Patents by Inventor Motonobu Koike

Motonobu Koike has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board, solder connection structure and method between printed circuit board and flexible printed circuit board
    Patent number: 7660129
    Abstract: There is provided a printed circuit board in which a PCB and an FPC can be readily located, a solder connection structure and method between a printed circuit board and a flexible printed circuit board. The printed circuit board 1 includes a plurality of pads 2 for mounting a flexible printed circuit board, wherein a solder resist 3 is formed on the surface of the printed circuit board so as to expose the pads 2 and convex portions are formed by insulation print layers 4 around the pads 2.
    Type: Grant
    Filed: January 30, 2008
    Date of Patent: February 9, 2010
    Inventors: Yuuji Minota, Yasuhiro Fukutomi, Motonobu Koike
  • PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME
    Publication number: 20080202804
    Abstract: There is provided a printed circuit board in which space between pads used for surface mounting can be narrowed and an FPC can be mounted along with electronic components by the reflow method even when the FPC is mounted and a method of producing the same. A printed circuit board is configured such that a solder resist 3 is formed on the surface of the printed circuit board so as to expose pads 2, a solder resist 4 is formed between the adjacent pads, and solder paste which is as high as or higher than the solder resist 4 is provided by printing on the pad 2 separated from other pads 2 by the solder resists 3 and 4.
    Type: Application
    Filed: February 19, 2008
    Publication date: August 28, 2008
    Inventors: YASUHIRO FAKUTOMI, Yuuji Minota, Motonobu Koike
  • PRINTED CIRCUIT BOARD, SOLDER CONNECTION STRUCTURE AND METHOD BETWEEN PRINTED CIRCUIT BOARD AND FLEXIBLE PRINTED CIRCUIT BOARD
    Publication number: 20080198566
    Abstract: There is provided a printed circuit board in which a PCB and an FPC can be readily located, a solder connection structure and method between a printed circuit board and a flexible printed circuit board. The printed circuit board 1 includes a plurality of pads 2 for mounting a flexible printed circuit board, wherein a solder resist 3 is formed on the surface of the printed circuit board so as to expose the pads 2 and convex portions are formed by insulation print layers 4 around the pads 2.
    Type: Application
    Filed: January 30, 2008
    Publication date: August 21, 2008
    Inventors: YUUJI MINOTA, Yasuhiro Fukutomi, Motonobu Koike