Abstract: The present invention provides a corrugated tube and a method for manufacturing the same capable of improving workability in press-fitting work of a pipe or a quick connector. A corrugated tube includes a flexible section having a first corrugated section and a second corrugated section, and straight sections integrally formed at both ends of the flexible section respectively. A length of valley portions in an axial center direction is larger than a length of valley portions in the first corrugated section, thereby allows a pitch P2 of mountain portions in the second corrugated section provided between the straight section and the first corrugated section to be larger than a pitch P1 of mountain portions in the first corrugated section.

Abstract: The present invention provides a corrugated tube and a method for manufacturing the same capable of improving workability in press-fitting work of a pipe or a quick connector. A corrugated tube includes a flexible section having a first corrugated section and a second corrugated section, and straight sections integrally formed at both ends of the flexible section respectively. A length of valley portions in an axial center direction is larger than a length of valley portions in the first corrugated section, thereby allows a pitch P2 of mountain portions in the second corrugated section provided between the straight section and the first corrugated section to be larger than a pitch P1 of mountain portions in the first corrugated section.

Abstract: A semiconductor device having a plurality of semiconductor chips mounted on a lead frame (10) and required portions covered with seal portions in which: the plurality of semiconductor chips are divided into a first group of semiconductor chips (Dx to Dz) and a second group of semiconductor chips (Du to Dw and Thx to Thz); both groups of semiconductor chips are mounted on the lead frame (10) at a distance from each other; the seal portions are comprised of first and second resin-seal portions (41 and 42) which cover the first and second groups of semiconductor chips, respectively, along with required portions of the lead frame; both resin-seal portions are mechanically coupled with each other by coupling portions; and a group of read terminals respectively connected to circuits within the first resin-seal portion and circuits within the second resin-seal portion are led out through a gap between the first resin-seal portion (41) and the second resin-seal portion (42).

Abstract: A semiconductor device having a plurality of semiconductor chips mounted on a lead frame (10) and required portions covered with seal portions in which: the plurality of semiconductor chips are divided into a first group of semiconductor chips (Dx to Dz) and a second group of semiconductor chips (Du to Dw and Thx to Thz); both groups of semiconductor chips are mounted on the lead frame (10) at a distance from each other; the seal portions are comprised of first and second resin-seal portions (41 and 42) which cover the first and second groups of semiconductor chips, respectively, along with required portions of the lead frame; both resin-seal portions are mechanically coupled with each other by coupling portions; and a group of read terminals respectively connected to circuits within the first resin-seal portion and circuits within the second resin-seal portion are led out through a gap between the first resin-seal portion (41) and the second resin-seal portion (42).

Abstract: A vibration damper material 1 composed of a laminated sheet having a base stock layer 3, a resilient layer 4, an primer layer 5, an organic component barrier layer 6 and an adhesive layer 7 successively laminated in that order from one to the other side thereof, and a release liner 8 stuck on the adhesive layer 7. The resilient layer 4 is constituted by a resilient material containing a vehicle consisting of a member or a mixture of two or more members selected from the group of asphalt, rubber, synthetic resins and cellulose derivatives, synthetic resin powder, and an elastic material having an elongation rate of 500% or higher. The organic component barrier layer functions to block permeation therethrough of organic components such as tar and oil components which would otherwise tend to migrate into the adhesive layer from the resilient layer.