Abstract: The present invention is a battery module comprising a case, a plurality of cells being arranged in the case and having an energy density of 200 Wh/L or more, and a heat absorbing member provided at least either between the case and the plurality of cells or between the plurality of cells, wherein the heat absorbing member has an endothermic quantity Q from 150° C. to 350° C. of 500 J/cm3 or more and a thermal conductivity ? of 0.8 W/mK or more. According to the present invention, there can be provided a battery module whose temperature hardly rises in an abnormal early period and in a certain period from abnormality occurrence.

Abstract: The heat-dissipating composition according to the present invention comprises a polymer matrix and diamond particles. The present invention provides the heat-dissipating composition compatibly satisfying both electric insulativity and heat dissipativity.

Abstract: A battery module including battery cells, a module housing storing the battery cells, and a gap-filling material loaded in the module housing. The battery cells are in a flat shape and stores battery elements in a flexible film pouch. The gap-filling material is a silicone elastic material containing a thermally conductive filler and having hardness of 80 or more for E hardness or 60 or more for A hardness. The gap-filling material is loaded between the battery cells and between the battery cell and the module housing on one side in a direction intersecting a direction in which the battery cells are arrayed side by side with flat surfaces of the battery cells facing each other. The gap-filling material adheres to the battery cells to retain a space between the battery cells and to conduct heat generated by the battery cells to the module housing.

Abstract: A thermally conductive sheet comprises a thermally conductive polymer layer, an adhesive layer provided on an outer surface of the thermally conductive polymer layer, and a thermal diffusion layer, which is a functional layer provided on the adhesive layer. The thermally conductive polymer layer is formed of a thermally conductive polymer composition containing a polymer matrix and a thermally conductive filler. The coefficient of static friction of the thermally conductive polymer layer is 1.0 or lower. The adhesive layer has an outer shape smaller than that of the thermally conductive polymer layer.

Abstract: A thermally conductive sheet composite comprises a gelatinous thermally conductive sheet molded of a thermally conductive polymer composition containing a polymeric material and a thermally conductive filler, and a release sheet molded separately from the thermally conductive sheet and peelably laminated on at least one surface of a pair of surfaces of the thermally conductive sheet. The release sheet has a hardness of 30 or more as measured by a type A durometer in conformity with ISO 7619.

Abstract: A laminated body comprises a thermally conductive sheet, a protective sheet, an auxiliary sheet, a carrier sheet and a coating sheet. The thermally conductive sheet comprises a main sheet body and an adhesive layer. The coefficient of static friction of the main sheet body is 1.0 or lower. The adhesive layer has high adhesiveness in comparison with the main sheet body, and has an outer shape smaller than that of the main sheet body. The protective sheet is formed having an outer shape larger than that of the adhesive layer, and provided with a cutting line extending toward the adhesive layer from the peripheral portion of the protective sheet so that the protective sheet can be cut along the cutting line.

Abstract: A thermally conductive sheet composite comprises a gelatinous thermally conductive sheet molded of a thermally conductive polymer composition containing a polymeric material and a thermally conductive filler, and a release sheet molded separately from the thermally conductive sheet and peelably laminated on at least one surface of a pair of surfaces of the thermally conductive sheet. The release sheet has a hardness of 30 or more as measured by a type A durometer in conformity with ISO 7619.

Abstract: Disclosed is a key sheet efficiently diffusing local heat generated by a device mounted on a board. A key sheet has a base sheet formed of a rubber-like elastic material in which a heat conductive filler is mixed. Thus, if a semiconductor device on a board generates heat, it is possible to suppress local heat storage by the heat conductive filler of the base sheet. Further, there is no need to provide a separate member for heat diffusion between the board and the key sheet, making it possible to realize a reduction in thickness. Thus, with the key sheet, it is possible to meet the requirement for heat diffusion to eliminate local heat storage in electronic apparatuses, and the requirement for a reduction in the thickness and weight of electronic apparatuses.

Abstract: A thermally conductive sheet comprises a thermally conductive polymer layer, an adhesive layer provided on an outer surface of the thermally conductive polymer layer, and a thermal diffusion layer, which is a functional layer provided on the adhesive layer. The thermally conductive polymer layer is formed of a thermally conductive polymer composition containing a polymer matrix and a thermally conductive filler. The coefficient of static friction of the thermally conductive polymer layer is 1.0 or lower. The adhesive layer has an outer shape smaller than that of the thermally conductive polymer layer.

Abstract: A laminated body comprises a thermally conductive sheet, a protective sheet, an auxiliary sheet, a carrier sheet and a coating sheet. The thermally conductive sheet comprises a main sheet body and an adhesive layer. The coefficient of static friction of the main sheet body is 1.0 or lower. The adhesive layer has high adhesiveness in comparison with the main sheet body, and has an outer shape smaller than that of the main sheet body. The protective sheet is formed having an outer shape larger than that of the adhesive layer, and provided with a cutting line extending toward the adhesive layer from the peripheral portion of the protective sheet so that the protective sheet can be cut along the cutting line.

Abstract: A thermal diffusion sheet is provided with a heat conducting layer, a thermal diffusion layer provided on the surface of the heat conducting layer and a heat insulating layer provided on the surface of the thermal diffusion layer. The heat conducting layer is formed of a composition containing an organic polymer and a heat conductive filler. The thermal diffusion layer is formed of a metal material. The heat insulating layer is formed of a material having electrical insulation properties. The thermal diffusion sheet is manufactured through providing a heat insulating layer on the surface of a thermal diffusion layer, preparing a composition, and forming a heat conducting layer. When preparing a composition, an organic polymer in liquid form having thermosetting properties and a heat conductive filler are mixed.

Abstract: Disclosed is a key sheet efficiently diffusing local heat generated by a device mounted on a board. A base sheet of a key sheet is provided with a heat diffusion sheet. The heat diffusion sheet is provided with a graphite sheet and a resin film and, in some cases, a thin metal plate. The base sheet itself thus constitutes the heat diffusion sheet, so even if no member for heat diffusion is provided between a board and the key sheet, it is possible to diffuse local heat generated by a semiconductor device in the face direction of the base sheet. Thus, with the key sheet, it is possible to meet the requirement for heat diffusion to eliminate local heat storage in electronic apparatuses and to meet the requirement for a reduction in the thickness and further in weight of electronic apparatuses.

Abstract: Disclosed is a key sheet efficiently diffusing local heat generated by a device mounted on a board. A key sheet has a base sheet formed of a rubber-like elastic material in which a heat conductive filler is mixed. Thus, if a semiconductor device on a board generates heat, it is possible to suppress local heat storage by the heat conductive filler of the base sheet. Further, there is no need to provide a separate member for heat diffusion between the board and the key sheet, making it possible to realize a reduction in thickness. Thus, with the key sheet, it is possible to meet the requirement for heat diffusion to eliminate local heat storage in electronic apparatuses, and the requirement for a reduction in the thickness and weight of electronic apparatuses.

Abstract: Disclosed is a key sheet efficiently diffusing local heat generated by a device mounted on a board. A base sheet of a key sheet is provided with a heat diffusion sheet. The heat diffusion sheet is provided with a graphite sheet and a resin film and, in some cases, a thin metal plate. The base sheet itself thus constitutes the heat diffusion sheet, so even if no member for heat diffusion is provided between a board and the key sheet, it is possible to diffuse local heat generated by a semiconductor device in the face direction of the base sheet. Thus, with the key sheet, it is possible to meet the requirement for heat diffusion to eliminate local heat storage in electronic apparatuses and to meet the requirement for a reduction in the thickness and further in weight of electronic apparatuses.

Abstract: A thermally conductive member including a thermal diffusion sheet having at least one opening with an inner periphery; and a thermally conductive elastomer piece passing through the opening of the sheet is provided. The thermally conductive elastomer piece includes at least one base portion fitting with the inner periphery of the opening of the thermal diffusion sheet and at least one projecting portion connected to the base portion and projecting out from the surface of the thermal diffusion sheet.