Patents by Inventor Motoki Oishi

Motoki Oishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240119745
    Abstract: By an object recognition device, an object recognition method, or a non-transitory computer-readable storage medium storing an object recognition program, matching between a three-dimensional dynamic map representing a state of a mapping point group obtained by mapping of a target existing in an observation space and three-dimensional observation data representing a state of an observation point group observed in the observation space is performed, a candidate point of the mobile object is searched, and the mobile object is identified.
    Type: Application
    Filed: December 6, 2023
    Publication date: April 11, 2024
    Inventors: SUGURU YAMAZAKI, TOMOYUKI OISHI, MOTOKI TANAKA
  • Publication number: 20240105668
    Abstract: There is provided a novel Al wiring material that achieves both of a suppression of chip damage and a thermal shock resistance. In aspect 1, the Al wiring material includes an Al core material and an Al coating layer formed on a surface of the Al core material, and satisfies 1.2?H1h/H1s where H1h is a Vickers hardness of the Al core material (Hv) and H1s is a Vickers hardness of the Al coating layer (Hv). In aspect 2, the Al wiring material includes an Al core material and an Al coating layer formed on a surface of the Al core material, and satisfies 1.2?H2h/H2s where H2s is a Vickers hardness of the Al core material (Hv) and H2h is a Vickers hardness of the Al coating layer (Hv).
    Type: Application
    Filed: January 31, 2022
    Publication date: March 28, 2024
    Inventors: Yuto KURIHARA, Daizo ODA, Motoki ETO, Ryo OISHI, Tetsuya OYAMADA, Tomohiro UNO
  • Patent number: 11929343
    Abstract: There is provided a novel Cu bonding wire that achieves a favorable FAB shape and achieve a favorable bond reliability of the 2nd bonding part even in a rigorous high-temperature environment. The bonding wire for semiconductor devices includes a core material of Cu or Cu alloy, and a coating layer having a total concentration of Pd and Ni of 90 atomic % or more formed on a surface of the core material. The bonding wire is characterized in that: in a concentration profile in a depth direction of the wire obtained by performing measurement using Auger electron spectroscopy (AES) so that the number of measurement points in the depth direction is 50 or more for the coating layer, a thickness of the coating layer is 10 nm or more and 130 nm or less, an average value X is 0.2 or more and 35.
    Type: Grant
    Filed: March 16, 2022
    Date of Patent: March 12, 2024
    Assignee: NIPPON MICROMETAL CORPORATION
    Inventors: Daizo Oda, Motoki Eto, Takashi Yamada, Teruo Haibara, Ryo Oishi
  • Patent number: 11825145
    Abstract: A communication management method includes: flag transmission of transmitting, to an on-vehicle communication device, identification flag information for identifying a function to be enabled among a plurality of functions of a vehicle, using a management server; port assignment of assigning different dedicated source ports for respective functions to be enabled based on the identification flag information, using the on-vehicle communication device, upon receipt of the identification flag information; and data communications for the respective functions assigned to the dedicated source ports in the port assignment via the dedicated source ports to allow a communication carrier to accumulate data traffic for the respective functions, using the on-vehicle communication device.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: November 21, 2023
    Assignee: MAZDA MOTOR CORPORATION
    Inventors: Motoki Oishi, Satoshi Nakao, Yoshiki Maekawa, Eiji Okazaki, Hiroshi Ariki
  • Publication number: 20220295136
    Abstract: A communication management method includes: flag transmission of transmitting, to an on-vehicle communication device, identification flag information for identifying a function to be enabled among a plurality of functions of a vehicle, using a management server; port assignment of assigning different dedicated source ports for respective functions to be enabled based on the identification flag information, using the on-vehicle communication device, upon receipt of the identification flag information; and data communications for the respective functions assigned to the dedicated source ports in the port assignment via the dedicated source ports to allow a communication carrier to accumulate data traffic for the respective functions, using the on-vehicle communication device.
    Type: Application
    Filed: December 22, 2021
    Publication date: September 15, 2022
    Applicant: MAZDA MOTOR CORPORATION
    Inventors: Motoki OISHI, Satoshi NAKAO, Yoshiki MAEKAWA, Eiji OKAZAKI, Hiroshi ARIKI
  • Patent number: D867155
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: November 19, 2019
    Assignee: KENZO
    Inventor: Motoki Oishi