Patents by Inventor Motoki Yamada

Motoki Yamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11958199
    Abstract: A robot control device that controls operation of a robot including a robot arm, a driving section configured to drive the robot arm, and a driving control section configured to receive electric power supplied to the driving section and output power to the driving section based on an input control signal, the robot control device including a logical operation circuit configured to perform a logical operation about a stop signal and output an operation result and a power interruption circuit configured to interrupt, based on the operation result, the electric power supplied to the driving control section or the control signal input to the driving control section to thereby interrupt the power of the driving section.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: April 16, 2024
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Daisuke Higashi, Takahiro Kamijo, Tomonori Yamada, Motoki Ito
  • Patent number: 11929343
    Abstract: There is provided a novel Cu bonding wire that achieves a favorable FAB shape and achieve a favorable bond reliability of the 2nd bonding part even in a rigorous high-temperature environment. The bonding wire for semiconductor devices includes a core material of Cu or Cu alloy, and a coating layer having a total concentration of Pd and Ni of 90 atomic % or more formed on a surface of the core material. The bonding wire is characterized in that: in a concentration profile in a depth direction of the wire obtained by performing measurement using Auger electron spectroscopy (AES) so that the number of measurement points in the depth direction is 50 or more for the coating layer, a thickness of the coating layer is 10 nm or more and 130 nm or less, an average value X is 0.2 or more and 35.
    Type: Grant
    Filed: March 16, 2022
    Date of Patent: March 12, 2024
    Assignee: NIPPON MICROMETAL CORPORATION
    Inventors: Daizo Oda, Motoki Eto, Takashi Yamada, Teruo Haibara, Ryo Oishi
  • Publication number: 20230286270
    Abstract: There is provided a liquid discharge apparatus including: a head having a nozzle surface and a nozzle opened in the nozzle surface; a cap configured to make contact with the nozzle surface at a covering position and configured to be separated away from the nozzle surface at a retreating position; a liquid channel configured to communicate an internal space of the cap and outside of the cap to each other; a lid member configured to make contact with the cap located at the retreating position so as to seal the internal space of the cap; and a heater which is positioned above the cap located at the retreating position. The lid member is positioned between the heater and the cap in an up-down direction in a state that the lid member seals the internal space of the cap.
    Type: Application
    Filed: March 7, 2023
    Publication date: September 14, 2023
    Applicant: BROTHER KOGYO KABUSHIKI KAISHA
    Inventors: MIKIO OGAWA, RIKUTO MITOKA, MOTOKI YAMADA, KIYOTO MIZOGUCHI
  • Publication number: 20230271419
    Abstract: There is provided a liquid discharge apparatus including a head configured to eject a liquid from nozzles being open in a nozzle surface, a liquid absorbing wiper, and a support supporting the liquid absorbing wiper. The supporter is movable relative to the head, between a first position where the liquid absorbing wiper is in contact with the nozzle surface, and a second position where the liquid absorbing wiper is away from the nozzle surface, the supporter has a flow channel for a liquid cleaner to flow therethrough, and the liquid absorbing wiper sucks in the liquid cleaner from below by way of contact with the liquid cleaner flowing in the flow channel.
    Type: Application
    Filed: December 21, 2022
    Publication date: August 31, 2023
    Applicant: BROTHER KOGYO KABUSHIKI KAISHA
    Inventors: MIKIO OGAWA, RIKUTO MITOKA, MOTOKI YAMADA
  • Patent number: 7968180
    Abstract: The extruded propylene-based resin composite foam (1) according to the present invention is provided by extrusion-foaming a molding material containing a propylene-based resin. The propylene-based resin forming the extruded foam has an olefin-based polymer whose loss tangent (tan ?) is 0.04 to 100 at a temperature of 298 K and a frequency of 10 Hz. The molding material includes a fibrous filler in an amount of more than 0 mass % and 60 mass % or less of the entirety of the molding material. The extruded composite foam (1) includes: first extruded foam (2) whose closed cell content is 40 percent or more and whose expansion ratio is 10 or more; and second extruded foam (3) whose closed cell content is less than 40 percent and whose expansion ratio is 10 or more.
    Type: Grant
    Filed: April 26, 2006
    Date of Patent: June 28, 2011
    Assignee: Prime Polymer Co., Ltd.
    Inventors: Minoru Sugawara, Yasuhiko Otsuki, Motoki Yamada, Ryoichi Tsunori
  • Patent number: 7842748
    Abstract: The present invention pertains to a master batch composition which contains 10 to 95% by mass of an additive for plastics, 1 to 50% by mass of an olefin polymer having specific physical properties, and 1 to 89% by mass of a polyolefin resin as a carrier, which is useful for producing a polyolefin resin, particularly an injection molded product of a polypropylene resin, which can improve dispersibility of additives in the polyolefin molded product, which permits high density filling of various additives in the master batch composition, and which is free of blocking. The present invention is also directed to a polyolefin resin composition in which the master batch composition is compounded in a polyolefin resin, and to a polyolefin molded product using the resin composition.
    Type: Grant
    Filed: November 22, 2005
    Date of Patent: November 30, 2010
    Assignee: Idemitsu Kosan Co., Ltd.
    Inventors: Tomoaki Takebe, Yutaka Minami, Tsutomu Onodera, Motoki Yamada
  • Publication number: 20090076179
    Abstract: The extruded propylene-based resin composite foam (1) according to the present invention is provided by extrusion-foaming a molding material containing a propylene-based resin. The propylene-based resin forming the extruded foam has an olefin-based polymer whose loss tangent (tan ?) is 0.04 to 100 at a temperature of 298 K and a frequency of 10 Hz. The molding material includes a fibrous filler in an amount of more than 0 mass % and 60 mass % or less of the entirety of the molding material. The extruded composite foam (1) includes: first extruded foam (2) whose closed cell content is 40 percent or more and whose expansion ratio is 10 or more; and second extruded foam (3) whose closed cell content is less than 40 percent and whose expansion ratio is 10 or more.
    Type: Application
    Filed: April 26, 2006
    Publication date: March 19, 2009
    Applicant: PRIME POLYMER CO., LTD.
    Inventors: Minoru Sugawara, Yasuhiko Otsuki, Motoki Yamada, Ryoichi Tsunori
  • Publication number: 20080119605
    Abstract: The present invention pertains to a master batch composition which contains 10 to 95% by mass of an additive for plastics, 1 to 50% by mass of an olefin polymer having specific physical properties, and 1 to 89% by mass of a polyolefin resin as a carrier, which is useful for producing a polyolefin resin, particularly an injection molded product of a polypropylene resin, which can improve dispersibility of additives in the polyolefin molded product, which permits high density filling of various additives in the master batch composition, and which is free of blocking. The present invention is also directed to a polyolefin resin composition in which the master batch composition is compounded in a polyolefin resin, and to a polyolefin molded product using the resin composition.
    Type: Application
    Filed: November 22, 2005
    Publication date: May 22, 2008
    Applicant: Idemitsu Kosan Co., Ltd.
    Inventors: Tomoaki Takebe, Yutaka Minami, Tsutomu Onodera, Motoki Yamada
  • Patent number: 5985973
    Abstract: Disclosed are a polypropylene-based resin and a polypropylene-based resin composition having well-balanced, high-level flowability, stiffness and impact resistance. The polypropylene-based resin has an MI of from 30 to 70 g/10 min and a 25.degree. C. xylene-soluble content, x, of from 5 to 15% by weight, in which the 25.degree. C. xylene-soluble component is such that (a) its ethylene unit content, z, is from 20 to 30% by weight, and (b) its intrinsic viscosity, [72], indecalin at 135.degree. C. is not smaller than 2.00 dl/g, and in which the 25.degree. C. xylene-insoluble component is such that (c) its ethylene unit content, y (% by weight), satisfies the following:100y/[y.times.(1-x/100)+x].ltoreq.1.13z-16.6,(d) in GPC, the content of its constituent component having a molecular weight of not smaller than 10.sup.6 is not smaller than 2% by weight, (e) its MI is from 40 to 130 g/10 min, and (f) its stereospecificity index is not smaller than 98.5%.
    Type: Grant
    Filed: August 6, 1997
    Date of Patent: November 16, 1999
    Assignee: Idemitsu Petrochemical Co., Ltd.
    Inventors: Takashi Sumitomo, Masaru Nakagawa, Masatoshi Toda, Yutaka Kobayashi, Motoki Yamada