Patents by Inventor Motoki Koyabashi

Motoki Koyabashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTROCHEMICAL DEVICE
    Publication number: 20110056737
    Abstract: Provided is an electrochemical device compatible with high-temperature reflow soldering using a lead-free solder. An electrical double layer capacitor 10-1 includes a package 14 that is constructed with a film or films and has sealed parts 14a1 to 14a3 formed by sealing parts, in which films are superimposed on each other, by, for example, heat sealing. The entireties of the sealed parts 14a1 to 14a3 of the package 14 are covered in a close-contact state with a support 16 that has higher rigidity than the film(s) constructing the package 14.
    Type: Application
    Filed: March 16, 2009
    Publication date: March 10, 2011
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Naoto Hagiwara, Katsuei Ishida, Kazushi Yawata, Motoki Koyabashi