Abstract: A substrate (1) includes conductive portions (7) formed by press working and a resin portion (11) integrally injection-molded with the conductive portions (7). The conductive portions (7) are formed from, for example, a copper alloy. The resin portion 11 is formed from, for example, PPS. A surface-mount component (3), which is an electronic surface-mount component, is mounted on the substrate (1). The surface-mount component (3) has electrodes (5) at its opposite sides, and the electrodes (5) and the respective conductive portions (7) are electrically connected by means of a solder (9). The substrate (1) has a hole (13), which functions as a stress relaxation mechanism, formed in the resin portion (11) (a portion extending therethrough) between connection portions (15) under the surface-mount component (3). The substrate (1) also has resin-exposed portions (13), which function as a stress relaxation mechanism, formed on opposite sides of the surface-mount component (3).

Abstract: A substrate usable for such as DC-DC converters, which has no defects such as openings therein but is more compact and easy to be manufactured and a method of manufacturing the same is provided. First, circuit materials are cut off by pressing and bended to be formed in desired shapes. Next, the circuit materials are joined or placed in predetermined positions to form a circuit conductor 15. Junction is performed by welding. Next, the circuit conductor 15 is installed on the mold 19. The mold 19 is for injection molding of resin 9 and has a predetermined cavity therein. The circuit conductor 15 is fixed to the mold 19, for example by a pin of a prescribed position. In such a condition, resin is injected into a mold. The substrate 1 is formed by the injection of resin to a surface and between layers of the circuit conductor.

Abstract: A substrate (1) includes conductive portions (7) formed by press working and a resin portion (11) integrally injection-molded with the conductive portions (7). The conductive portions (7) are formed from, for example, a copper alloy. The resin portion 11 is formed from, for example, PPS. A surface-mount component (3), which is an electronic surface-mount component, is mounted on the substrate (1). The surface-mount component (3) has electrodes (5) at its opposite sides, and the electrodes (5) and the respective conductive portions (7) are electrically connected by means of a solder (9). The substrate (1) has a hole (13), which functions as a stress relaxation mechanism, formed in the resin portion (11) (a portion extending therethrough) between connection portions (15) under the surface-mount component (3). The substrate (1) also has resin-exposed portions (13), which function as a stress relaxation mechanism, formed on opposite sides of the surface-mount component (3).

Abstract: In the first buffering area provided between the inlet of the furnace and the heating chamber, the ambient gas is blown to the printed circuit board from the lower side of the carrier device, while the ambient gas is sucked in the upper side of the carrier device, thus the outside air is prevented from infiltrating and the ambient gas is prevented from flowing out. Furthermore, the flux is prevented from being attached to the printed circuit board, by installing the flux dropping prevention mechanism in the suction port of the ambient gas.

Abstract: In the first buffering area provided between the inlet of the furnace and the heating chamber, the ambient gas is blown to the printed circuit board from the lower side of the carrier device, while the ambient gas is sucked in the upper side of the carrier device, thus the outside air is prevented from infiltrating and the ambient gas is prevented from flowing out. Furthermore, the flux is prevented from being attached to the printed circuit board, by installing the flux dropping prevention mechanism in the suction port of the ambient gas.

Abstract: A flux collection system is proposed in which in a buffering area between an inlet and a heating chamber of a reflow furnace, blowing in-furnace ambient gas to a printed circuit board from a position under a carrier device and sucking ambient gas at a lower section of the carrier device cause a device to prevent outside air from entering and ambient gas from releasing the ambient gas including flux component to be blown out from a narrowing mechanism to collide with a partition plate and promote mixture of solidified flux and liquefied flux to collect flux easily.

Abstract: In the first buffering area provided between the inlet of the furnace and the heating chamber, the ambient gas is blown to the printed circuit board from the lower side of the carrier device, while the ambient gas is sucked in the upper side of the carrier device, thus the outside air is prevented from infiltrating and the ambient gas is prevented from flowing out. Furthermore, the flux is prevented from being attached to the printed circuit board, by installing the flux dropping prevention mechanism in the suction port of the ambient gas.

Abstract: In the first buffering area provided between the inlet of the furnace and the heating chamber, the ambient gas is blown to the printed circuit board from the lower side of the carrier device, while the ambient gas is sucked in the upper side of the carrier device, thus the outside air is prevented from infiltrating and the ambient gas is prevented from flowing out. Furthermore, the flux is prevented from being attached to the printed circuit board, by installing the flux dropping prevention mechanism in the suction port of the ambient gas.