Abstract: A semiconductor inspection apparatus of this disclosure is a semiconductor inspection apparatus that performs a visual inspection of, as an inspection target, a semiconductor module on a surface of which a plurality of semiconductor devices connected to one another by a wire is mounted. This semiconductor inspection apparatus includes a first light source that is arranged in a first casing, emits light in a specific wavelength band or white light, and constitutes a part of a coaxial vertical illumination system for the inspection target, and a second light source that obliquely irradiates the inspection target with light in at least one wavelength range among a red band, a blue band, and an infrared range from a light source that is arranged in a ring shape around an optical axis of incident light of the coaxial vertical illumination system.

Abstract: An object of the present invention is to accurately measure the heights of wire loops densely disposed in a power module. A semiconductor manufacturing inspection system includes: an single-color illumination unit including a plurality of LED chips to emit light beams to a plurality of wire loops connected to surfaces of semiconductor elements; a camera to capture images of the wire loops; and an image processor to recognize an imaging region of each of the wire loops from the images, based on a luminance value and to measure the height of each of the wire loops based on the imaging region of the wire loop in the images. The LED chips emit the light beams to the separate wire loops, and the light beams emitted from two of the LED chips to adjacent two of the wire loops differ in luminance.

Abstract: An object of the present invention is to accurately measure the heights of wire loops densely disposed in a power module. A semiconductor manufacturing inspection system includes: an single-color illumination unit including a plurality of LED chips to emit light beams to a plurality of wire loops connected to surfaces of semiconductor elements; a camera to capture images of the wire loops; and an image processor to recognize an imaging region of each of the wire loops from the images, based on a luminance value and to measure the height of each of the wire loops based on the imaging region of the wire loop in the images. The LED chips emit the light beams to the separate wire loops, and the light beams emitted from two of the LED chips to adjacent two of the wire loops differ in luminance.