Abstract: A semiconductor device includes a resin molded semiconductor element having a resin package and a plurality of connection leads disposed at one side of the resin package. An electromagnetic shielding member is disposed externally on the resin molded semiconductor element. The electromagnetic shielding member is made of a conductive or semi-conductive material and is in the form of an open-ended tubular covering. The resin package is inserted into the tubular covering through an opening thereof to enable the tubular covering to wrap the resin package with the connection leads extending outwardly through the opening.

Abstract: A sensor for detecting a physical parameter is capable of detecting an error state in which normal physical parameter detection is not possible even though the output voltage is within a normal output voltage range is disclosed. Errors such as a normal reference frequency signal not being output from an oscillation circuit for some reason, or the frequency of the reference frequency signal output from the oscillation circuit not being within a particular frequency range, can occur. The physical parameter sensor of the invention comprises a self-testing circuit for detecting such error states, and outputting a signal indicating such error detection.

Abstract: A semiconductor pressure detecting device comprises a package having a pressure introducing hole; a base plate which has a first through hole and is mounted in the package; a base mounted on the base plate; and a semiconductor pressure sensor chip which is mounted on the base; wherein the base plate has a thickened portion formed around the first through hole and is fixed by welding the circumference of the thickened portion onto the package.

Abstract: The pressure sensor is simplified in structure and its assembled state to the housing body is made more compact. In the semiconductor pressure sensor for detecting pressure of a pressure medium, the semiconductor pressure sensor has a semiconductor sensor element for pressure detection supported by a sensor body via a pedestal seat and is assembled to a housing body that partitions the pressure medium and outside from each other. The sensor body is formed into a plate shape of a specified thickness having a flange portion, where the pedestal seat for joining and supporting the semiconductor sensor element and an adjustment circuit board for the semiconductor sensor element are joined on one surface side of the sensor body. The sensor body is fixed by being inserted into a stepped through hole provided in the housing body.

Abstract: A semiconductor pressure sensor having a sensor element including a sensor chip to which pressure from a pressure medium is applied, and a pedestal for supporting the sensor chip. The sensor element is bonded to a subplate at the pedestal, and the subplate is bonded to a main plate. The main plate includes an airtightness holding means for holding an airtight seal between the main plate and a sensor mounting part and disposed where pressure of a pressure medium can be detected.

Abstract: A semiconductor pressure detecting device comprises a package having a pressure introducing hole, a base plate which has a first through hole at the center thereof and is bonded on the periphery thereof to the inside of the package so that the first through hole becomes concentric with the pressure introduction hole, a mount which has a second through hole at the center thereof and is mounted on the base plate so that the second through hole becomes concentric with the first through hole and located inside the bonding portion of the package and the base plate, and a semiconductor pressure sensor chip, wherein the base plate has a groove which surrounds the mount at a position inside of the bonding portion.

Abstract: The semiconductor pressure sensor has a pressure sensor unit with a pressure sensor chip for detecting pressure, peripheral circuitry for converting the pressure detected by the pressure sensor unit to an electrical signal and processing the electrical signal, a lead frame for fastening and electrically connecting peripheral circuitry, a package in which the peripheral circuitry and lead frame are integrated in a resin molding including a cavity in which the pressure sensor unit is housed, a cover for closing the opening of the cavity in which the pressure sensor unit is housed, and a pressure opening for conveying a pressure-conveying medium to the pressure sensor chip. The pressure sensor unit is fastened to the inside bottom of the cavity and is electrically connected to a particular part of the lead frame exposed inside the cavity.

Abstract: A semiconductor sensor comprising a substrate having thick-film conductors formed on both sides of the substrate, a semiconductor sensor chip having a diaphragm to which a pressure to be detected is applied and a pan-shaped cap bonded to the mounting side of the substrate with a die bond agent, further comprises plural through-holes pierced through the substrate, conductors formed in plural through-holes which connect the thick-film conductors to each other, bonding electrodes formed from a thick-film conductor on the mounting side of the substrate, each being connected to the thick-film conductor of the mounting side of the substrate and to the semiconductor sensor chip by a wire bonding, and a protection glass film formed on the thick-film conductor of the mounting side having apertures for forming exposed conductor portions of the thick-film conductor, wherein the opening of each through-hole and the exposed conductor portions are disposed at the position to which the cap is bonded and covered by the die b

Abstract: A semiconductor pressure sensor includes a pressure sensor chip including a diaphragm at the center thereof for measuring pressure and a die with an opening for introducing the pressure to the diaphragm. The pressure sensor chip is fixed to the die using an adhesive agent. Furthermore, prevention grooves are formed on the surface of the pressure sensor chip to prevent the adhesive agent from elevating onto the diaphragm.

Abstract: A less expensive small semiconductor pressure sensor in which a pressure sensing element is not displaced by vibration and the like and wire bonding is highly reliably effected includes a pressure sensing element having a diaphragm and a glass base die bonded to a die pad in substantially the same plane as that of an outer lead with a bonding resin. Each of two sets of hanging leads is attached to one of two opposite sides of the die pad to fix the die pad to a package base. With this arrangement, the die pad is securely bonded to the package base to prevent breakage of a metal wire caused by vibration and the like so that a less expensive and smaller semiconductor pressure sensor can be provided.

Abstract: A pressure sensor is capable of detecting a certain pressure and an atmospheric pressure individually and independently in real time, with miniaturization and light weight. This is attained by providing a pressure sensor comprising a first pressure sensor; and an atmospheric pressure sensor. Each sensor includes a pressure-sensitive element and a circuit for amplifying an output signal from the pressure-sensitive element. The amplifying circuit for the first pressure sensor, and the pressure-sensitive element and the amplifying circuit for the atmospheric pressure sensor are provided on the same chip. The amplifying circuit compensates for nonuniformity in characteristics of the pressure-sensitive element due to temperatures.

Abstract: A semiconductor pressure sensor has a package base provided with an adhesive supporting portion for supporting nearly the entire lengths of inner portions of outer leads. Since nearly the entire lengths of the inner portions in a package are supported, the inner portions do not resonate even if the semiconductor pressure sensor vibrates, thereby preventing detachment of the wires bonded to the ends of the inner portions.

Abstract: A semiconductor pressure sensor includes a semiconductor pressure-sensing chip including a semiconductor body having a diaphragm that flexes in response to applied pressure, a strain gauge disposed in the diaphragm for altering an electrical signal in response to flexing of the diaphragm, and an amplifying circuit disposed in the semiconductor body outside the diaphragm and connected to the strain gauge for amplifying the electrical signal; a base supporting the semiconductor pressure-sensing chip; a package enclosing the semiconductor pressure-sensing chip and the base and having an opening providing access to the pressure-sensing chip; a plurality of leads penetrating the package and connected to the amplifying circuit; a substrate on which the package is mounted; and a gain-adjusting resistor disposed on the substrate opposite the package and electrically connected to the amplifying circuit for adjusting the gain of the amplifying circuit.