Abstract: A vertical layer stack including a bit-line-level dielectric layer and an etch stop dielectric layer can be formed over an array region. Bit-line trenches are formed through the vertical layer stack. Bit-line-trench fill structures are formed in the bit-line trenches. Each of the bit-line-trench fill structures includes a stack of a bit line and a capping dielectric strip. At least one via-level dielectric layer can be formed over the vertical layer stack. A bit-line-contact via cavity can be formed through the at least one via-level dielectric layer and one of the capping dielectric strips. A bit-line-contact via structure formed in the bit-line-contact via cavity includes a stepped bottom surface including a top surface of one of the bit lines, a sidewall segment of the etch stop dielectric layer, and a segment of a top surface of the etch stop dielectric layer.

Abstract: An electric wheelchair includes a main frame; a drivable wheel supported by the main frame; an electric motor disposed on the main frame and configured to drive the drivable wheel; a clutch configured to switch a power transmission path from the electric motor to the drivable wheel between an engagement state and a disengagement state; and a clutch operation handle configured to be moved in a predetermined range in an up-down direction. The clutch operation handle is configured to operate the clutch so as to be in: (i) one of the engagement state or the disengagement state when the clutch operation handle is stopped at a lowest position of the predetermined range; and (ii) the other of the engagement state or the disengagement state when the clutch operation handle is stopped at a highest position of the predetermined range.

Abstract: A wafer processing method includes: a holding step of holding a wafer on a chuck table through a dicing tape; and a dividing step of cutting the wafer along division lines by a cutting blade. In the dividing step, cleaning water including pure water mixed with carbon dioxide is supplied to the front surface of the wafer, and cutting water including pure water alone or pure water mixed with carbon dioxide in a concentration lower than that of the cleaning water is supplied to the cutting blade. During cutting, therefore, the cleaning water and the cutting water are always shielded by each other. Consequently, the cutting blade can be prevented from being corroded or excessively worn due to the cleaning water, and the cutting water can be prevented from contacting the front surface of the wafer to cause electrostatic discharge damage to the devices.

Abstract: A wafer processing method includes: a holding step of holding a wafer on a chuck table through a dicing tape; and a dividing step of cutting the wafer along division lines by a cutting blade. In the dividing step, cleaning water including pure water mixed with carbon dioxide is supplied to the front surface of the wafer, and cutting water including pure water alone or pure water mixed with carbon dioxide in a concentration lower than that of the cleaning water is supplied to the cutting blade. During cutting, therefore, the cleaning water and the cutting water are always shielded by each other. Consequently, the cutting blade can be prevented from being corroded or excessively worn due to the cleaning water, and the cutting water can be prevented from contacting the front surface of the wafer to cause electrostatic discharge damage to the devices.

Abstract: In a bed having a load detection function, a load detector attached to a bed main body includes a load cell provided at a site which is positioned at any location on a load transmission path extending from a bed surface-forming portion to a bed installation surface, and at which a load from the bed surface-forming portion side is received and the load is transmitted to a configuration member of the installation surface side. The load cell includes a load-receiving member, and a base body which is separated from the load-receiving member and to which the load from the load-receiving member is applied. The load-receiving member comes into contact with the base body, the load from the load-receiving member acts on the base body, and the resulting strain is detected by a strain sensor.

Abstract: The object of the invention is to provide a bed with a load detection function. The invention provides a bed with a load detection function that detects a load applied to a bed body, using a load detector attached to the bed body, and detects the state of a user on a bed surface of the bed body. Additionally, a load detector suitable for the bed is provided.

Abstract: The present invention provides sustained-release oral administration preparations containing the phenylalanine compound of the formula (1) wherein A represent the formula (2) and the like; B represents an alkoxy group and the like; E represents a hydrogen atom and the like; D represents a substituted phenyl group and the like; T, U, and V represent a carbonyl group and the like; Arm represents a benzene ring and the like; R1 represents an alkyl group and the like; R2, R3, and R4 may be the same or different from each other and represent a hydrogen atom, substituted amino group and the like; and J and J? represent a hydrogen atom and the like, or pharmaceutically acceptable salts thereof as an active ingredient in either form of a coating preparation or a matrix preparation. This active ingredient has a relatively shorter half-life in blood plasma, and the preparations having continuance of the effects are provided by the present invention.