Abstract: A solution including an organic solvent (S), and an antioxidant (A), in which an antioxidant (A) includes a tocopherol compound (A1).

Abstract: An information processing device includes a processor configured to select, when the processor acquires power supply request information requesting supply of electric power from a vehicle equipped with a power supply device that supplies electric power to outside to a power supply target to which a plurality of electronic devices is connected, the electronic device to which electric power is supplied from among the electronic devices based on the power supply request information.

Abstract: A server includes a processor configured to: acquire electric power supply information indicating electric energy that is suppliable by each of a plurality of vehicles to outside; set electric energy to be supplied to a facility by each of the vehicles based on the electric power supply information of each of the vehicles; and cause each of the vehicles to supply electric power based on the set electric energy of each of the vehicles.

Abstract: The information processing device includes a processor configured to control setting and cancellation of a power supply mode in which the power supply device operates, for a vehicle including the power supply device that supplies electric power to the outside. The processor outputs information requesting an input of authentication information when a canceling request of the power supply mode that is set is acquired.

Abstract: An information processing device includes a processor configured to: acquire connection information representing a state of a connection region including a connection portion that connects a vehicle and a power supply target such that power is able to be supplied; determine whether the connection information includes information indicating an abnormality in the connection portion; and output information that issues a notification that the connection portion is abnormal when the processor determines that the connection information includes the information indicating an abnormality in the connection portion.

Abstract: A control device includes a processor configured to: acquire electric power supply information indicating suppliable electric energy by each of a plurality of vehicles and electric power demand information indicating demanded electric energy of a facility to which each of the vehicles supply electric power; fix a master vehicle that controls electric power supply of each of the vehicles from among the vehicles based on the electric power supply information; and control electric energy when each of the vehicles supplies the electric power to the facility based on the electric power supply information of the master vehicle and the electric power demand information.

Abstract: The present disclosure relates to a thinner composition for removing a resist and a processing method of a semiconductor substrate using the thinner composition. Particularly, the thinner composition includes (a) propylene glycol monoalkyl ether, (b) propylene glycol monoalkyl ether acetate, (c) cyclohexanone, and (d) cyclopentanone. In addition, the processing method of a semiconductor substrate includes applying a resist composition on a semiconductor substrate and removing the applied resist composition using the thinner composition of the present invention.

Abstract: A solution including an organic solvent (S), and an antioxidant (A), in which an antioxidant (A) includes a tocopherol compound (A1).

Abstract: A method of diffusing an impurity-diffusing component including forming a first diffusing agent layer containing a first conductivity type impurity-diffusing component on the surface of a semiconductor substrate; calcining the first diffusing agent layer; forming a second diffusing agent layer containing a second conductivity type impurity-diffusing component on the surface of the semiconductor substrate excluding the region where the first diffusing agent layer is formed; and heating the semiconductor substrate at a temperature higher than the calcination temperature to diffuse the first and second conductivity type impurity-diffusing components to the semiconductor substrate.

Abstract: An adhesive composition is disclosed which includes a polymer prepared by copolymerizing a monomer containing a polymerizable group, the polymer including a low-molecular-weight component having a molecular weight equivalent to 1% or less of the weight-average molecular weight of the polymer, the low-molecular-weight component is contained in a range of not less than 0 weight % to less than 0.3 weight % of the total weight of the polymer. This allows provision of an adhesive composition having great adhesive strength in a high-temperature environment, especially at temperatures from 140° C. to 200° C., as well as high heat resistance and favorable crack resistance.

Abstract: A method of diffusing an impurity-diffusing component including forming a first diffusing agent layer containing a first conductivity type impurity-diffusing component on the surface of a semiconductor substrate; calcining the first diffusing agent layer; forming a second diffusing agent layer containing a second conductivity type impurity-diffusing component on the surface of the semiconductor substrate excluding the region where the first diffusing agent layer is formed; and heating the semiconductor substrate at a temperature higher than the calcination temperature to diffuse the first and second conductivity type impurity-diffusing components to the semiconductor substrate.

Abstract: An embodiment of the present invention relates to a diffusing agent composition used in printing an impurity-diffusing component onto a semiconductor substrate, wherein the diffusing agent composition contains: a hydrolysis product of alkoxysilane (A); a component (B) containing at least one selected from the group consisting of a hydrolysis product of alkoxy titanium, a hydrolysis product of alkoxy zirconium, titania fine particle, and zirconia fine particle; an impurity-diffusing component (C); and an organic solvent (D).

Abstract: Disclosed is a positive-type photosensitive composition which can form a metal compound film pattern at high resolution and with less affection by organic residues. The positive-type photosensitive composition comprises: a metal complex component (A) which can form a metal compound film when applied and subsequently fired; and a photosensitizing agent (B). In the composition, a ligand in the component (A) is preferably a multidentate ligand having an aromatic compound as its skeleton. According to this construction, even a composition containing substantially no photosensitive resin can impart photosensitivity and a metal compound film pattern can be formed readily.

Abstract: A mask material composition that is used for diffusion barrier of an impurity diffusing component into a semiconductor substrate includes a siloxane resin (A1) containing a constituent unit represented by the following formula (a1): wherein R1 is a single bond or C1-C5 alkylene group; and R2 is a C6-C20 aryl group.

Abstract: A method of vaporizing a solid organometallic compound in which the method comprises filling the solid organometallic compound into a container, introducing a carrier gas to the container and taking out the gas containing the organometallic compound, wherein the solid organometallic compound is in the form of pellets and contains an inert support.

Abstract: When communications are performed by connecting a non-SIP information terminal device in which SIP is not supported to a SIP converter connected to a communication line via a line terminating device, the SIP converter performs establishment and disconnection of a SIP session, and transmission of a SIP message on behalf of the non-SIP information terminal device.

Abstract: A mask material composition that is used for diffusion barrier of an impurity diffusing component into a semiconductor substrate includes a siloxane resin (A1) containing a constituent unit represented by the following formula (a1): wherein R1 is a single bond or C1-C5 alkylene group; and R2 is a C6-C20 aryl group.

Abstract: An embodiment of the present invention relates to a diffusing agent composition used in printing an impurity-diffusing component onto a semiconductor substrate, wherein the diffusing agent composition contains: a hydrolysis product of alkoxysilane (A); a component (B) containing at least one selected from the group consisting of a hydrolysis product of alkoxy titanium, a hydrolysis product of alkoxy zirconium, titania fine particle, and zirconia fine particle; an impurity-diffusing component (C); and an organic solvent (D).

Abstract: An adhesive composition of the present invention includes a polymer as a main component. The polymer is produced by copolymerization of a monomer composition which includes chain-structured alkyl (meth)acrylate and a monomer containing a maleimide group. This makes it possible to provide an adhesive composition used for forming an adhesive layer in which adhesive strength is kept in a high temperature environment. That is, it becomes possible to provide an adhesive composition that allows forming an adhesive layer which has high adhesive strength in a high temperature environment (particularly at 200° C. to 250° C.).

Abstract: Disclosed is a positive-type photosensitive composition which can form a metal compound film pattern at high resolution and with less affection by organic residues. The positive-type photosensitive composition comprises: a metal complex component (A) which can form a metal compound film when applied and subsequently fired; and a photosensitizing agent (B). In the composition, a ligand in the component (A) is preferably a multidentate ligand having an aromatic compound as its skeleton. According to this construction, even a composition containing substantially no photosensitive resin can impart photosensitivity and a metal compound film pattern can be formed readily.