaced and a plurality of electrically connecting portions electrically connected to the plurality of piezoresistance elements. The supports of the sensor and base substrates are joined to each other and the plurality of electrically connecting portions of the sensor and base substrates are joined to each other. Furthermore, in each of the sensor and base substrates, either the support or the plurality of electrically connecting portions or both extend to the periphery of the sensor substrate or the base substrate.

Abstract: A sensor substrate includes a plurality of piezoresistance elements. The electrical resistance of each piezoresistance element changes in accordance with an amount of displacement of a displacement portion displaced by an external load applied through a pressure receiving unit. A base substrate supports the sensor substrate. The sensor substrate and the base substrate each include a support supporting the displacement portion such that the displacement portion can be displaced and a plurality of electrically connecting portions electrically connected to the plurality of piezoresistance elements. The supports of the sensor and base substrates are joined to each other and the plurality of electrically connecting portions of the sensor and base substrates are joined to each other. Furthermore, in each of the sensor and base substrates, either the support or the plurality of electrically connecting portions or both extend to the periphery of the sensor substrate or the base substrate.

Abstract: In a magnetic detection device using a magnetic resistance element, the resistance of a layer having a multi-layer structure can be easily adjusted without causing damages to the layer. A magneto-resistance layer is connected in series to a reference resistance layer, and a magneto-resistance layer is connected in series to a reference resistance layer on a substrate. A voltage is applied between a power supply layer and a grounding layer. A first output conductive layer and the reference resistance layer extend in parallel to each other so that they are partially electrically connected to each other via a connection layer. A second output conductive layer and the reference resistance layer extend in parallel to each other so that they are partially electrically connected to each other via a connection layer. Accordingly, it is possible to adjust the resistance of the reference resistance layers by selecting the respective positions of the connection layers.

Abstract: In a magnetic detection device using a magnetic resistance element, the resistance of a layer having a multi-layer structure can be easily adjusted without causing damages to the layer. A magneto-resistance layer is connected in series to a reference resistance layer, and a magneto-resistance layer is connected in series to a reference resistance layer on a substrate. A voltage is applied between a power supply layer and a grounding layer. A first output conductive layer and the reference resistance layer extend in parallel to each other so that they are partially electrically connected to each other via a connection layer. A second output conductive layer and the reference resistance layer extend in parallel to each other so that they are partially electrically connected to each other via a connection layer. Accordingly, it is possible to adjust the resistance of the reference resistance layers by selecting the respective positions of the connection layers.

Abstract: In a magnetic detection device using a magnetic resistance element, the resistance of a layer having a multi-layer structure can be easily adjusted without causing damages to the layer. A magneto-resistance layer is connected in series to a reference resistance layer, and a magneto-resistance layer is connected in series to a reference resistance layer on a substrate. A voltage is applied between a power supply layer and a grounding layer. A first output conductive layer and the reference resistance layer extend in parallel to each other so that they are partially electrically connected to each other via a connection layer. A second output conductive layer and the reference resistance layer extend in parallel to each other so that they are partially electrically connected to each other via a connection layer. Accordingly, it is possible to adjust the resistance of the reference resistance layers by selecting the respective positions of the connection layers.

Abstract: A magnetic detection device has stable characteristics having an area of a resist layer covering an insulating passivation layer, forming the magnetic detection element and a connection layer on a small stepped surface with high-precision, and preventing the resist layer from peeling, thereby providing a method of manufacturing the magnetic detection device. A resist layer 42 is overlapped through the insulating passivation layer 41 on an interconnection layer 35.

Abstract: A thermal head includes a large number of heating resistors disposed at a regular interval, individual conductors individually connected to each of the heating resistors, and common conductors connected to each of the heating resistors in common, the individual conductors and the common conductors serving as conductors for supplying the heating resistors with a current. In the thermal head, an underlayer having a large number of irregularities is provided and a conductor layer is provided on the underlayer along the irregularities. Thereby, bonding pads that are composed of the conductor layer and that have irregularities are provided as electrodes of the individual conductors or the common conductors.

Abstract: A thermal head includes a large number of heating resistors disposed at a regular interval, individual conductors individually connected to each of the heating resistors, and common conductors connected to each of the heating resistors in common, the individual conductors and the common conductors serving as conductors for supplying the heating resistors with a current. In the thermal head, an underlayer having a large number of irregularities is provided and a conductor layer is provided on the underlayer along the irregularities. Thereby, bonding pads that are composed of the conductor layer and that have irregularities are provided as electrodes of the individual conductors or the common conductors.